1200 bps Single Chip FSK MODEM
| Parameter Name | Attribute value |
| Maker | OKI |
| Parts packaging code | QFP |
| package instruction | QFP, |
| Contacts | 44 |
| Reach Compliance Code | unknow |
| Other features | HALF DUPLEX |
| data rate | 1.2 Mbps |
| JESD-30 code | R-PQFP-G44 |
| length | 10.5 mm |
| Number of functions | 1 |
| Number of terminals | 44 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | QFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Maximum seat height | 2 mm |
| Maximum slew rate | 18 mA |
| Nominal supply voltage | 12 V |
| surface mount | YES |
| Telecom integrated circuit types | MODEM |
| Temperature level | COMMERCIAL |
| Terminal form | GULL WING |
| Terminal pitch | 0.8 mm |
| Terminal location | QUAD |
| width | 9.5 mm |

| MSM6947GS-K | MSM6927GS-2K | MSM6927GS-K | MSM6927RS | MSM6947RS | MSM6947 | MSM6927 | |
|---|---|---|---|---|---|---|---|
| Description | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM | 1200 bps Single Chip FSK MODEM |
| Maker | OKI | OKI | OKI | OKI | OKI | - | - |
| Parts packaging code | QFP | QFP | QFP | DIP | DIP | - | - |
| package instruction | QFP, | QFP, | QFP, | DIP, | DIP, | - | - |
| Contacts | 44 | 44 | 44 | 28 | 28 | - | - |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | - | - |
| Other features | HALF DUPLEX | - | HALF DUPLEX | HALF DUPLEX | HALF DUPLEX | - | - |
| data rate | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | 1.2 Mbps | - | - |
| JESD-30 code | R-PQFP-G44 | R-PQFP-G44 | R-PQFP-G44 | R-PDIP-T28 | R-PDIP-T28 | - | - |
| length | 10.5 mm | 10.5 mm | 10.5 mm | 36.7 mm | 36.7 mm | - | - |
| Number of functions | 1 | 1 | 1 | 1 | 1 | - | - |
| Number of terminals | 44 | 44 | 44 | 28 | 28 | - | - |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | - | - |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| encapsulated code | QFP | QFP | QFP | DIP | DIP | - | - |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| Package form | FLATPACK | FLATPACK | FLATPACK | IN-LINE | IN-LINE | - | - |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - |
| Maximum seat height | 2 mm | 2.25 mm | 2 mm | 5.08 mm | 5.08 mm | - | - |
| Maximum slew rate | 18 mA | 18 mA | 18 mA | 18 mA | 18 mA | - | - |
| Nominal supply voltage | 12 V | 12 V | 12 V | 12 V | 12 V | - | - |
| surface mount | YES | YES | YES | NO | NO | - | - |
| Telecom integrated circuit types | MODEM | MODEM | MODEM | MODEM | MODEM | - | - |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | - | - |
| Terminal form | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | - | - |
| Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 2.54 mm | 2.54 mm | - | - |
| Terminal location | QUAD | QUAD | QUAD | DUAL | DUAL | - | - |
| width | 9.5 mm | 9.5 mm | 9.5 mm | 15.24 mm | 15.24 mm | - | - |