5962-8764805XA datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > storage> storage> 5962-8764805XA

5962-8764805XA: DescriptionUVPROM, 64KX8, 90ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28; Categorystorage storage; File Size320KB，12 Pages; ManufacturerAMD; Websitehttp://www.amd.com

Download Datasheet Parametric Compare View All

5962-8764805XA Overview

UVPROM, 64KX8, 90ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

5962-8764805XA Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	AMD
Parts packaging code	DIP
package instruction	WDIP, DIP28,.6
Contacts	28
Reach Compliance Code	unknown
ECCN code	EAR99
Maximum access time	90 ns
I/O type	COMMON
JESD-30 code	R-GDIP-T28
JESD-609 code	e0
length	37.1475 mm
memory density	524288 bit
Memory IC Type	UVPROM
memory width	8
Number of functions	1
Number of terminals	28
word count	65536 words
character code	64000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	64KX8
Output characteristics	3-STATE
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	WDIP
Encapsulate equivalent code	DIP28,.6
Package shape	RECTANGULAR
Package form	IN-LINE, WINDOW
Parallel/Serial	PARALLEL
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	5.588 mm
Maximum standby current	0.000325 A
Maximum slew rate	0.06 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE
Terminal pitch	2.54 mm
Terminal location	DUAL
width	15.24 mm
Base Number Matches	1

Preview

Download Datasheet

View All

5962-8764805XA Related Products

	5962-8764805XA	5962-8764801XA	5962-8764804YA	5962-8764802XA	5962-8764803YA	5962-8764803XA	5962-8764805YA	5962-8764801YA	5962-8764804XA	5962-8764802YA
Description	UVPROM, 64KX8, 90ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 120ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 64KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32	UVPROM, 64KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28	UVPROM, 64KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible	incompatible
Parts packaging code	DIP	DIP	QFJ	DIP	QFJ	DIP	QFJ	QFJ	DIP	QFJ
package instruction	WDIP, DIP28,.6	WDIP, DIP28,.6	WQCCN, LCC32,.45X.55	WDIP, DIP28,.6	WQCCN, LCC32,.45X.55	WDIP, DIP28,.6	WQCCN, LCC32,.45X.55	WQCCN, LCC32,.45X.55	WDIP, DIP28,.6	WQCCN, LCC32,.45X.55
Contacts	28	28	32	28	32	28	32	32	28	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum access time	90 ns	150 ns	120 ns	200 ns	250 ns	250 ns	90 ns	150 ns	120 ns	200 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	R-GDIP-T28	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-CQCC-N32	R-GDIP-T28	R-CQCC-N32	R-CQCC-N32	R-GDIP-T28	R-CQCC-N32
JESD-609 code	e0	e0	e0	e0	e0	e0	e0	e0	e0	e0
length	37.1475 mm	37.1475 mm	13.97 mm	37.1475 mm	13.97 mm	37.1475 mm	13.97 mm	13.97 mm	37.1475 mm	13.97 mm
memory density	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM	UVPROM
memory width	8	8	8	8	8	8	8	8	8	8
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of terminals	28	28	32	28	32	28	32	32	28	32
word count	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
character code	64000	64000	64000	64000	64000	64000	64000	64000	64000	64000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
organize	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8	64KX8
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	WDIP	WDIP	WQCCN	WDIP	WQCCN	WDIP	WQCCN	WQCCN	WDIP	WQCCN
Encapsulate equivalent code	DIP28,.6	DIP28,.6	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55	LCC32,.45X.55	DIP28,.6	LCC32,.45X.55
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	IN-LINE, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW	CHIP CARRIER, WINDOW	IN-LINE, WINDOW	CHIP CARRIER, WINDOW
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
power supply	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	5.588 mm	5.588 mm	3.556 mm	5.588 mm	3.556 mm	5.588 mm	3.556 mm	3.556 mm	5.588 mm	3.556 mm
Maximum standby current	0.000325 A	0.000325 A	0.000325 A	0.000325 A	0.000325 A	0.000325 A	0.000325 A	0.000325 A	0.000325 A	0.000325 A
Maximum slew rate	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA	0.06 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	YES	NO	YES	NO	YES	YES	NO	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped	Tin/Lead (Sn/Pb) - hot dipped
Terminal form	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	NO LEAD
Terminal pitch	2.54 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	2.54 mm	1.27 mm	1.27 mm	2.54 mm	1.27 mm
Terminal location	DUAL	DUAL	QUAD	DUAL	QUAD	DUAL	QUAD	QUAD	DUAL	QUAD
width	15.24 mm	15.24 mm	11.43 mm	15.24 mm	11.43 mm	15.24 mm	11.43 mm	11.43 mm	15.24 mm	11.43 mm
Maker	AMD	-	AMD	-	-	AMD	AMD	AMD	AMD	AMD
Base Number Matches	1	1	1	1	1	1	1	1	1	-

Recommended Resources

Lighting sound-activated switch circuit using thyristors Part 3

Provides circuit diagram for three-way power supply

Automatic protection DC power supply circuit diagram to prevent microcomputer power outage

Circuit diagram of changing 1.8V-3.6V to 3.3V without inductor

TDA1521 power amplifier circuit

Barcode signal conditioning circuit

Chapter 6 Audio Devices: Written by Ogawa Studio, this book is written for the LM3S USB chip. The uploaded ones are all drafts and have not been revised . There may be many shortcomings. I hope netizens will forgive me! QQ:26...; paulhyde Microcontroller MCU

Research on 18B20 multi-point temperature measurement: I think everyone has learned how to measure temperature with an 18B20. Have you ever measured the temperature of multiple 18B20s in series? It is difficult to find such a program on the Internet. If y...; ruiquan765 MCU

[National Technology N32G457 Review] 1. Data Preparation: [i=s]This post was last edited by fxyc87 on 2022-1-18 13:48[/i]Event page: National Technology M4 core hot-selling model N32G45XVLThe N32G45XVL-STB development board is used for the sample development...; fxyc87 Domestic Chip Exchange

How to receive status report with SMS modem???: I searched online for a long time, but found that none of them are available. I have a mobile modem. After executing the SIM card STK menu to send a text message, I hope to receive a mobile status rep...; cooler1981 Embedded System

Design and application principles of multi-channel output switching power supply: For modern electronic systems, even the simplest electronic system consisting of a single-chip microcomputer and a single I/O interface circuit, its power supply voltage is generally composed of multi...; wzt Power technology

How to convert the 3.3V output of PWM into 5V?: Since the driver module requires 5V to be driven, how to convert the 3.3V output of the PWM into 5V?...; taoym101 Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components