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MT8JSF12864HY-80CXX

Description
DDR DRAM Module, 128MX64, CMOS, LEAD FREE, SODIMM-204
Categorystorage    storage   
File Size626KB,19 Pages
ManufacturerMicron Technology
Websitehttp://www.mdtic.com.tw/
Environmental Compliance  
Download Datasheet Parametric View All

MT8JSF12864HY-80CXX Overview

DDR DRAM Module, 128MX64, CMOS, LEAD FREE, SODIMM-204

MT8JSF12864HY-80CXX Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicron Technology
Parts packaging codeSODIMM
package instructionLEAD FREE, SODIMM-204
Contacts204
Reach Compliance Codecompliant
ECCN codeEAR99
access modeSINGLE BANK PAGE BURST
Other featuresSELF CONTAINED REFRESH
JESD-30 codeR-XZMA-N204
JESD-609 codee4
memory density8589934592 bit
Memory IC TypeDDR DRAM MODULE
memory width64
Number of functions1
Number of ports1
Number of terminals204
word count134217728 words
character code128000000
Operating modeSYNCHRONOUS
Maximum operating temperature70 °C
Minimum operating temperature
organize128MX64
Package body materialUNSPECIFIED
encapsulated codeDIMM
Package shapeRECTANGULAR
Package formMICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
self refreshYES
Maximum supply voltage (Vsup)1.575 V
Minimum supply voltage (Vsup)1.425 V
Nominal supply voltage (Vsup)1.5 V
surface mountNO
technologyCMOS
Temperature levelCOMMERCIAL
Terminal surfaceGold (Au)
Terminal formNO LEAD
Terminal locationZIG-ZAG
Maximum time at peak reflow temperature30
1GB, 2GB (x64, SR) 204-Pin DDR3 SDRAM SODIMM
Features
DDR3 SDRAM SODIMM
MT8JSF12864H – 1GB
MT8JSF25664H – 2GB
For component data sheets, refer to Micron’s Web site:
www.micron.com
Features
• DDR3 functionality and operations supported as per
the component data sheet
• 204-pin, small-outline dual in-line memory module
(SODIMM)
• Fast data transfer rates: PC3-10600, PC3-8500,
or PC3-6400
• 1GB (128 Meg x 64) and 2GB (256 Meg x 64)
• V
DD
= 1.5V ±0.075V
• V
DDSPD
= +3.0V to +3.6V
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Single rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 8 internal device banks
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Pb-free
• Fly-by topology
• Terminated control, command, and address bus
Figure 1:
204-Pin SODIMM (MO-268 R/C B)
PCB height: 30.0mm (1.18in)
Options
Commercial (0°C
T
A
+70°C)
Industrial (–40°C
T
A
+85°C)
• Package
204-pin DIMM
• Frequency/CAS latency
1.5ns @ CL = 8 (DDR3-1333)
1.5ns @ CL = 9 (DDR3-1333)
1.5ns @ CL = 10 (DDR3-1333)
2
1.87ns @ CL = 7 (DDR3-1066)
1.87ns @ CL = 8 (DDR3-1066)
2
2.5ns @ CL = 5 (DDR3-800)
2
2.5ns @ CL = 6 (DDR3-800)
2
Operating temperature
1
Marking
None
I
Y
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Notes: 1. Contact Micron for industrial temperature
module offerings.
2. Not recommended for new designs.
Table 1:
Speed
Grade
-1G5
-1G4
-1G3
-1G1
-1G0
-80C
-80B
Key Timing Parameters
Industry
Nomenclature
PC3-10600
PC3-10600
PC3-10600
PC3-8500
PC3-8500
PC3-6400
PC3-6400
Data Rate (MT/s)
CL = 10
1333
1333
1333
CL = 9
1333
1333
CL = 8
1333
1066
1066
1066
1066
CL = 7
1066
1066
1066
CL = 6
800
800
800
800
800
800
800
CL = 5
800
800
t
RCD
t
RP
t
RC
(ns)
12
13.5
15
13.125
15
12.5
15
(ns)
12
13.5
15
13.125
15
12.5
15
(ns)
48
49.5
51
50.625
52.5
50
52.5
PDF: 09005aef82b36df5/Source: 09005aef82b36dc2
JSF8C128_256x6HY.fm - Rev. B 3/08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2007 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
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