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DPAM-15-09.0-S-8-2

Description
Board Stacking Connector, 104 Contact(s), 8 Row(s), Male, Straight, 0.085 inch Pitch, Surface Mount Terminal, Locking, Black Insulator,
CategoryThe connector    The connector   
File Size491KB,4 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric View All

DPAM-15-09.0-S-8-2 Overview

Board Stacking Connector, 104 Contact(s), 8 Row(s), Male, Straight, 0.085 inch Pitch, Surface Mount Terminal, Locking, Black Insulator,

DPAM-15-09.0-S-8-2 Parametric

Parameter NameAttribute value
MakerSAMTEC
Reach Compliance Codecompliant
subject depth0.262 inch
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD (30)
Contact completed and terminatedMATTE TIN
Contact point genderMALE
Contact materialCOPPER ALLOY
contact modeRECTANGULAR
Contact resistance10.4 mΩ
Contact styleBELLOWED TYPE
DIN complianceNO
Durability100 Cycles
Filter functionNO
IEC complianceNO
Insulator colorBLACK
insulator materialLIQUID CRYSTAL POLYMER (LCP)
JESD-609 codee3
MIL complianceNO
Plug contact pitch0.085 inch
Mixed contactsNO
Installation option 1LOCKING
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number16
Number of rows loaded8
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
OptionsGENERAL PURPOSE
PCB contact patternMIXED
Plating thickness30u inch
Rated current (signal)2.9 A
GuidelineUL
reliabilityCOMMERCIAL
Terminal pitch2.16 mm
Termination typeSURFACE MOUNT
Total number of contacts104
Base Number Matches1
REVISION C
PATENT NUMBERS
6979238 / 7137832
6969286 / 7178232
7159312 / 7172438
7052337 / 7125293
DPAM-23-14.0-S-8-1 SHOWN
(ALL TERMINALS NOT SHOWN FOR CLARITY)
FIG. 1
DPAM-XX-XX.X-X-X-X-XX
No OF POSITIONS
-08, -15, -23
(PER ROW)
LEAD STYLE (SEE NOTE 3)
*
-09.0: 12mm STACK HEIGHT
-11.0: 14mm STACK HEIGHT
-14.0: 17mm STACK HEIGHT
*
-17.0: 20mm STACK HEIGHT
PLATING SPECIFICATION
-S: SELECTIVE .000030 GOLD
IN CONTACT AREA, MATTE
TIN ON SOLDER TAIL
OPTION
-A: ALIGNMENT PIN
(SEE FIG. 2, SHEET 3)
-K: POLYAMIDE FILM
(SEE FIG. 3, SHT 3)
-TR: TAPE & REEL
(LEAVE BLANK FOR TRAY)
SOLDER CRIMP MATERIAL
-1: 63% TIN / 37% LEAD
(USE SUB-T-1M32-XX.X-1)
-2: 96.5% TIN/3% SILVER/0.5% COPPER
(USE SUB-T-1M32-XX.X-2)
ROW
*
-3: 3 DIFFERENTIAL PAIR ROWS
-8: 8 DIFFERENTIAL PAIR ROWS
DO NOT
SCALE FROM
THIS PRINT
.107 2.71
REF
(No OF POS) x .085[2.16] + .171 [4.34] REF
(No OF POS -1) x .085[2.16] (TYP)
.0425 1.080
C2
C3
C1
.085 2.16 (TYP)
(Ground Pin)
G1
G3
"A"
* = NOT TOOLED
"B"
(SEE TABLE 2)
C4
.100 2.54
REF (TYP)
"A" REF
(SEE TABLE 2)
PIN 2 (PAIR 1)
PIN 1 (PAIR 1)
G2
PIN 4 (PAIR 2)
PIN 3 (PAIR 2)
(No OF POS) x .085[2.16] + .097[2.46] REF
"A"
"D"
(SEE TABLE 3)
(SEE NOTE 5)
C5
'C'
.0029 0.07 REF
C11
.006±.003 0.15±0.08
C6
C7
.085 2.16
.043 1.08
C
L
C C
L L
C8
(No OF POS - 1) x .085[2.16] (TYP)
(SEE SHEET 2 FOR BOTTOM VIEW)
'B'
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
DETAIL 'C'
SCALE 4 : 1
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. MINIMUM PUSHOUT FORCE: 1.0 LBS.
3. LEAD STYLE STACK HEIGHTS APPLY WHEN
MATED WITH A -3.0 LEAD STYLE DPAF.
4. PARTS TO BE PACKAGED IN TRAYS IF -TR
OPTION IS NOT SELECTED.
5. TO BE CHECKED ON ALL 4 CORNERS.
6. DIMS TO BE CHECKED AT TIPS.
.006 0.15 REF
.008[0.20]
C10
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2:1
INSULATORS: L.C.P., COLOR: BLACK
TERMINAL: COPPER ALLOY
.085 PITCH ELEVATED DP TERMINAL ASM
DETAIL 'B'
SCALE 4 : 1
.026 0.66
REF (TYP)
F:\DWG\MISC\MKTG\DPAM-XX-XX.X-X-X-X-XX-MKT.SLDDRW
BY:
CHAD F
DPAM-XX-XX.X-X-X-X-XX
01/13/2005
SHEET
1
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