TSOP5038
Vishay Semiconductors
IR Receiver Module for Light Barrier Systems
FEATURES
• Low supply current
• Photo detector and preamplifier in one package
• Internal filter for 38 kHz IR signals
• Shielding against EMI
3
4
16797
• Supply voltage: 2.7 V to 5.5 V
• Visible light is suppressed by IR filter
• Insensitive to supply voltage ripple and noise
• Compliant to RoHS directive 2002/95/EC
accordance to WEEE 2002/96/EC
and
in
1
2
MECHANICAL DATA
Pinning:
1 = GND, 2 = N.C., 3 = OUT, 4 = V
S
DESCRIPTION
The TSOP5038 is a compact SMD IR receiver for sensor
applications. It has a high gain for IR signals at 38 kHz. The
detection level does not change when ambient light or strong
IR signals are applied. It can receive continuous 38 kHz
signals or 38 kHz bursts.
PARTS TABLE
CARRIER FREQUENCY
38 kHz
SENSOR APPLICATIONS
TSOP5038
BLOCK DIAGRAM
16833_9
APPLICATION CIRCUIT
17170_8
R
1
V
S
Circuit
C
1
OUT
GND
V
O
µC
GND
+
V
S
4
33 kΩ
V
S
3
Input
AMP
Band
pass
Demo-
dulator
OUT
IR receiver
1
PIN
GND
The external components R
1
and C
1
are optional
to improve the robustnes against electrical overstress
(typical
values
are R
1
= 100
Ω,
C
1
= 0.1 µF).
The output
voltage V
O
should not
be
pulled down to a level
below
1
V by
the external circuit.
The capacitive load at the output should
be
less than 2 nF.
Document Number: 81904
Rev. 1.2, 13-Aug-09
www.vishay.com
1
TSOP5038
Vishay Semiconductors
IR Receiver Module for Light Barrier
Systems
ABSOLUTE MAXIMUM RATINGS
(1)
PARAMETER
Supply voltage (pin 4)
Supply current (pin 4)
Output voltage (pin 3)
Voltage at output to supply
Output current (pin 3)
Junction temperature
Storage temperature range
Operating temperature range
Power consumption
T
amb
≤
85 °C
TEST CONDITION
SYMBOL
V
S
I
S
V
O
V
S
- V
O
I
O
T
j
T
stg
T
amb
P
tot
VALUE
- 0.3 to + 6.0
5
- 0.3 to 5.5
- 0.3 to (V
S
+ 0.3)
5
100
- 25 to + 85
- 25 to + 85
10
UNIT
V
mA
V
V
mA
°C
°C
°C
mW
Note
(1)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability.
ELECTRICAL AND OPTICAL CHARACTERISTICS
(1)
PARAMETER
Supply current (pin 4)
Supply voltage
Transmission distance
Output voltage low (pin 3)
Minimum irradiance
Maximum irradiance
Directivity
E
v
= 0, test signal see fig. 1,
IR diode TSAL6200,
I
F
= 400 mA
I
OSL
= 0.5 mA, E
e
= 2 mW/m
2
,
test signal see fig. 1
Pulse width tolerance:
t
pi
- 5/f
o
< t
po
< t
pi
+ 6/f
o
,
test signal see fig. 1
t
pi
- 5/f
o
< t
po
< t
pi
+ 6/f
o
,
test signal see fig. 1
Angle of half transmission distance
TEST CONDITION
E
v
= 0, V
S
= 5 V
E
v
= 40 klx, sunlight
SYMBOL
I
SD
I
SH
V
S
d
V
OSL
E
e min.
E
e max.
ϕ
1/2
30
± 50
0.5
2.7
30
100
1
MIN.
0.65
TYP.
0.85
0.95
5.5
MAX.
1.05
UNIT
mA
mA
V
m
mV
mW/m
2
W/m
2
deg
Note
(1)
T
amb
= 25 °C, unless otherwise specified
TYPICAL CHARACTERISTICS
T
amb
= 25 °C, unless otherwise specified
1
E
e
Optical Test Signal
t
po
- Output Pulse
Width
(ms)
(IR diode TSAL6200, I
F
= 0.4 A, 30 pulses, f = f
0
, t = 10 ms)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
Output Pulse
Width
t
t
pi
*
* t
pi
V
O
V
OH
V
OL
t
d
1)
T
10/f
0
is recommended for optimal function
16110
Input Burst Length
Output Signal
1)
2)
7/f
0
<
t
d
<
15/f
0
t
pi
- 5/f
0
<
t
po
<
t
pi
+ 6/f
0
t
po 2)
t
λ
= 950 nm,
Optical Test Signal, Fig.1
0.1
1
10
10
2
10
3
10
4
10
5
21391
E
e
- Irradiance (mW/m²)
Fig. 1 - Output Active Low
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2
Fig. 2 - Pulse Length and Sensitivity in Dark Ambient
Document Number: 81904
Rev. 1.2, 13-Aug-09
TSOP5038
IR Receiver Module for Light Barrier
Vishay Semiconductors
Systems
E
e
E
e min.
