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KFG5616Q1

Description
OneNAND256
File Size1MB,93 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
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KFG5616Q1 Overview

OneNAND256

OneNAND256
FLASH MEMORY
OneNAND SPECIFICATION
Product
OneNAND256
Part No.
KFG5616Q1M-DEB
KFG5616D1M-DEB
KFG5616U1M-DIB
V
CC
(core & IO)
1.8V(1.7V~1.95V)
2.65V(2.4V~2.9V)
3.3V(2.7V~3.6V)
Temperature
Extended
Extended
Industrial
PKG
63FBGA(LF)/48TSOP1
63FBGA(LF)/48TSOP1
63FBGA(LF)/48TSOP1
Version: Ver. 1.2
Date: June 15th, 2005
1

KFG5616Q1 Related Products

KFG5616Q1 KFG5616D1M-DEB KFG5616Q1M KFG5616Q1M-DEB KFG5616U1M-DIB
Description OneNAND256 OneNAND256 OneNAND256 OneNAND256 OneNAND256
Is it lead-free? - Lead free - Lead free Lead free
Is it Rohs certified? - conform to - conform to conform to
package instruction - FBGA, BGA63,10X12,32 - FBGA, BGA63,10X12,32 FBGA, BGA63,10X12,32
Reach Compliance Code - compli - compli compli
Maximum access time - 14.5 ns - 14.5 ns 14.5 ns
command user interface - YES - YES YES
Data polling - NO - NO NO
JESD-30 code - R-PBGA-B63 - R-PBGA-B63 R-PBGA-B63
JESD-609 code - e3 - e3 e3
memory density - 262144 bi - 262144 bi 262144 bi
Memory IC Type - FLASH - FLASH FLASH
memory width - 16 - 16 16
Humidity sensitivity level - 1 - 1 1
Number of departments/size - 512 - 512 512
Number of terminals - 63 - 63 63
word count - 16777216 words - 16777216 words 16777216 words
character code - 16000000 - 16000000 16000000
Maximum operating temperature - 85 °C - 85 °C 85 °C
Minimum operating temperature - -30 °C - -30 °C -40 °C
organize - 16MX16 - 16MX16 16MX16
Package body material - PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code - FBGA - FBGA FBGA
Encapsulate equivalent code - BGA63,10X12,32 - BGA63,10X12,32 BGA63,10X12,32
Package shape - RECTANGULAR - RECTANGULAR RECTANGULAR
Package form - GRID ARRAY, FINE PITCH - GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
page size - 512 words - 512 words 512 words
Parallel/Serial - PARALLEL - PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) - 225 - 225 225
power supply - 2.7 V - 1.8 V 3.3 V
Certification status - Not Qualified - Not Qualified Not Qualified
ready/busy - YES - YES YES
Department size - 32K - 32K 32K
Maximum standby current - 0.00005 A - 0.00005 A 0.00005 A
Maximum slew rate - 0.03 mA - 0.025 mA 0.03 mA
Nominal supply voltage (Vsup) - 2.7 V - 1.8 V 3.3 V
surface mount - YES - YES YES
technology - CMOS - CMOS CMOS
Temperature level - OTHER - OTHER INDUSTRIAL
Terminal surface - MATTE TIN - MATTE TIN MATTE TIN
Terminal form - BALL - BALL BALL
Terminal pitch - 0.8 mm - 0.8 mm 0.8 mm
Terminal location - BOTTOM - BOTTOM BOTTOM
Maximum time at peak reflow temperature - NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
switch bit - NO - NO NO
type - NAND TYPE - NAND TYPE NAND TYPE
Base Number Matches - 1 - 1 1
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