N80960SB10 datasheet, PDF - EEWORLD Datasheet

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N80960SB10: DescriptionIC mpu i960sb 10mhz 84-plcc; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，38 Pages; ManufacturerIntel; Websitehttp://www.intel.com/

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N80960SB10 Overview

IC mpu i960sb 10mhz 84-plcc

N80960SB10 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Intel
Parts packaging code	LCC
package instruction	QCCJ, LDCC84,1.2SQ
Contacts	84
Reach Compliance Code	compliant
Other features	REGISTER SCOREBOARDING; BURST BUS
Address bus width	32
bit size	32
boundary scan	NO
maximum clock frequency	20 MHz
External data bus width	16
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PQCC-J84
JESD-609 code	e0
length	29.3116 mm
low power mode	NO
Number of DMA channels
Number of external interrupt devices	4
Number of serial I/Os
Number of terminals	84
On-chip data RAM width
Maximum operating temperature	85 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC84,1.2SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (number of words)	0
Maximum seat height	4.83 mm
speed	10 MHz
Maximum slew rate	280 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	29.3116 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC
Base Number Matches	1

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80960SB

EMBEDDED 32-BIT MICROPROCESSOR

WITH 16-BIT BURST DATA BUS

■

High-Performance Embedded Architecture

■

Built-in Interrupt Controller

— 16 MIPS* Burst Execution at 16 MHz

— 5 MIPS Sustained Execution at 16 MHz

■

512-Byte On-Chip Instruction Cache

— Direct Mapped

— Parallel Load/Decode for Uncached

Instructions

■

Multiple Register Sets

— Sixteen Global 32-Bit Registers

— Sixteen Local 32-Bit Registers

— Four Local Register Sets Stored

On-Chip

— Register Scoreboarding

■

Pin Compatible with 80960SA

— 4 Direct Interrupt Pins

— 31 Priority Levels, 256 Vectors

■

Built-In Floating Point Unit

— Fully IEEE 754 Compatible

■

Easy to Use, High Bandwidth 16-Bit Bus

— 25.6 Mbytes/s Burst

— Up to 16 Bytes Transferred per Burst

■

32-Bit Address Space, 4 Gigabytes

■

80-Lead Quad Flat Pack (EIAJ QFP)

— 84-Lead Plastic Leaded Chip Carrier

(PLCC)

■

Software Compatible with

80960KA/KB/CA/CF Processors

The 80960SB is a member of Intel’s i960

32-bit processor family, which is designed especially for low cost

embedded applications. It includes a 512-byte instruction cache, an integrated floating-point unit and a built-in

interrupt controller. The 80960SB has a large register set, multiple parallel execution units and a 16-bit burst

bus. Using advanced RISC technology, this high performance processor is capable of execution rates in excess

of 5 million instructions per second

. The 80960SB is well-suited for a wide range of cost sensitive embedded

applications including non-impact printers, network adapters and I/O controllers.

FOUR

80-BIT FP

REGISTERS

80-BIT

FPU

SIXTEEN

32-BIT GLOBAL

REGISTERS

64- BY 32-BIT

LOCAL

CACHE

32-BIT

INSTRUCTION

EXECUTION

UNIT

INSTRUCTION

FETCH UNIT

512-BYTE

INSTRUCTION

CACHE

INSTRUCTION

DECODER

MICRO-

INSTRUCTION

SEQUENCER

MICRO-

INSTRUCTION

ROM

32-BIT

BUS

CONTROL

LOGIC

32-BIT

ADDRESS

16-BIT

BURST

BUS

Figure 1. The 80960SB Processor’s Highly Parallel Architecture

* Relative to Digital Equipment Corporation’s VAX-11/780 at 1 MIPS (VAX-11™ is a trademark of Digital Equipment

Corporation)

Intel Corporation assumes no responsibility for the use of any circuitry other than circuitry embodied in an Intel product. No other circuit patent

licenses are implied. Information contained herein supersedes previously published specifications on these devices from Intel.

August 2004

Order Number: 272207-003

80960SB

EMBEDDED 32-BIT MICROPROCESSOR

WITH 16-BIT BURST DATA BUS

CONTENTS

PAGE

1.0 THE i960

PROCESSOR

...........................................................................................................................1

1.1 Key Performance Features .................................................................................................................2

1.1.1 Memory Space And Addressing Modes ................................................................................... 4

1.1.2 Data Types ...............................................................................................................................4

1.1.3 Large Register Set ...................................................................................................................4

1.1.4 Multiple Register Sets ..............................................................................................................5

1.1.5 Instruction Cache .....................................................................................................................5

1.1.6 Register Scoreboarding ........................................................................................................... 5

1.1.7 Floating-Point Arithmetic .......................................................................................................... 6

1.1.8 High Bandwidth Bus ................................................................................................................6

1.1.9 Interrupt Handling ....................................................................................................................7

1.1.10 Debug Features .....................................................................................................................7

1.1.11 Fault Detection .......................................................................................................................7

1.1.12 Built-in Testability ...................................................................................................................7

1.1.13 CHMOS .................................................................................................................................. 7

2.0 ELECTRICAL SPECIFICATIONS.............................................................................................................

