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HD63A03YCP

Description
cmos mpu
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,45 Pages
ManufacturerHitachi (Renesas )
Websitehttp://www.renesas.com/eng/
Download Datasheet Parametric Compare View All

HD63A03YCP Overview

cmos mpu

HD63A03YCP Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeLCC
package instructionPLASTIC, LCC-68
Contacts68
Reach Compliance Codeunknown
Has ADCNO
Address bus width16
bit size8
CPU series6800
maximum clock frequency1.5 MHz
DAC channelNO
DMA channelNO
External data bus width8
JESD-30 codeS-PQCC-J68
JESD-609 codee0
length24.2316 mm
Number of I/O lines24
Number of terminals68
Maximum operating temperature75 °C
Minimum operating temperature-20 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC68,1.0SQ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
RAM (bytes)256
rom(word)0
Maximum seat height4.57 mm
speed1.5 MHz
Maximum slew rate15 mA
Maximum supply voltage5.5 V
Minimum supply voltage4.5 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL EXTENDED
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width24.2316 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1

HD63A03YCP Related Products

HD63A03YCP HD63A03YH HD63A03YF
Description cmos mpu cmos mpu cmos mpu
Is it Rohs certified? incompatible incompatible incompatible
Parts packaging code LCC QFP QFP
package instruction PLASTIC, LCC-68 PLASTIC, QFP-64 PLASTIC, QFP-64
Contacts 68 64 64
Reach Compliance Code unknown unknown unknown
Has ADC NO NO NO
Address bus width 16 16 16
bit size 8 8 8
CPU series 6800 6800 6800
maximum clock frequency 1.5 MHz 1.5 MHz 1.5 MHz
DAC channel NO NO NO
DMA channel NO NO NO
External data bus width 8 8 8
JESD-30 code S-PQCC-J68 S-PQFP-G64 R-PQFP-G64
JESD-609 code e0 e0 e0
length 24.2316 mm 14 mm 20 mm
Number of I/O lines 24 24 24
Number of terminals 68 64 64
Maximum operating temperature 75 °C 75 °C 75 °C
Minimum operating temperature -20 °C -20 °C -20 °C
PWM channel NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ QFP QFP
Encapsulate equivalent code LDCC68,1.0SQ QFP64,.66SQ,32 QFP64,.7X.95,40
Package shape SQUARE SQUARE RECTANGULAR
Package form CHIP CARRIER FLATPACK FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (bytes) 256 256 256
Maximum seat height 4.57 mm 3.05 mm 3.1 mm
speed 1.5 MHz 1.5 MHz 1.5 MHz
Maximum slew rate 15 mA 15 mA 15 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V
Minimum supply voltage 4.5 V 4.5 V 4.5 V
Nominal supply voltage 5 V 5 V 5 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level COMMERCIAL EXTENDED COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form J BEND GULL WING GULL WING
Terminal pitch 1.27 mm 0.8 mm 1 mm
Terminal location QUAD QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 24.2316 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1 1
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