5962-8761301DA datasheet, PDF - EEWORLD Datasheet

5962-8761301DA: DescriptionIC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14, Gate; Categorylogic logic; File Size111KB，6 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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5962-8761301DA Overview

IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14, Gate

Parameter Name	Attribute value
package instruction	DFP, FL14,.3
Reach Compliance Code	unknown
series	AC
JESD-30 code	R-GDFP-F14
JESD-609 code	e0
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
MaximumI(ol)	0.012 A
Number of functions	2
Number of entries	4
Number of terminals	14
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Encapsulate equivalent code	FL14,.3
Package shape	RECTANGULAR
Package form	FLATPACK
power supply	3.3/5 V
Prop。Delay @ Nom-Sup	11 ns
propagation delay (tpd)	11 ns
Certification status	Not Qualified
Schmitt trigger	NO
Filter level	MIL-STD-883
Maximum seat height	2.032 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
width	6.2865 mm
Base Number Matches	1

	5962-8761301DA	5962-87613012A	JM38510R75003SD	JM38510R75003BD
Description	IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERAMIC, DFP-14, Gate	IC AC SERIES, DUAL 4-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20, Gate	IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERPACK-14, Gate	IC AC SERIES, DUAL 4-INPUT NAND GATE, CDFP14, CERPACK-14, Gate
package instruction	DFP, FL14,.3	CERAMIC, LCC-20	DFP,	DFP,
Reach Compliance Code	unknown	unknown	unknown	unknown
series	AC	AC	AC	AC
JESD-30 code	R-GDFP-F14	S-CQCC-N20	R-GDFP-F14	R-GDFP-F14
Logic integrated circuit type	NAND GATE	NAND GATE	NAND GATE	NAND GATE
Number of functions	2	2	2	2
Number of entries	4	4	4	4
Number of terminals	14	20	14	14
Maximum operating temperature	125 °C	125 °C	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-55 °C
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DFP	QCCN	DFP	DFP
Package shape	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	CHIP CARRIER	FLATPACK	FLATPACK
propagation delay (tpd)	11 ns	11 ns	10 ns	10 ns
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	2.032 mm	1.905 mm	2.032 mm	2.032 mm
Maximum supply voltage (Vsup)	6 V	6 V	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V	2 V	2 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	MILITARY
Terminal form	FLAT	NO LEAD	FLAT	FLAT
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	DUAL	QUAD	DUAL	DUAL
width	6.2865 mm	8.89 mm	6.2865 mm	6.2865 mm

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