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N74F133N,602

Description
IC gate nand 1ch 13-inp 16-dip
Categorylogic    logic   
File Size80KB,8 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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N74F133N,602 Overview

IC gate nand 1ch 13-inp 16-dip

N74F133N,602 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeDIP
package instructionDIP, DIP16,.3
Contacts16
Manufacturer packaging codeSOT38-4
Reach Compliance Codeunknown
seriesF/FAST
JESD-30 codeR-PDIP-T16
JESD-609 codee4
length19.025 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeNAND GATE
MaximumI(ol)0.02 A
Number of functions1
Number of entries13
Number of terminals16
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP16,.3
Package shapeRECTANGULAR
Package formIN-LINE
Peak Reflow Temperature (Celsius)260
power supply5 V
Maximum supply current (ICC)4 mA
Prop。Delay @ Nom-Sup8 ns
propagation delay (tpd)8 ns
Certification statusNot Qualified
Schmitt triggerNO
Maximum seat height4.2 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyTTL
Temperature levelCOMMERCIAL
Terminal surfaceNICKEL PALLADIUM GOLD
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width7.62 mm
INTEGRATED CIRCUITS
74F133
13-input NAND gate
Product specification
Supersedes data of 1989 Oct 16
IC15 Data Handbook
1993 Jul 02
Philips
Semiconductors

N74F133N,602 Related Products

N74F133N,602 I74F133N,112 I74F133D,112 N74F133D,623
Description IC gate nand 1ch 13-inp 16-dip IC gate nand 1ch 13-inp 16-dip IC gate nand 1ch 13-inp 16-SO IC gate nand 1ch 13-inp 16-SO
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to
Parts packaging code DIP DIP SOP SOP
package instruction DIP, DIP16,.3 DIP, DIP16,.3 SOP, SOP16,.25 SOP, SOP16,.25
Contacts 16 16 16 16
Manufacturer packaging code SOT38-4 SOT38-4 SOT109-1 SOT109-1
Reach Compliance Code unknown unknown unknown unknown
series F/FAST F/FAST F/FAST -
JESD-30 code R-PDIP-T16 R-PDIP-T16 R-PDSO-G16 -
JESD-609 code e4 e4 e4 -
length 19.025 mm 19.025 mm 9.9 mm -
Logic integrated circuit type NAND GATE NAND GATE NAND GATE -
MaximumI(ol) 0.02 A 0.02 A 0.02 A -
Number of functions 1 1 1 -
Number of entries 13 13 13 -
Number of terminals 16 16 16 -
Maximum operating temperature 70 °C 85 °C 85 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code DIP DIP SOP -
Encapsulate equivalent code DIP16,.3 DIP16,.3 SOP16,.25 -
Package shape RECTANGULAR RECTANGULAR RECTANGULAR -
Package form IN-LINE IN-LINE SMALL OUTLINE -
Peak Reflow Temperature (Celsius) 260 260 260 -
power supply 5 V 5 V 5 V -
Maximum supply current (ICC) 4 mA 4 mA 4 mA -
Prop。Delay @ Nom-Sup 8 ns 8 ns 8 ns -
propagation delay (tpd) 8 ns 8 ns 8 ns -
Certification status Not Qualified Not Qualified Not Qualified -
Schmitt trigger NO NO NO -
Maximum seat height 4.2 mm 4.2 mm 1.75 mm -
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V -
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V -
Nominal supply voltage (Vsup) 5 V 5 V 5 V -
surface mount NO NO YES -
technology TTL TTL TTL -
Temperature level COMMERCIAL INDUSTRIAL INDUSTRIAL -
Terminal surface NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD NICKEL PALLADIUM GOLD -
Terminal form THROUGH-HOLE THROUGH-HOLE GULL WING -
Terminal pitch 2.54 mm 2.54 mm 1.27 mm -
Terminal location DUAL DUAL DUAL -
Maximum time at peak reflow temperature 30 30 30 -
width 7.62 mm 7.62 mm 3.9 mm -
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