MEMORY MODULE
NOR FLASH 256Mx16-BGA
Flash Memory
MODULE
3DFO4G16VB2408
4Gbit Nor Flash organized as 258Mx16, based on 128Mx16
Pin Assignment (Top View)
BGA 64
Features
- Single supply for read/program/erase (2.7V to 3.6V)
- V
IO
= V
CC
= 2.7 to 3.6V
- x16 data bus
- 16-word/32-byte page read buffer
- 512-byte programming buffer
- Uniform 128-Kbytes sector architecture
- Suspend and Resume commands for Program and Erase
Operations
- Separate 1024-byte OTP array
- Protection methods for each sector
- Highest address sector protected
- WP#/ACC input for accelerated programming time
- Maximum read access times
Random Access Time: 110 ns
Page Access Time: 20 ns
CE# Access Time: 110 ns
OE# Access Time: 25 ns
- 100,000 erase cycles per sector typical
- 20-year data retention typical
- Available Temperature Range:
0°C to 70°C
-40°C to +85°C
-55°C to +125°C
Block Diagram
CE#
CE2#
1
2
128Mx16
All other signals are common to all memories
General Description
The 3DFO4G16VB2408 is a 3.0V single power 4Gbit Flash memory. The device has a 16-bit wide data bus and offers a fast
page access time of 25ns.
It is organized in
2 banks with separate chip enable
(CE#) controls. It requires only a
single 3.0 volt power supply
for both
read and write functions.
In addition to VCC input, a high-voltage
accelerated program
(WP#/ACC) input provides accelerated programming time and
protects first or last sector regardless of sector protection settings. The
Ready/Busy
(RY/BY#) is a dedicated open drain output
pin that detects program or erase cycle completion. The
V
IO
pin
allows the host system to set the voltage levels that the device
generates and tolerates on all inputs and outputs.
Hardware data protection measures include a low V
CC
detector that automatically inhibits write operations during power
transitions. Persistent Sector Protection provides in-system, command-enable protection of any combination of sectors.
Password Sector Protection prevents unauthorized write and erase operations in any combination of sectors through a user-
defined 64-bit password.
This makes the device an ideal product for embedded applications that require higher density, better performance and lower
power consumption.
FLASH Memory Module
3D Plus SA reserves the right to cancel product or specifications without notice
3DFP-0408-REV 1 - November 2011
MEMORY MODULE
NOR FLASH 256Mx16-BGA
Flash Memory
MODULE
Mechanical Drawing
3DFO4G16VB2408
4Gbit Nor Flash organized as 258Mx16, based on 128Mx16
Dimensions (mm)
3,9
3,5
13,7
11,7
7,00
7,00
0,60
1,00
1,00
0,50
Note
Height
Body thickness
Body size
Body size
Matrix footprint
Matrix footprint
Ball diameter
Ball pitch
Ball pitch
Solder ball placement
E
A
A2
D
E
D1
E1
b
eD
eE
SD/SE
D
OPERATING RANGES
Parameter
Vcc supply voltages
Vio supply voltage
Com. Temp. Range
Ind. Temp. Range
Mil. Temp. Range
ABSOLUTE MAXIMUM RATINGS PER DEVICE
Min
+2,7
+2,7
0
-40
-55
Symbol
V
cc
V
io
C
I
M
Max
+3,6
+3,6
70
+85
+125
Unit
V
V
°C
°C
°C
Parameter
Voltage with respect to ground
Storage temperature
Short circuit output current I/Os
Symbol
V
io
, V
cc
A9 and ACC
Min
-0,5
-0,5
-65
-
Max
+4,0
+12,5
+150
200
Unit
V
V
°C
mA
T
STG
DC CHARACTERISTICS
Parameter
Active Read Current @ f=5Mhz
Standby current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output High Voltage
Symbol
Icc1
Icc4
V
IL
V
IH
V
OL
V
OH
Min
-0,5
0,7xVio
-
0,85xVio
Typ
55
280
-
-
-
-
Max
60
400
0,3xVio
Vio+0,4
0,15xVio
-
Unit
mA
µA
V
V
V
V
Module Marking
3DFO4G16VB2408
Temperature Range
C
= 0°C ~ +70°C
I
= -40°C ~ +85°C
M
= -55°C ~ +125°C
-X
Part Number Marking
3D Plus Logo
Date Code
Date Code
YYWW
(WWYY)
Part Option Marking
MMXX00000000XXX
-XX
0000
0000
Pin 1 Indicator
Serial Number
(Optional)
Main Sales Office
FRANCE
3D PLUS
408, rue Hélène Boucher ZI.
78532 BUC Cedex
3D PLUS USA, Inc
6633 Eldorado Parkway
Suite 420
Mckinney, TX 75070
Tel : 33 (0)1 30 83 26 50
Fax : 33 (0)1 39 56 25 89
Web :
www.3d-plus.com
e-mail :
sales@3d-plus.com
DISTRIBUTOR
USA
Tel : (214) 733-8505
Fax : (214) 733-8506
e-mail :
sales@3d-plus.com
FLASH Memory Module
3D Plus SA reserves the right to cancel product or specifications without notice
3DFP-0408-REV 1 - November 2011
Embedded System
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EEWORLD
