A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
I am currently working on USB development, please come and visit me. Can anyone please give me some references on how to read USB disks in embedded LINUX?...
[i=s]This post was last edited by sacq on 2014-1-7 00:15[/i] In addition to verifying the routine, this post also verifies the "oscilloscope". (First time using) Verify the official routine: DAC_Signa...
I want to burn the generated AIS file into the external NOR FLASH of C6748. Should I write the AIS file into the starting address 0x60000000 of NOR FLASH according to the address?...
Due to employee resignation, I am transferring 2 swimming cards of Ginza Sunshine Swimming Pool. They are issued by the company collectively, and are valid for 250 days and 17 times. This card is anon...
After soldering the LCD screen off, I found that several solder pads of the cable were left directly on the board. It was not because the soldering iron was too hot. Alas......
1. Introduction
RFID (radio frequency identification) is a non-contact automatic identification technology that emerged in the 1990s. It uses the characteristics of radio frequency signal prop...[Details]
1. Introduction
Since the 1980s, with the continuous development of automotive electronic technology, there are more and more electronic control units in automobiles, such as electronic fuel i...[Details]
In public places such as schools, government agencies, factories and mines, as well as public corridors in residential areas, the phenomenon of long-burning lights is very common, which causes a h...[Details]
Electronic systems are located at different points on the automotive power bus and therefore often need to operate under very stringent power requirements. These include load dump, cold crank, very lo...[Details]
Since the No. 4 blast furnace of Handan Iron and Steel was put into operation in 1993, its external equipment has been seriously aged, and the original PLC control system TDC3000 of the hot blast furn...[Details]
1. Introduction
Testing the temperature of steel billets before rolling is an important measure to ensure the quality of steel. Traditional manual testing is difficult to ensure product qu...[Details]
1 Introduction
In recent years, there have been many major advances in the production technology and processes of automotive headlights, which have greatly improved the performance of automoti...[Details]
With the rapid development of intelligent control technology, computers and information technology, the trend of information appliances IA (Information Application), computers and communications integ...[Details]
Different initialization between C8051F and 80C51 series microcontrollers
In the past 30 years, major electronic component manufacturers in the world have launched their own unique single-chip...[Details]
Since the late 1990s, with the demand for higher system efficiency and lower power consumption, the technological update of telecommunications and data communication equipment has promoted the deve...[Details]
System Overview
The system consists of a signal preprocessing circuit, a single-chip computer AT89C2051, a systematic LED display module, a serial port data storage circuit and system software...[Details]
1 Introduction
Ultrasound refers to elastic vibration with a frequency higher than the audible frequency limit (i.e., in the frequency band above 20 kHz). The propagation process of this vib...[Details]
0 Introduction
There are many types of sensors, and the working principles, measurement targets and measurement environments of different types of sensors vary greatly. The corresponding detection s...[Details]
The demand for improved healthcare environments is endless, so medical imaging equipment with higher resolution is needed to better observe the human body. High resolution brings problems with sign...[Details]
Almost everyone in a student dormitory has a bedside lamp. But if you want to read for a while after turning off the lights and don't want to disturb your roommates' sleep, you may need a reading l...[Details]