HD63A03YF datasheet, PDF - EEWORLD Datasheet

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HD63A03YF: Descriptioncmos mpu; CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，45 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HD63A03YF Overview

cmos mpu

HD63A03YF Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Parts packaging code	QFP
package instruction	PLASTIC, QFP-64
Contacts	64
Reach Compliance Code	unknown
Has ADC	NO
Address bus width	16
bit size	8
CPU series	6800
maximum clock frequency	1.5 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	R-PQFP-G64
JESD-609 code	e0
length	20 mm
Number of I/O lines	24
Number of terminals	64
Maximum operating temperature	75 °C
Minimum operating temperature	-20 °C
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QFP
Encapsulate equivalent code	QFP64,.7X.95,40
Package shape	RECTANGULAR
Package form	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	0
Maximum seat height	3.1 mm
speed	1.5 MHz
Maximum slew rate	15 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	4.5 V
Nominal supply voltage	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	1 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER
Base Number Matches	1

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HD63A03YF Related Products

	HD63A03YF	HD63A03YCP	HD63A03YH
Description	cmos mpu	cmos mpu	cmos mpu
Is it Rohs certified?	incompatible	incompatible	incompatible
Parts packaging code	QFP	LCC	QFP
package instruction	PLASTIC, QFP-64	PLASTIC, LCC-68	PLASTIC, QFP-64
Contacts	64	68	64
Reach Compliance Code	unknown	unknown	unknown
Has ADC	NO	NO	NO
Address bus width	16	16	16
bit size	8	8	8
CPU series	6800	6800	6800
maximum clock frequency	1.5 MHz	1.5 MHz	1.5 MHz
DAC channel	NO	NO	NO
DMA channel	NO	NO	NO
External data bus width	8	8	8
JESD-30 code	R-PQFP-G64	S-PQCC-J68	S-PQFP-G64
JESD-609 code	e0	e0	e0
length	20 mm	24.2316 mm	14 mm
Number of I/O lines	24	24	24
Number of terminals	64	68	64
Maximum operating temperature	75 °C	75 °C	75 °C
Minimum operating temperature	-20 °C	-20 °C	-20 °C
PWM channel	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QFP	QCCJ	QFP
Encapsulate equivalent code	QFP64,.7X.95,40	LDCC68,1.0SQ	QFP64,.66SQ,32
Package shape	RECTANGULAR	SQUARE	SQUARE
Package form	FLATPACK	CHIP CARRIER	FLATPACK
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	256	256	256
Maximum seat height	3.1 mm	4.57 mm	3.05 mm
speed	1.5 MHz	1.5 MHz	1.5 MHz
Maximum slew rate	15 mA	15 mA	15 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	4.5 V	4.5 V	4.5 V
Nominal supply voltage	5 V	5 V	5 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED	COMMERCIAL EXTENDED
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	J BEND	GULL WING
Terminal pitch	1 mm	1.27 mm	0.8 mm
Terminal location	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	14 mm	24.2316 mm	14 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER
Base Number Matches	1	1	1

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