Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Maxim |
| Parts packaging code | SOIC |
| package instruction | 0.300 INCH, SOIC-16 |
| Contacts | 16 |
| Reach Compliance Code | not_compliant |
| ECCN code | EAR99 |
| Adjustable threshold | NO |
| Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 code | R-PDSO-G16 |
| JESD-609 code | e0 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | SOP |
| Encapsulate equivalent code | SOP16,.4 |
| Package shape | RECTANGULAR |
| Package form | SMALL OUTLINE |
| Peak Reflow Temperature (Celsius) | 245 |
| Certification status | Not Qualified |
| Maximum seat height | 2.642 mm |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.6745 mm |
| Base Number Matches | 1 |

| MAX714EWE | MAX716EWI | MAX714CWE | MAX716CWI | MAX716EPI | MAX716MJI | MAX715EWG | MAX715ENG | MAX715CNG | MAX715MRG | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16 | Power Management Circuit, BIPolar, PDSO28 | Power Supply Support Circuit, Fixed, CMOS, PDSO16, 0.300 INCH, SOIC-16 | Power Management Circuit, BIPolar, PDSO28 | Power Management Circuit, BIPolar, PDIP28 | Power Management Circuit, BIPolar, CDIP28 | Power Supply Support Circuit, Fixed, 1 Channel, CMOS, PDSO24, 0.300 INCH, SOIC-24 | Power Supply Support Circuit, Fixed, CMOS, PDIP24, PLASTIC, DIP-24 | Power Supply Support Circuit, Fixed, CMOS, PDIP24, PLASTIC, DIP-24 | Power Supply Support Circuit, Fixed, CMOS, CDIP24, CERDIP-24 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | _compli | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | _compli | _compli |
| JESD-30 code | R-PDSO-G16 | R-PDSO-G28 | R-PDSO-G16 | R-PDSO-G28 | R-PDIP-T28 | R-XDIP-T28 | R-PDSO-G24 | R-PDIP-T24 | R-PDIP-T24 | R-GDIP-T24 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| Number of terminals | 16 | 28 | 16 | 28 | 28 | 28 | 24 | 24 | 24 | 24 |
| Maximum operating temperature | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 125 °C | 85 °C | 85 °C | 70 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C | - | - | -40 °C | -55 °C | -40 °C | -40 °C | - | -55 °C |
| Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED |
| encapsulated code | SOP | SOP | SOP | SOP | DIP | DIP | SOP | DIP | DIP | DIP |
| Encapsulate equivalent code | SOP16,.4 | SOP28,.4 | SOP16,.4 | SOP28,.4 | DIP28,.3 | DIP28,.3 | SOP24,.4 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| surface mount | YES | YES | YES | YES | NO | NO | YES | NO | NO | NO |
| technology | CMOS | BIPOLAR | CMOS | BIPOLAR | BIPOLAR | BIPOLAR | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maker | Maxim | - | - | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim | Maxim |
| Parts packaging code | SOIC | - | SOIC | - | - | - | SOIC | DIP | DIP | DIP |
| package instruction | 0.300 INCH, SOIC-16 | - | 0.300 INCH, SOIC-16 | - | - | - | 0.300 INCH, SOIC-24 | PLASTIC, DIP-24 | PLASTIC, DIP-24 | CERDIP-24 |
| Contacts | 16 | - | 16 | - | - | - | 24 | 24 | 24 | 24 |
| ECCN code | EAR99 | - | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 | EAR99 |
| Adjustable threshold | NO | - | NO | - | - | - | NO | NO | NO | NO |
| Analog Integrated Circuits - Other Types | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | - | - | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| Number of functions | 1 | - | 1 | - | - | - | 1 | 1 | 1 | 1 |
| Peak Reflow Temperature (Celsius) | 245 | - | 245 | - | - | - | 245 | 245 | 245 | 245 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.642 mm | - | 2.642 mm | - | - | - | 2.65 mm | 4.572 mm | 4.572 mm | 5.842 mm |
| Maximum time at peak reflow temperature | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 7.6745 mm | - | 7.6745 mm | - | - | - | 7.5 mm | 7.62 mm | 7.62 mm | 7.62 mm |