datasheet
EEWORLDEEWORLDEEWORLD
Datasheet
Part Number

Keyword

Search
Keyword

Part Number

Search
Datasheet> All Categories > CHP0502L2052FNT
PDF
Preview

CHP0502L2052FNT

Description
RESISTOR, METAL GLAZE/THICK FILM, 0.05 W, 1 %, 200 ppm, 20500 ohm, SURFACE MOUNT, 0502, CHIP, ROHS COMPLIANT
File Size156KB，9 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance  
Download Datasheet Parametric View All

CHP0502L2052FNT Overview

RESISTOR, METAL GLAZE/THICK FILM, 0.05 W, 1 %, 200 ppm, 20500 ohm, SURFACE MOUNT, 0502, CHIP, ROHS COMPLIANT

CHP0502L2052FNT Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1620122275
package instructionSMT, 0502
Reach Compliance Codecompliant
Country Of OriginFrance
ECCN codeEAR99
YTEOL6.66
structureRectangular
JESD-609 codee2
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.38 mm
Package length1.22 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.7 mm
method of packingTR, PLASTIC
Rated power dissipation(P)0.05 W
Rated temperature70 °C
resistance20500 Ω
Resistor typeFIXED RESISTOR
size code0502
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient200 ppm/°C
Terminal surfaceTin/Silver (Sn/Ag) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage50 V