- Threshold Irradiance (mW/m²)
Optical Test Signal
1
0.9
0.8
0.7
f = 30 kHz
0.6
0.5
f = 20 kHz
0.4
0.3
0.2
0.1
0
1
10
100
f = 10 kHz
f = 100 Hz
1000
f = f
0
600 µs
t = 60 ms
Output Signal,
(see fig. 4)
600 µs
t
94
8134
V
O
V
OH
V
OL
t
on
t
off
t
21394
ΔVs
RMS
- AC
Voltage
on DC Supply
Voltage
(mV)
Fig. 3 - Output Function
0.8
Fig. 6 - Sensitivity vs. Supply Voltage Disturbances
500
T
on
, T
off
- Output Pulse
Width
(ms)
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0.1
1
10
10
2
10
3
λ
= 950 nm,
Optical Test Signal, Fig. 3
E - Max. Field Strength (V/m)
10
5
T
on
450
400
350
300
250
200
150
100
50
0
T
off
10
4
0
20747
500
1000
1500
2000
2500
3000
21392
E
e
- Irradiance (mW/m²)
f - EMI Frequency (MHz)
Fig. 4 - Output Pulse Diagram
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.7
16925
Fig. 7 - Sensitivity vs. Electric Field Disturbances
0.7
0.65
0.6
0.55
0.5
0.45
0.4
0.35
0.3
- 30
21407
f = f
0
± 5 %
Δ
f(3 dB) = f
0
/10
E
e min.
- Threshold Irradiance (mW/m²)
E
e min.
/E
e
- Rel. Responsivity
0.9
1.1
1.3
- 10
10
30
50
70
90
f/f
0
- Relative Frequency
T
amb
- Ambient Temperature (°C)
Fig. 5 - Frequency Dependence of Responsivity
Fig. 8 - Sensitivity vs. Ambient Temperature
Document Number: 81904
Rev. 1.2, 13-Aug-09
www.vishay.com
3
TSOP5038
Vishay Semiconductors
IR Receiver Module for Light Barrier
Systems
1.2
S (
λ
)
rel
- Relative Spectral Sensitivity
1.0
0.8
0.6
0.4
0.2
0.0
750
850
950
1050
1150
16919
λ
-
Wavelength
(nm)
Fig. 9 - Relative Spectral Sensitivity vs. Wavelength
0°
10°
20°
30°
40°
1.0
0.9
0.8
50°
60°
70°
0.7
80°
0.6
16801
0.4
0.2
0
0.2
0.4
0.6
d
rel
- Relative Transmission Distance
Fig. 10 - Horizontal Directivity
0.8
0.75
E
e min.
- Sensitivity (mW/m²)
0.7
0.65
0.6
0.55
0.5
0.45
0.4
0.35
0.3
1.5
2.5
3.5
4.5
5.5
21408
V
S
- Supply
Voltage
(V)
Fig. 11 - Sensitivity vs. Supply Voltage
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Document Number: 81904
Rev. 1.2, 13-Aug-09
TSOP5038
IR Receiver Module for Light Barrier
Vishay Semiconductors
Systems
PACKAGE DIMENSIONS
in millimeters
7.5 ± 0.5
Pick and place area. TT taping
7.2
2.8
1
0.5
1.27
3 x 1.27 = 3.81
5.51
4x
4
(1.4)
(1.5)
2.9 ± 0.5
4
Pick and place area. TR taping
Not
indicated tolerances ± 0.3
2.6
technical drawings
according to DIN
specifications
Footprint
3 x 1.27 = 3.81
2.35
1.27
0.9
Drawing-No.: 6.544-5341.01-4
Issue: 7; 23.03.09
16776
R1.7
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60
%
RH after opening
the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as shown
in the diagram. Excercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Document Number: 81904
Rev. 1.2, 13-Aug-09
www.vishay.com
5
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
2.2
Ø 2.2
5.3
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