EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342K03B768ES-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.2W, 768000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1005, CHIP
CategoryPassive components    The resistor   
File Size995KB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

M55342K03B768ES-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.2W, 768000ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1005, CHIP

M55342K03B768ES-W Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid1873951480
package instructionSMT, 1005
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL5.55
Other featuresPRECISION
structureRectangular
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length2.62 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.22 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.2 W
Rated temperature70 °C
GuidelineMIL-PRF-55342/03
resistance768000 Ω
Resistor typeFIXED RESISTOR
size code1005
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn60Pb40) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage75 V
State of the Art, Inc.
Precision Thin Film Chip Resistor
MIL-PRF-55342/03 Solderable RM1005
5.6Ω to 1.5 MΩ
0.1, 0.25, 0.5, 1, 2, 5, 10
25, 50, 100
200 mW
75 V
-65 to 150°C
M, P, R, S, U, V, T
Noise
c
d
a
b
e
Performance
Resistance Range*
Tolerances (± %)*
TCR (± ppm/°C)*
Power Rating
Voltage Rating
Operating Range
Product Levels
0
Noise (dB)
-10
-20
-30
-40
125
100
75
50
25
0
0
0.5
ceramic board
1.0 1.5 2.0
Power (W)
2.5
Power Dissipation
fiber epoxy board
*see QPL55342 for part number availability
1
1k
1M
Resistance Value (Ω)
Maximum Allowable Drift
Temperature Characteristic
TCR (ppm/°C)
Thermal Shock
Power Conditioning
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Moisture Resistance
Life (Qualification)
Life (FR Level)
Resistance to Soldering Heat
Resistance to Bonding Exposure
E
±25
±0.1%
±0.2%
±0.1%
±0.1%
±0.1%
±0.2%
±0.5%
±2.0%
±0.2%
±0.2%
H
±50
±0.25%
±0.25%
±0.25%
±0.1%
±0.2%
±0.4%
±0.5%
±2.0%
±0.25%
±0.25%
K
±100
±0.5%
±0.5%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±2.0%
±0.25%
±0.25%
0.5
Drift (|%∆R|)
0.4
0.3
0.2
0.1
0
0
2k
Life Test
Percent Power
100
75
50
25
0
Temperature Rise (°C)
Power Derating
4k 6k
Hours
8k
10k
-10
70
150
Ambient Temperature (°C)
Part Number
M55342E03B100AS -TR
Packaging: -TR: Tape & Reel
Product Level (/1000 hrs.): M: 1%
Resistance Value and Tolerance:
Three numerals and a letter indicating
decimal, value range, and tolerance
-W: Waffle Tray
P: 0.1%
R & U: 0.01%
S & V: 0.001%
T: Space 0.001%
Ω: A: 0.1% R: 0.25% W: 0.5% D: 1% G: 2% J: 5% M: 10%
kΩ: B: 0.1% U: 0.25% Y: 0.5% E: 1% H: 2% K: 5% N: 10%
MΩ: C: 0.1% V: 0.25% Z: 0.5% F: 1% T: 2% L: 5% P: 10%
Termination Material: B: Solderable (SnPb solder over nickel)
Size: 03: RM1005
Temperature Characteristic (ppm/°C): E: ±25
Performance Specification MIL-PRF-55342
H: ±50
K: ±100
Mechanical
Length (a)
Width (b)
Thickness (c)
Top Termination (d)
Bottom Termination (e)
Approximate Weight
Inches
.103(.098 - .112)
.048(.045 - .055)
.018(.015 - .033)
.015(.010 - .020)
.014(.010 - .020)
0.00540 g
Millimeters
2.62(2.49 - 2.84)
1.22(1.14 - 1.40)
0.46(0.38 - 0.84)
0.38(0.25 - 0.51)
0.36(0.25 - 0.51)
.133
Recommended
Minimum
Bond Pads
(inches)
.032
.069
.054
State of the Art, Inc.
www.resistor.com
Specifications Subject to Change Without Notice
2470 Fox Hill Road, State College, PA, USA 16803-1797
Telephone: 814-355-8004 Toll Free: 800-458-3401 Fax: 814-355-2714
All Products Made in the USA
Copyright 2016 by State of the Art, Inc.
We can only do our best at work, and we don't care what the leaders think.
Too many leaders and tiring work!...
eeleader Talking about work
Show off your POS machine kit!
The development of a whole set (many, a bunch of) system chips is a bit difficult. Is there a PCB development board? I can solder the chip myself, but how do I solder the BGA? I mainly want to get tec...
lidonglei1 Analogue and Mixed Signal
Does anyone have tornado2.2 for mips?
I have just started learning vxworks and want to develop a BSP for MIPS. Does anyone have tornado2.2 for mips?...
zwjiang Embedded System
Install the driver
Why does the installation of ccs_setup_win32 fail due to the lack of ASCII character?...
gwjhyy Integrated technical exchanges
How to implement process monitoring under WINCE?
What needs to be achieved now is: to be able to capture the opening event of a specified exe window, call your own program before opening, and determine whether to execute the intercepted exe event ba...
heyuqi Embedded System
Help: Looking for C6000 routines
I have just started learning C6000. I have some books on structure but no actual code. I hope some expert can share some C6000 routines, preferably c6713 or dm642, but others are also fine. Or tell me...
zhouluopei DSP and ARM Processors

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 580  1640  917  765  268  12  34  19  16  6 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号