XOR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14
| Parameter Name | Attribute value |
| package instruction | , |
| Reach Compliance Code | unknown |
| series | HCT |
| JESD-30 code | R-CDFP-F14 |
| JESD-609 code | e4 |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | XOR GATE |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| propagation delay (tpd) | 20 ns |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | GOLD |
| Terminal form | FLAT |
| Terminal location | DUAL |
| total dose | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9581401VXC | 5962R9581401VCC | HCTS86D/SAMPLE | HCTS86K/SAMPLE | HCTS86DMSR | HCTS86KMSR | HCTS86HMSR | |
|---|---|---|---|---|---|---|---|
| Description | XOR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14 | XOR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDIP14 | XOR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDIP14 | XOR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14 | XOR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDIP14 | XOR Gate, HCT Series, 4-Func, 2-Input, CMOS, CDFP14 | XOR Gate, HCT Series, 4-Func, 2-Input, CMOS |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
| series | HCT | HCT | HCT | HCT | HCT | HCT | HCT |
| JESD-30 code | R-CDFP-F14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | R-CDIP-T14 | R-CDFP-F14 | X-XUUC-N14 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | XOR GATE | XOR GATE | XOR GATE | XOR GATE | XOR GATE | XOR GATE | XOR GATE |
| Number of functions | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Number of entries | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | UNSPECIFIED |
| Package form | FLATPACK | IN-LINE | IN-LINE | FLATPACK | IN-LINE | FLATPACK | UNCASED CHIP |
| propagation delay (tpd) | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | NO | NO | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Terminal form | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | THROUGH-HOLE | FLAT | NO LEAD |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | UPPER |
| JESD-609 code | e4 | e4 | - | - | e0 | e0 | - |
| Maximum operating temperature | 125 °C | 125 °C | - | - | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
| Temperature level | MILITARY | MILITARY | - | - | MILITARY | MILITARY | MILITARY |
| Terminal surface | GOLD | GOLD | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| total dose | 100k Rad(Si) V | 100k Rad(Si) V | - | - | 200k Rad(Si) V | 200k Rad(Si) V | - |
| Maker | - | Harris | Harris | Harris | Harris | Harris | Harris |
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