Standard SRAM, 1KX4, 3ns, ECL, CQFP24, CERPACK-24
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Cypress Semiconductor |
| Parts packaging code | QFP |
| package instruction | CERPACK-24 |
| Contacts | 24 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Maximum access time | 3 ns |
| I/O type | SEPARATE |
| JESD-30 code | S-GQFP-F24 |
| JESD-609 code | e0 |
| length | 9.779 mm |
| memory density | 4096 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 4 |
| Negative supply voltage rating | -5.2 V |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 24 |
| word count | 1024 words |
| character code | 1000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C |
| Minimum operating temperature | |
| organize | 1KX4 |
| Output characteristics | OPEN-EMITTER |
| Exportable | NO |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | QFF |
| Encapsulate equivalent code | FL24,.4 |
| Package shape | SQUARE |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | -5.2 V |
| Certification status | Not Qualified |
| Maximum seat height | 2.54 mm |
| Maximum slew rate | 0.275 mA |
| surface mount | YES |
| technology | ECL |
| Temperature level | COMMERCIAL EXTENDED |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 9.779 mm |
| Base Number Matches | 1 |
| CY10E474-3KC | 5962-9151802MZX | CY100E474-3KC | CY100E474-3LC | CY100E474-3YC | CY10E474-3LC | CY10E474-3YC | 5962-9151801MZX | |
|---|---|---|---|---|---|---|---|---|
| Description | Standard SRAM, 1KX4, 3ns, ECL, CQFP24, CERPACK-24 | Standard SRAM, 1KX4, 5ns, ECL, CQFP24, CERPACK-24 | Standard SRAM, 1KX4, 3ns, ECL, CQFP24, CERPACK-24 | Standard SRAM, 1KX4, 3ns, ECL, CQCC24, LCC-24 | Standard SRAM, 1KX4, 3ns, ECL, CQCC28, CERAMIC, JLCC-28 | Standard SRAM, 1KX4, 3ns, ECL, CQCC24, LCC-24 | Standard SRAM, 1KX4, 3ns, ECL, CQCC28, CERAMIC, JLCC-28 | Standard SRAM, 1KX4, 7ns, ECL, CQFP24, CERPACK-24 |
| Parts packaging code | QFP | QFP | QFP | LCC | QLCC | LCC | QLCC | QFP |
| package instruction | CERPACK-24 | QFF, | CERPACK-24 | LCC-24 | CERAMIC, JLCC-28 | LCC-24 | CERAMIC, JLCC-28 | QFF, |
| Contacts | 24 | 24 | 24 | 24 | 28 | 24 | 28 | 24 |
| Reach Compliance Code | not_compliant | unknown | compliant | compliant | compliant | not_compliant | not_compliant | unknown |
| ECCN code | EAR99 | 3A001.A.2.C | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | 3A001.A.2.C |
| Maximum access time | 3 ns | 5 ns | 3 ns | 3 ns | 3 ns | 3 ns | 3 ns | 7 ns |
| JESD-30 code | S-GQFP-F24 | S-GQFP-F24 | S-GQFP-F24 | S-CQCC-N24 | S-CQCC-J28 | S-CQCC-N24 | S-CQCC-J28 | S-GQFP-F24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| length | 9.779 mm | 9.779 mm | 9.779 mm | 10.2235 mm | 11.43 mm | 10.2235 mm | 11.43 mm | 9.779 mm |
| memory density | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Negative supply voltage rating | -5.2 V | -5.2 V | -4.5 V | -4.5 V | -4.5 V | -5.2 V | -5.2 V | -5.2 V |
| Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of terminals | 24 | 24 | 24 | 24 | 28 | 24 | 28 | 24 |
| word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
| character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 75 °C | 125 °C | 85 °C | 85 °C | 85 °C | 75 °C | 75 °C | 125 °C |
| organize | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 | 1KX4 |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | QFF | QFF | QFF | QCCN | QCCJ | QCCN | QCCJ | QFF |
| Package shape | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| Package form | FLATPACK | FLATPACK | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 4.572 mm | 2.54 mm | 4.572 mm | 2.54 mm |
| surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
| technology | ECL | ECL | ECL | ECL | ECL | ECL | ECL | ECL |
| Temperature level | COMMERCIAL EXTENDED | MILITARY | OTHER | OTHER | OTHER | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD |
| Terminal form | FLAT | FLAT | FLAT | NO LEAD | J BEND | NO LEAD | J BEND | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| Terminal location | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| width | 9.779 mm | 9.779 mm | 9.779 mm | 10.2235 mm | 11.43 mm | 10.2235 mm | 11.43 mm | 9.779 mm |
| Is it lead-free? | Contains lead | - | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - |
| Is it Rohs certified? | incompatible | - | incompatible | incompatible | incompatible | incompatible | incompatible | - |
| I/O type | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE | SEPARATE | SEPARATE | - |
| Number of ports | 1 | - | 1 | 1 | 1 | 1 | 1 | - |
| Output characteristics | OPEN-EMITTER | - | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | - |
| Exportable | NO | - | NO | NO | NO | NO | NO | - |
| Encapsulate equivalent code | FL24,.4 | - | FL24,.4 | LCC24,.4SQ | LDCC28,.5SQ | LCC24,.4SQ | LDCC28,.5SQ | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| power supply | -5.2 V | - | -4.5 V | -4.5 V | -4.5 V | -5.2 V | -5.2 V | - |
| Maximum slew rate | 0.275 mA | - | 0.275 mA | 0.275 mA | 0.275 mA | 0.275 mA | 0.275 mA | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | 1 | - |
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