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5962-8764805YA

Description
UVPROM, 64KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
Categorystorage    storage   
File Size320KB，12 Pages
ManufacturerAMD
Websitehttp://www.amd.com
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5962-8764805YA Overview

UVPROM, 64KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32

5962-8764805YA Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerAMD
Parts packaging codeQFJ
package instructionWQCCN, LCC32,.45X.55
Contacts32
Reach Compliance Codeunknown
ECCN codeEAR99
Maximum access time90 ns
I/O typeCOMMON
JESD-30 codeR-CQCC-N32
JESD-609 codee0
length13.97 mm
memory density524288 bit
Memory IC TypeUVPROM
memory width8
Number of functions1
Number of terminals32
word count65536 words
character code64000
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize64KX8
Output characteristics3-STATE
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeWQCCN
Encapsulate equivalent codeLCC32,.45X.55
Package shapeRECTANGULAR
Package formCHIP CARRIER, WINDOW
Parallel/SerialPARALLEL
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height3.556 mm
Maximum standby current0.000325 A
Maximum slew rate0.06 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb) - hot dipped
Terminal formNO LEAD
Terminal pitch1.27 mm
Terminal locationQUAD
width11.43 mm
Base Number Matches1

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5962-8764805YA 5962-8764805XA 5962-8764801XA 5962-8764804YA 5962-8764802XA 5962-8764803YA 5962-8764803XA 5962-8764801YA 5962-8764804XA 5962-8764802YA
Description UVPROM, 64KX8, 90ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 UVPROM, 64KX8, 90ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 UVPROM, 64KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 UVPROM, 64KX8, 120ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 UVPROM, 64KX8, 200ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 UVPROM, 64KX8, 250ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 UVPROM, 64KX8, 250ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 UVPROM, 64KX8, 150ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 UVPROM, 64KX8, 120ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 UVPROM, 64KX8, 200ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32
Is it Rohs certified? incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible incompatible
Parts packaging code QFJ DIP DIP QFJ DIP QFJ DIP QFJ DIP QFJ
package instruction WQCCN, LCC32,.45X.55 WDIP, DIP28,.6 WDIP, DIP28,.6 WQCCN, LCC32,.45X.55 WDIP, DIP28,.6 WQCCN, LCC32,.45X.55 WDIP, DIP28,.6 WQCCN, LCC32,.45X.55 WDIP, DIP28,.6 WQCCN, LCC32,.45X.55
Contacts 32 28 28 32 28 32 28 32 28 32
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown unknown unknown
ECCN code EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
Maximum access time 90 ns 90 ns 150 ns 120 ns 200 ns 250 ns 250 ns 150 ns 120 ns 200 ns
I/O type COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON COMMON
JESD-30 code R-CQCC-N32 R-GDIP-T28 R-GDIP-T28 R-CQCC-N32 R-GDIP-T28 R-CQCC-N32 R-GDIP-T28 R-CQCC-N32 R-GDIP-T28 R-CQCC-N32
JESD-609 code e0 e0 e0 e0 e0 e0 e0 e0 e0 e0
length 13.97 mm 37.1475 mm 37.1475 mm 13.97 mm 37.1475 mm 13.97 mm 37.1475 mm 13.97 mm 37.1475 mm 13.97 mm
memory density 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit 524288 bit
Memory IC Type UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM UVPROM
memory width 8 8 8 8 8 8 8 8 8 8
Number of functions 1 1 1 1 1 1 1 1 1 1
Number of terminals 32 28 28 32 28 32 28 32 28 32
word count 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words 65536 words
character code 64000 64000 64000 64000 64000 64000 64000 64000 64000 64000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C
organize 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8 64KX8
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED CERAMIC, GLASS-SEALED CERAMIC, METAL-SEALED COFIRED
encapsulated code WQCCN WDIP WDIP WQCCN WDIP WQCCN WDIP WQCCN WDIP WQCCN
Encapsulate equivalent code LCC32,.45X.55 DIP28,.6 DIP28,.6 LCC32,.45X.55 DIP28,.6 LCC32,.45X.55 DIP28,.6 LCC32,.45X.55 DIP28,.6 LCC32,.45X.55
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form CHIP CARRIER, WINDOW IN-LINE, WINDOW IN-LINE, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW CHIP CARRIER, WINDOW IN-LINE, WINDOW CHIP CARRIER, WINDOW
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum seat height 3.556 mm 5.588 mm 5.588 mm 3.556 mm 5.588 mm 3.556 mm 5.588 mm 3.556 mm 5.588 mm 3.556 mm
Maximum standby current 0.000325 A 0.000325 A 0.000325 A 0.000325 A 0.000325 A 0.000325 A 0.000325 A 0.000325 A 0.000325 A 0.000325 A
Maximum slew rate 0.06 mA 0.06 mA 0.06 mA 0.06 mA 0.06 mA 0.06 mA 0.06 mA 0.06 mA 0.06 mA 0.06 mA
Maximum supply voltage (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES NO NO YES NO YES NO YES NO YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped Tin/Lead (Sn/Pb) - hot dipped
Terminal form NO LEAD THROUGH-HOLE THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD THROUGH-HOLE NO LEAD
Terminal pitch 1.27 mm 2.54 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm 1.27 mm
Terminal location QUAD DUAL DUAL QUAD DUAL QUAD DUAL QUAD DUAL QUAD
width 11.43 mm 15.24 mm 15.24 mm 11.43 mm 15.24 mm 11.43 mm 15.24 mm 11.43 mm 15.24 mm 11.43 mm
Maker AMD AMD - AMD - - AMD AMD AMD AMD
Base Number Matches 1 1 1 1 1 1 1 1 1 -

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