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DS2502PV

Description
OTP ROM, 1KX1, CMOS, PDSO6, 3.7 X 4 X 1.5 MM, TSOC-6
Categorystorage    storage   
File Size486KB,21 Pages
ManufacturerMaxim
Websitehttps://www.maximintegrated.com/en.html
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DS2502PV Overview

OTP ROM, 1KX1, CMOS, PDSO6, 3.7 X 4 X 1.5 MM, TSOC-6

DS2502PV Parametric

Parameter NameAttribute value
MakerMaxim
package instructionLSOC,
Reach Compliance Codeunknown
ECCN codeEAR99
JESD-30 codeR-PDSO-C6
JESD-609 codee0
length3.94 mm
memory density1024 bit
Memory IC TypeOTP ROM
memory width1
Number of functions1
Number of terminals6
word count1024 words
character code1000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize1KX1
Package body materialPLASTIC/EPOXY
encapsulated codeLSOC
Package shapeRECTANGULAR
Package formSMALL OUTLINE, LOW PROFILE
Parallel/SerialSERIAL
Certification statusNot Qualified
Maximum seat height1.5 mm
Maximum supply voltage (Vsup)6 V
Minimum supply voltage (Vsup)2.8 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formC BEND
Terminal pitch1.27 mm
Terminal locationDUAL
width3.76 mm
Base Number Matches1

DS2502PV Related Products

DS2502PV DS2502SY DS25021AT DS25021A
Description OTP ROM, 1KX1, CMOS, PDSO6, 3.7 X 4 X 1.5 MM, TSOC-6 OTP ROM, 1KX1, CMOS, PDSO8 OTP ROM, 1KX1, CMOS, PBCY3, TO-92, 3 PIN OTP ROM, 1KX1, CMOS, PSIP3
Maker Maxim Maxim Maxim Maxim
package instruction LSOC, SOP, TO-92, TO-92,
Reach Compliance Code unknown compliant compliant compliant
ECCN code EAR99 EAR99 EAR99 EAR99
JESD-30 code R-PDSO-C6 R-PDSO-G8 O-PBCY-T3 O-PBCY-T3
JESD-609 code e0 e0 e0 e0
memory density 1024 bit 1024 bit 1024 bit 1024 bit
Memory IC Type OTP ROM OTP ROM OTP ROM OTP ROM
memory width 1 1 1 1
Number of functions 1 1 1 1
Number of terminals 6 8 3 3
word count 1024 words 1024 words 1024 words 1024 words
character code 1000 1000 1000 1000
Operating mode ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 1KX1 1KX1 1KX1 1KX1
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LSOC SOP TO-92 TO-92
Package shape RECTANGULAR RECTANGULAR ROUND ROUND
Package form SMALL OUTLINE, LOW PROFILE SMALL OUTLINE CYLINDRICAL CYLINDRICAL
Parallel/Serial SERIAL SERIAL SERIAL SERIAL
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum supply voltage (Vsup) 6 V 6 V 6 V 6 V
Minimum supply voltage (Vsup) 2.8 V 2.8 V 2.8 V 2.8 V
surface mount YES YES NO NO
technology CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal surface TIN LEAD TIN LEAD TIN LEAD TIN LEAD
Terminal form C BEND GULL WING THROUGH-HOLE THROUGH-HOLE
Terminal location DUAL DUAL BOTTOM BOTTOM
Is it lead-free? - Contains lead Contains lead Contains lead
Is it Rohs certified? - incompatible incompatible incompatible
Peak Reflow Temperature (Celsius) - 240 NOT SPECIFIED NOT SPECIFIED
Maximum time at peak reflow temperature - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
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