CHP0502L2052FNT Preview

CHP, HCHP
www.vishay.com
Vishay Sfernice
High Stability Resistor Chips
(< 0.25 % at Pn at 70 °C during 1000 h) Thick Film Technology
FEATURES
• CHP: standard passivated version for
industrial, professional and military applications
Available
• Robust terminations
• Large ohmic value range 0.1
to 100 M
• Tight tolerance to 0.5 %
• HCHP: for high frequency applications
• ESCC approved see CHPHR
Available
DESIGN SUPPORT TOOLS
Models
Available
click logo to get started
• High temperature (245 °C) see CHPHT
• SMD wraparound chip resistor
• Halogen-free according to IEC 61249-2-21 definition
• Withstand moisture resistance test of AEC-Q200
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Vishay Sfernice thick film resistor chips are specially
designed to meet very stringent specifications in terms
of reliability, stability < 0.25 % at Pn at +70 °C during
1000 h, homogeneity, reproducibility and quality.
They conform to specifications NFC 83-240 and
MIL-R-55342 D.
Evaluated to ESCC 4001/026 (see CHPHR datasheet).
Sputtered Thin Film terminations, with nickel barrier, are
very convenient for high operating conditions. They can
withstand thousands of very severe thermal shocks.
B (W/A), N (W/A), and F (one face) types are for solder reflow
assembly.
G (W/A) and W (one face) types are for wire bonding, gluing
and even high temperature solder reflow.
STANDARD ELECTRICAL SPECIFICATIONS
MODEL
SIZE
RATED
POWER
Pn
W
LIMITING
ELEMENT
VOLTAGE
V
MAX. OVERLOAD RESISTANCE
TEMPERATURE UNIT
TOLERANCE
VOLTAGE
RANGE
(1)
COEFFICIENT WEIGHT
±%
V
± ppm/°C
mg
1
3
2
4
5
8
8
26
25
21
42
12
CHP0502
0.050
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0502 0502
CHP0505
0505
0.125
50
100
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP0505
CHP0603
0603
0.125
50
100
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0603
CHP0805
(2)
0.200
150
300
0.1 to 25M
0.5, 1, 2, 5
100, 200
HCHP0805 0805
CHP1005
1005
0.250
150
300
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1005
CHP1206
1206
0.250
200
400
0.1 to 50M
0.5, 1, 2, 5
100, 200
HCHP1206
CHP1505
0.500
200
400
0.1 to 75M
0.5, 1, 2, 5
100, 200
HCHP1505 1505
CHP2010
2010
1.000
(3)
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2010
CHP1020
1020
1.000
(3)
200
400
0.1 to 10M
0.5, 1, 2, 5
100, 200
HCHP1020
CHP2208
0.750
200
400
0.1 to 100M
0.5, 1, 2, 5
100, 200
HCHP2208 2208
CHP2512
2512
2.000
(3)
250
500
0.1 to 100M
0.5, 1, 2, 5
100, 200
CHP2512
CHP1010
1010
0.500
200
400
0.1 to 25M
0.5, 1, 2, 5
100, 200
CHP1010
Notes
(1)
Shall be read in conjunction with other tables
(2)
Model CHP0805 being same size than case 0705 with same performances, only codification of CHP0805 remains
(3)
With special assembly care
Revision: 24-Jan-18
Document Number: 52023
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
DIMENSIONS
in millimeters
(F) and (W)
(B), (G), and (N)
D
C
D
C
B
B
E
A
E
A
CASE
SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
A
± 0.152
1.22
1.22
1.60
1.85
2.49
2.49
2.49
3.00
3.70
5.03
5.53
6.30
B
± 0.127
0.70
1.25
0.90
1.25
1.25
2.64
5.18
1.73
1.25
2.64
2.05
3.30
C
± 0.127
0.38
0.38
0.38
0.38
0.38
0.38
0.50
0.38
0.50
0.50
0.50
0.50
D
± 0.127
0.20
0.20
0.31
0.31
0.31
0.31
0.31
0.40
0.50
0.50
0.50
0.50
E
± 0.127
0.31
0.31
0.40
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
0.50
SUGGESTED LAND PATTERN
(to IPC-7351A) in millimeters
G
min.
X
max.
Z
max.
CASE SIZE
0502
0505
0603
0805
1005
1010
1020
1206
1505
2010
2208
2512
Z
max.
1.77
1.77
2.15
2.70
3.34
3.34
3.34
3.85
4.55
5.88
6.38
7.15
G
min.
0.19
0.19
0.39
0.44
1.08
1.08
1.08
1.59
2.29
3.62
4.12
4.89
X
max.
0.83
1.38
1.03
1.38
1.38
2.77
5.31
1.85
1.38
2.77
2.18
3.43
Revision: 24-Jan-18
Document Number: 52023
2
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
POWER DERATING CURVE
Rated Power (%)
100
80
60
40
20
0
Vishay Sfernice
MECHANICAL SPECIFICATIONS
Substrate
Technology
Protection
Alumina
Thick film (ruthenium oxide)
0.5
<
R
< 100 M: epoxy coating
R
0.5
:
overglaze protection
(no epoxy coating)
B (W/A):
SnPb over nickel barrier
for solder reflow
N (W/A):
SnAg over nickel barrier
for solder reflow
F (Flip Chip):
SnAg over nickel barrier
for solder reflow
W (one face) and G (W/A) type:
gold over nickel barrier
for other applications
Terminations
0
20
40
60 70 80
100
120
140 155
Ambient Temperature in °C
PACKAGING
ESD packaging available: Waffle pack and plastic tape and
reel (low conductivity). Paper tapes available on request
(ESD only).
NUMBER OF PIECES PER
WAFFLE
TAPE AND
PACK
MIN. MAX.
400
4000
100
221
140
60
100
60
60
50
5000
8 mm
4000
100
2000
2500
4000
1000
2000
8 mm
8 mm
8 mm
8 mm
8 mm
Note
• Refer to Application Note “Guidelines for Vishay
