KLM8G2FE3B-B0010 datasheet, PDF

KLM8G2FE3B-B0010: DescriptionFlash Memory Drive, CMOS, PBGA153, 11.50 X 13 MM, 1 MM HEIGHT, FBGA-153; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，37 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/

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KLM8G2FE3B-B0010 Overview

Flash Memory Drive, CMOS, PBGA153, 11.50 X 13 MM, 1 MM HEIGHT, FBGA-153

Parameter Name	Attribute value
Maker	SAMSUNG
package instruction	VFBGA,
Reach Compliance Code	unknown
Other features	ALSO OPERATES AT 2.7 V MIN
External data bus width	8
Maximum host data transfer rate	44 MBps
Host interface standard	USB
JESD-30 code	R-PBGA-B153
length	13 mm
Number of terminals	153
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height	1 mm
Maximum supply voltage	1.95 V
Minimum supply voltage	1.7 V
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
width	11.5 mm
uPs/uCs/peripheral integrated circuit type	SECONDARY STORAGE CONTROLLER, FLASH MEMORY DRIVE
Base Number Matches	1

Rev. 1.0, Oct. 2011

KLMxGxFE3B-x00x

Samsung e·MMC Product family

e.MMC 4.41 Specification compatibility

datasheet

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SPECIFICATIONS WITHOUT NOTICE.

Products and specifications discussed herein are for reference purposes only. All information discussed

herein is provided on an "AS IS" basis, without warranties of any kind.

This document and all information discussed herein remain the sole and exclusive property of Samsung

Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property

right is granted by one party to the other party under this document, by implication, estoppel or other-

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	KLM8G2FE3B-B0010	KLM4G1FE3B-B0010
Description	Flash Memory Drive, CMOS, PBGA153, 11.50 X 13 MM, 1 MM HEIGHT, FBGA-153	Flash Memory Drive, CMOS, PBGA153, 11.50 X 13 MM, 1 MM HEIGHT, FBGA-153
Maker	SAMSUNG	SAMSUNG
package instruction	VFBGA,	VFBGA,
Reach Compliance Code	unknown	compliant
JESD-30 code	R-PBGA-B153	R-PBGA-B153
length	13 mm	13 mm
Number of terminals	153	153
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height	1 mm	1 mm
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	OTHER
Terminal form	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM
width	11.5 mm	11.5 mm
Base Number Matches	1	1

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