2.1 Power and Grounding ....................................................................................................................... 11

2.2 Power Decoupling Recommendations .............................................................................................. 11

2.3 Connection Recommendations ......................................................................................................... 11

2.4 Characteristic Curves ....................................................................................................................... 11

2.5 Test Load Circuit ............................................................................................................................... 13

2.6 ABSOLUTE MAXIMUM RATINGS* .................................................................................................. 14

2.7 DC Characteristics ............................................................................................................................ 14

2.8 AC Specifications .............................................................................................................................. 15

3.0 MECHANICAL DATA

............................................................................................................................... 20

3.1 Packaging ......................................................................................................................................... 20

3.2 Pin Assignment ................................................................................................................................. 20

3.3 Pinout ................................................................................................................................................ 22

3.4 Package Thermal Specifications ...................................................................................................... 26

4.0 WAVEFORMS

........................................................................................................................................... 27

5.0 REVISION HISTORY

................................................................................................................................ 33

LIST OF FIGURES

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Figure 16

Figure 17

Figure 18

Figure 19

Figure 20

Figure 21

Figure 22

PAGE

The 80960SB Processor’s Highly Parallel Architecture ................................................................ 0

80960SB Programming Environment ........................................................................................... 1

Instruction Formats ...................................................................................................................... 4

Multiple Register Sets Are Stored On-Chip .................................................................................. 6

Connection Recommendation for LOCK .................................................................................... 11

Typical Supply Current vs. Case Temperature ........................................................................... 12

Typical Current vs. Frequency (Room Temp) ............................................................................. 12

Typical Current vs. Frequency (Hot Temp) ................................................................................. 13

Capacitive Derating Curve ......................................................................................................... 13

Test Load Circuit for Three-State Output Pins ............................................................................ 13

Drive Levels and Timing Relationships for 80960SB Signals ..................................................... 15

Processor Clock Pulse (CLK2) ................................................................................................... 18

RESET Signal Timing ................................................................................................................. 18

HOLD Timing .............................................................................................................................. 19

80-Lead EIAJ Quad Flat Pack (QFP) Package .......................................................................... 20

84-Lead Plastic Leaded Chip Carrier (PLCC) Package ............................................................. 21

Non-Burst Read and Write Transactions Without Wait States .................................................... 27

Quad Word Burst Read Transaction With 1, 0, 0, 0, 0, 0, 0, 0 Wait States ................................ 28

Burst Write Transaction With 2, 1, 1, 1 Wait States (6-8 Bytes Transferred) .............................. 29

Accesses Generated by Quad Word Read Bus Request,

Misaligned One Byte from Quad Word Boundary 1, 0, 0, 0, 0, 0, 0, 0 Wait States

Interrupt Acknowledge Cycle ...................................................................................................... 31

Cold Reset Waveform ................................................................................................................ 32

LIST OF TABLES

Table 1

Table 2

Table 3

Table 4

Table 5

Table 6

Table 7

Table 8

Table 9

Table 10

Table 11

Table 12

Table 13

Table 14

80960SB Instruction Set .............................................................................................................. 3

Memory Addressing Modes ......................................................................................................... 4

Sample Floating-Point Execution Times (µs) at 16 MHz .............................................................. 6

80960SB Pin Description: Bus Signals ........................................................................................ 8

80960SB Pin Description: Support Signals ................................................................................ 10

DC Characteristics ..................................................................................................................... 14

80960SB AC Characteristics (10 MHz) ...................................................................................... 16

80960SB AC Characteristics (16 MHz) ...................................................................................... 17

80960SB QFP Pinout — In Pin Order ........................................................................................ 22

80960SB QFP Pinout — In Signal Order ................................................................................... 23

80960SB PLCC Pinout — In Pin Order ...................................................................................... 24

80960SB PLCC Pinout — In Signal Order ................................................................................. 25

80960SB QFP Package Thermal Characteristics ...................................................................... 26

80960SB PLCC Package Thermal Characteristics .................................................................... 26

iii

N80960SB10 Related Products

	N80960SB10	N80960SB16	EE80960SB10512	EN80960SB16512	TN80960SB16
Description	IC mpu i960sb 10mhz 84-plcc	IC mpu i960sb 16mhz 84-plcc	IC mpu i960sb 10mhz 84-plcc	IC mpu i960sb 16mhz 84-plcc	IC mpu i960sb 16mhz 84-plcc
Is it Rohs certified?	incompatible	incompatible	-	-	incompatible
Maker	Intel	Intel	-	-	Intel
package instruction	QCCJ, LDCC84,1.2SQ	QCCJ, LDCC84,1.2SQ	-	-	QCCJ, LDCC84,1.2SQ
Reach Compliance Code	compliant	compliant	-	-	unknown
bit size	32	32	-	-	32
JESD-30 code	S-PQCC-J84	S-PQCC-J84	-	-	S-PQCC-J84
JESD-609 code	e0	e0	-	-	e0
Number of terminals	84	84	-	-	84
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-	PLASTIC/EPOXY
encapsulated code	QCCJ	QCCJ	-	-	QCCJ
Encapsulate equivalent code	LDCC84,1.2SQ	LDCC84,1.2SQ	-	-	LDCC84,1.2SQ
Package shape	SQUARE	SQUARE	-	-	SQUARE
Package form	CHIP CARRIER	CHIP CARRIER	-	-	CHIP CARRIER
power supply	5 V	5 V	-	-	5 V
Certification status	Not Qualified	Not Qualified	-	-	Not Qualified
speed	10 MHz	16 MHz	-	-	16 MHz
Maximum slew rate	280 mA	350 mA	-	-	350 mA
Nominal supply voltage	5 V	5 V	-	-	5 V
surface mount	YES	YES	-	-	YES
technology	CMOS	CMOS	-	-	CMOS
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)
Terminal form	J BEND	J BEND	-	-	J BEND
Terminal pitch	1.27 mm	1.27 mm	-	-	1.27 mm
Terminal location	QUAD	QUAD	-	-	QUAD
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	-	-	MICROPROCESSOR, RISC
Base Number Matches	1	1	-	-	1

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