Sfernice
Resistive
and
Inductive
Components”
(www.vishay.com/doc?52029) for recommended reflow profile.
Profile #3 applies
SIZE
MOQ
TAPE
WIDTH
CLIMATIC SPECIFICATIONS
Operating temperature
range
-55 °C; +155 °C
0502
0505
0603
0805
1005
1206
1505
2010
1010
2208
1020
2512
Note
• For temperature up to 215 °C please consult Vishay Sfernice
BEST TOL. AND TCR VS. OHMIC VALUE
OHMIC VALUE
RANGE in
10
<
R
< 5M
5
<
R
< 10M
1
<
R
<
R
max.
0.1
<
R
<
R
max.
TIGHTEST
TOLERANCE
(%)
0.5 % (D)
1 % (F)
2 % (G)
5 % (J)
(1)
100
BEST
TCR
(ppm/°C)
100 (K)
100 (K)
200 (L)
200 (L)
PACKAGING RULES
Waffle Pack
Can be filled up to maximum quantity indicated in the table
here above, taking into account the minimum order quantity.
When quantity ordered exceeds maximum quantity of a
single waffle pack, the waffle packs are stacked up on the
top of each other and closed by one single cover.
To get “not stacked up” waffle pack in case of ordered
quantity > maximum number of pieces per package:
Please consult Vishay Sfernice for specific ordering
code
Tape and Reel
See Part Numbering information to get the quantity desired
by tape.
Note
(1)
Improved performance on request
CHIPS FOR HIGH FREQUENCY APPLICATIONS
The HF performance of flip chip and W/A types can be
improved on request.
Please ask for HCHP
Revision: 24-Jan-18
Document Number: 52023
3
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
TYPICAL HF PERFORMANCE OF HCHP
2.0
1.8
1.6
1.4
1.2
2.0
1
Ω
10
Ω
1.8
1.6
1.4
1.2
1
Ω
10
Ω
Vishay Sfernice
|Z|/R
|Z|/R
1.0
0.8
0.6
0.4
0.2
0
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
100
Ω
200
Ω
1.0
0.8
0.6
100
Ω
1 kΩ
200
Ω
1 kΩ
0.4
0.2
0
10 000
1
10
100
1000
1 MΩ
100 kΩ
10 kΩ
10 000
Size 0603 (W/A)
f (MHz)
Size 0603 (Flip chip)
f (MHz)
POPULAR OPTIONS
For any option it is recommended to consult Vishay Sfernice for availability first.
Option: Enlarged terminations:
0063
For stringent and special power dissipation requirements, the thermal resistance between the resistive layer and the solder joint
can be reduced using enlarged terminations chip resistors which are soldered on large and thick copper pads acting as heat
sinks (see application note: 53048 Power Dissipation in High Precision Vishay Sfernice Chip Resistors and Arrays (P Thin Film,
PRA Arrays, CHP Thick Film)
www.vishay.com/doc?53048.
Option to order: 0063 (applies to size 1206 / 1505 / 1020 / 2010 / 2512).
DIMENSIONS
(Option 0063) in millimeters
Bottom view for mounting
Uncoated
ceramic
Enlarged
termination
C
E
B
D
A
CASE
SIZE
1206
1505
2010
1020
2208
2512
A
± 0.152
3.00
3.70
5.03
2.49
5.53
6.30
B
± 0.127
1.73
1.25
2.64
5.18
2.05
3.30
C
± 0.127
0.38
0.50
0.50
0.50
0.50
0.50
D
± 0.127
0.40
0.50
0.50
0.31
0.50
0.50
E
± 0.127
1.19
1.54
2.20
0.93
2.45
2.84
Revision: 24-Jan-18
Document Number: 52023
4
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
CHP, HCHP
www.vishay.com
Vishay Sfernice
SUGGESTED LAND PATTERN
(Option 0063)
G
min.
X
max.
Z
max.
CASE SIZE
1206
1505
2010
1020
2208
2512
DIMENSIONS (IN MILLIMETERS)
Z
max.
3.85
4.55
5.88
3.34
6.38
7.15
G
min.
0.50
0.50
0.50
0.50
0.50
0.50
X
max.
1.86
1.38
2.77
5.31
2.18
3.43
OPTION: MARKING
Option to order 0013:
Marking of ohmic value and tolerance:
Sizes: 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes: 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
Tolerance indicated by a color dot.
Option to order 0014:
Marking of ohmic value:
Sizes 0805 to 1005: 3 digits marking (according to EIA-96)
Sizes 1206 to 2010: 4 digits marking (same codification than in the ordering procedure)
No standard marking available for smaller sizes.
A price adder will apply to the unit price of the parts for options 0013 and 0014.
PERFORMANCE
TESTS
Termination adhesion
Resistance to solder heat
CONDITIONS
5N for 10 s
Immersion 10 s
in Sn/Pb 60/40
at +260 °C
5 cycles
-55 °C
+155 °C
Phase A dry heat
Phase B damp heat
Phase C cold -55 °C
Phase D damp heat 5 cycles
56 days
AEC-Q200
85 °C / 85 % RH / Pn / 10
1000 h
6.25 Pr
for 2 s
1000 h at rated power
90’/30’ at +70 °C
REQUIREMENTS
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
± (0.25 % + 0.05
)
TYPICAL VALUES
AND DRIFTS
< ± 0.1 %
< ± 0.1 %
Rapid temperature change
< ± 0.1 %
Climatic sequence
Humidity (steady state)
Moisture resistance
Short time overload
Load life
± (1 % + 0.05
)
± (1 % + 0.05
)
5 % + 0.05
± (0.25 % + 0.05
)
1000 h
± (1 % + 0.05
)
1000 h
< 0.25 %
< ± 0.2 %
< ± 0.2 %
Max. < 3 % + 0.05
< ± 0.1 %
2000 h
< 0.5 %
10 000 h
<1%
Revision: 24-Jan-18
Document Number: 52023
5
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
More (Only the first 5 pages are displayed. Please Download Datasheet to view the full content.) >

