3DSD2G64VB4488MS datasheet, PDF

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3DSD2G64VB4488MS: DescriptionSynchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119; Categorystorage storage; File Size490KB，2 Pages; Manufacturer3D PLUS

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3DSD2G64VB4488MS Overview

Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119

3DSD2G64VB4488MS Parametric

Parameter Name	Attribute value
Maker	3D PLUS
package instruction	BGA,
Reach Compliance Code	unknown
access mode	MULTI BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B119
length	26 mm
memory density	2147483648 bit
Memory IC Type	SYNCHRONOUS DRAM
memory width	64
Number of functions	1
Number of ports	1
Number of terminals	119
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	32MX64
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	RECTANGULAR
Package form	GRID ARRAY
Maximum seat height	8.9 mm
self refresh	YES
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	16 mm
Base Number Matches	1

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MEMORY MODULE

SDRam 64Mx48-SOP

3DSD2G64VB4488

Synchronous Dynamic Ram

MODULE

2Gbit SDRAM organized as 32Mx64, based on 32Mx16

Pin Assignment (Top View)

BGA 119 (8x15 - Pitch : 1.27mm)

Features

- Stack of four 512Mbit SDRam.

- Organized as 32Mx64bit.

- Single +3.3V power supply.

- Fully synchronous; all signals registered on positive edge

of system clock.

- Internal pipelined operation; column address can be

changed every clock cycle.

- Programmable burst lengths; 1,2,4,8 or full page.

- Auto Precharge, includes Concurrent Auto Precharge, and

Auto Refresh Modes.

- Auto Refresh Modes.

- LVTTL-compatible inputs and outputs.

- Available Temperature Range:

0°C to +70°C

-40°C to +85°C

-

Available with screening option for high reliability

application (Space, etc…)

General Description

The 3D SD2G64VB4488 is a high-speed highly integrated

Synchronous Dynamic Random Access Memory containing

2.147.483.648 bits.

It is organized with 6 banks of 512Mbit.

Each bank has a 16-bit interface and is selected with

specific #CS, CLK and CKE.

All other signals are common to the four 512Mbit SDRAM

memories.

It is particularly well suited for use in high reliability, high

performance and high density system applications, such as

solid state mass recorder, server or workstation.

The 3D SD2G64VB4488 is packaged in a 119 ball BGA.

FUNCTIONAL BLOCK DIAGRAM

(All other signals are common to the four memories)

SDRAM Memory Module

130

3D Plus SA reserves the right to cancel product or specifications without notice

3DFP-0488-REV 2-JAN. 2013

3DSD2G64VB4488MS Related Products

	3DSD2G64VB4488MS	3DSD2G64VB4488CN	3DSD2G64VB4488IBH-00	3DSD2G64VB4488CN-00	3DSD2G64VB4488SC	3DSD2G64VB4488MSY-00	3DSD2G64VB4488MS-00	3DSD2G64VB4488IB	3DSD2G64VB4488MSP-00
Description	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119	Synchronous DRAM, 32MX64, CMOS, PBGA119, 1.27 MM PITCH, BGA-119
Maker	3D PLUS	3D PLUS	3D PLUS	3D PLUS	3D PLUS	3D PLUS	3D PLUS	3D PLUS	3D PLUS
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
access mode	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST	MULTI BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119	R-PBGA-B119
length	26 mm	26 mm	26 mm	26 mm	26 mm	26 mm	26 mm	26 mm	26 mm
memory density	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit
Memory IC Type	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM	SYNCHRONOUS DRAM
memory width	64	64	64	64	64	64	64	64	64
Number of functions	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1
Number of terminals	119	119	119	119	119	119	119	119	119
word count	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words	33554432 words
character code	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
organize	32MX64	32MX64	32MX64	32MX64	32MX64	32MX64	32MX64	32MX64	32MX64
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Maximum seat height	8.9 mm	8.9 mm	8.9 mm	8.9 mm	8.9 mm	8.9 mm	8.9 mm	8.9 mm	8.9 mm
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm	16 mm
Base Number Matches	1	1	1	1	1	1	1	1	1
Maximum operating temperature	125 °C	70 °C	85 °C	70 °C	-	125 °C	125 °C	85 °C	125 °C
Minimum operating temperature	-55 °C	-	-40 °C	-	-	-55 °C	-55 °C	-40 °C	-55 °C
Temperature level	MILITARY	COMMERCIAL	INDUSTRIAL	COMMERCIAL	-	MILITARY	MILITARY	INDUSTRIAL	MILITARY

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