|
IRFV360PBF |
IRFV360DPBF |
IRFV360 |
IRFV360UPBF |
| Description |
Power Field-Effect Transistor, 25A I(D), 400V, 0.2ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-258AA |
Power Field-Effect Transistor, 25A I(D), 400V, 0.23ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-258AA |
repetitive avalanche rated and dv/dt rated hexfet transistor |
Power Field-Effect Transistor, 25A I(D), 400V, 0.23ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-258AA |
| Is it lead-free? |
Lead free |
Lead free |
Contains lead |
Lead free |
| Maker |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
International Rectifier ( Infineon ) |
| package instruction |
FLANGE MOUNT, R-XSFM-P3 |
FLANGE MOUNT, R-XSFM-P3 |
FLANGE MOUNT, R-XSFM-P3 |
FLANGE MOUNT, R-XSFM-P3 |
| Reach Compliance Code |
compliant |
compliant |
unknown |
compliant |
| Avalanche Energy Efficiency Rating (Eas) |
980 mJ |
980 mJ |
980 mJ |
980 mJ |
| Shell connection |
ISOLATED |
ISOLATED |
ISOLATED |
ISOLATED |
| Configuration |
SINGLE |
SINGLE WITH BUILT-IN DIODE |
SINGLE |
SINGLE WITH BUILT-IN DIODE |
| Minimum drain-source breakdown voltage |
400 V |
400 V |
400 V |
400 V |
| Maximum drain current (ID) |
25 A |
25 A |
25 A |
25 A |
| Maximum drain-source on-resistance |
0.2 Ω |
0.23 Ω |
0.2 Ω |
0.23 Ω |
| FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
| JEDEC-95 code |
TO-258AA |
TO-258AA |
TO-258AA |
TO-258AA |
| JESD-30 code |
R-XSFM-P3 |
R-XSFM-P3 |
R-XSFM-P3 |
R-XSFM-P3 |
| Number of components |
1 |
1 |
1 |
1 |
| Number of terminals |
3 |
3 |
3 |
3 |
| Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
| Maximum operating temperature |
150 °C |
150 °C |
150 °C |
150 °C |
| Package body material |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
UNSPECIFIED |
| Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
| Package form |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
FLANGE MOUNT |
| Peak Reflow Temperature (Celsius) |
260 |
260 |
NOT SPECIFIED |
260 |
| Polarity/channel type |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
N-CHANNEL |
| Maximum pulsed drain current (IDM) |
100 A |
100 A |
100 A |
100 A |
| Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
| surface mount |
NO |
NO |
NO |
NO |
| Terminal form |
PIN/PEG |
PIN/PEG |
PIN/PEG |
PIN/PEG |
| Terminal location |
SINGLE |
SINGLE |
SINGLE |
SINGLE |
| Maximum time at peak reflow temperature |
40 |
40 |
NOT SPECIFIED |
40 |
| transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
| Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
| Base Number Matches |
1 |
1 |
1 |
1 |
| Is it Rohs certified? |
conform to |
conform to |
- |
conform to |
| Maximum power consumption environment |
300 W |
300 W |
- |
300 W |
| Maximum off time (toff) |
219 ns |
219 ns |
- |
219 ns |
| Maximum opening time (tons) |
173 ns |
173 ns |
- |
173 ns |