Recommended Resources

Universal RF detector

High-precision low-noise filter circuit design

Interface circuit between ICL7109 and microcontroller

Hot wire respiratory flow meter amplification circuit

300kHz600WZVT--PWM boost converter

Computer motherboard circuit diagram 820 2_23

How to truly become an embedded elite
How can we quickly become an embedded programmer? Actually, there is no shortcut to engineering. Let's listen to what a great programmer wrote below! Let's talk about hardware first: Read your digital...
呱呱 Embedded System
There is still a Wi-Fi wireless network connection icon on the taskbar, but there is no wireless connection icon in the "Network and Dial-up Connections" window. How can I add it?
There is still a Wi-Fi wireless network connection icon on the taskbar, but there is no wireless connection icon in the "Network and Dial-up Connections" window. How can I add it?...
lichangjd Embedded System
Taking CE as an example, we will develop an encryption card with SD interface. Please help us complete it together (Part 1)
I am now completing a project - secure storage of mobile phones. To solve the pornographic photo scandal that may occur on mobile phones. I have no relevant experience, please give me some advice. I w...
iamfuchengzxh Embedded System
5418a Parallel communication transfers 16 floating point numbers. There is a problem with timing. Please give me some advice.
Dual-computer communication, passing floating point numbers, using parallel port. The host determines the rising edge of P2.7 and reads data as follows: float TXD_float(void) {char tt[4];uchar i;//whi...
shzps Microcontroller MCU
Urgent! ! High score solution: How to package the driver into an MSI file in Plaform Builder 6.0?
The platform->Export Wizard... option provided by PB5.0 is no longer available. I have now packaged the Driver DLL into MSI through the Setup Wizard provided by VS2005. However, the problem is that I ...
zhaonash Embedded System
11.07 Another busy day begins:
15.07 Another busy day begins;...
hchen Talking
Shortcut:   A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components

  1. PCA9541AD-03118
  2. DW-19-09-L-D-300
  3. CTF8-WA1B4C150-200.000KD6
  4. 2200HG1F502F3FB
  5. PT00E10-98SZJ023
  6. GRM1555C1H471JA01W
  7. 821-A064P-AMA00
  8. 4306S-106-2200DBAL
  9. BZQ55-C6V2AT/R13
  10. GDZJ4.3C-34
  11. SGM8651XS
  12. A7921WVA-5P-S-32-C

Popular Articles

  1. Problems in Field Testing of Contact Loop Resistance Tester
  2. Infineon's new factory goes into production, requiring only 10 workers to operate?
  3. Honor foldable phone to be released at the end of the year: BOE and Visionox may supply screens
  4. Wuling strikes again! Self-developed chip debuts in public for the first time
  5. Microchip releases high-precision voltage reference IC for automotive applications with extremely low drift
  6. ASUS Zenfone 9 screenshots leaked: equipped with a small rear screen and supports double-click back cover function
  7. Infineon Technologies expands wireless product portfolio
  8. Qualcomm Launches Snapdragon Ride™ Vision System, Built on 4nm Process SoC
  9. Talk about the working principle of single-phase capacitor motor
  10. How MCUs can unlock the full potential of electrified designs

Technical ResourceMore

  1. UM0412 DFUSE USB device firmware upgrade function extension document
  2. Relay comprehensive parameter detection principle
  3. Anti-interference technology in control engineering
  4. Altium Designer 6 schematic component library collection
  5. IRFR_U3910 pdf
  6. Telephone Remote Control System Designed by FPGA
  7. Linux open source operating system
  8. CYCLONE 3C120 circuit diagram
  9. Haier circuit diagram
  10. Design of C-band Ceramic Resonant Oscillator

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Index Files: 1332  869  696  2050  2627  27  18  14  42  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号