EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

74F352PC

Description
多路复用器 2 x 4:1 16-PDIP
Categorylogic    Signal switch, multiplexer, decoder   
File Size50KB,5 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Download Datasheet Parametric View All

74F352PC Online Shopping

Suppliers Part Number Price MOQ In stock  
74F352PC - - View Buy Now

74F352PC Overview

多路复用器 2 x 4:1 16-PDIP

74F352PC Parametric

Parameter NameAttribute value
category
MakerON Semiconductor
series74F
PackagePipe fittings
typemultiplexer
circuit2 x 4:1
Current - Output High, Low1mA,20mA
供电电压源single power supply
Voltage - Power supply4.5V ~ 5.5V
Operating temperature0°C ~ 70°C
Installation typeThrough hole
Package/casing16-DIP(0.300",7.62mm)
Supplier device packaging16-PDIP
independent circuit1
Basic product number74F352
Flybuck solution - multi-channel isolated output power supply derived from buck converter
[font=微软雅黑][size=4]{:1_94:} [color=#ff0000]【New course online! 】[/color] [/size][/font] [font=微软雅黑][size=4] [/size][/font] [font=微软雅黑][size=4]Da Xue Tang has launched a new power supply course, [color...
linjiang Analogue and Mixed Signal
Every father has a goal.
[font=微软雅黑][size=3]Every father has a goal - to marry a beautiful wife, give birth to a lovely daughter, and then make money to let them wear all kinds of beautiful clothes, while he smiles foolishly ...
幸福的娃 Talking
Programming Embedded System II Keil 8051
Programming Embedded System II Keil 8051 English original...
lydemon 51mcu
FPGA controls AD9280 to collect voltage and sends it to PC via serial port
I want to use FPGA to control the matching AD module (AD9280) to collect voltage and send it to the PC through the serial port. I have no idea yet. Is there any relevant information that can be shared...
嘀哩嘀哩 FPGA/CPLD
C language algorithm 27-37
[align=left][font=宋体]【Program[/font]27[font=宋体]】 [/font] [font=宋体]Title: Use recursive function calling to print the 5 input characters in reverse order. [/font] 1.[font=宋体]Program analysis: [/font] 2...
jingcheng Linux and Android
Introduction to chip packaging knowledge
[i=s]This post was last edited by paulhyde on 2014-9-15 09:09[/i]1. BGA (ball grid array) is a type of surface mount package. Ball bumps are made on the back of the printed circuit board in an array t...
open82977352 Electronics Design Contest

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 452  283  80  450  149  10  6  2  3  48 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号