Chip On Board Mixer Quads
Features
s
High Volume Automatic Assembly
s
For Microwave MIC Assembly and
Automated High Volume Manufacturing
s
Mechanically Rugged Design
s
100% DC Tested
s
Three Barrier Heights for Customized
Mixer Performance
Description
Alpha’s ceramic Chip on Board (COB) mixer quads are
designed for high performance RF and microwave receiver
applications. These devices utilize Alpha’s advanced
silicon beamless Schottky technology, combined with
precision ceramic COB assembly techniques, to achieve
a high degree of device reliability in commercial
applications. Performance to 10 GHz is available with the
ring quads in the 106 package, which employs via hole
technology resulting in metalized contacts on the bottom
side and eliminating the need for wire bonds to topside
contacts.
Absolute Maximum Ratings
Characteristic
Maximum Current (I
MAX
)
Power Dissipation (P
D
) CW
Storage Temperature (T
ST
)
Operating Temperature (T
OP
)
ESD Human Body Model
Value
50 mA
75 mW/Junction
-65°C to +175°C
-65°C to +150°C
Class 1B
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 6/99A
1
Chip On Board Mixer Quads
Electrical Specifications at 25°C
Part Number
Barrier
V
F
@ 1 mA
(mV)
Min.
Ring Quad (to 6 GHz)
DMF3926-101
DME3927-101
DMJ3928-101
Ring Quad (to 10 GHz)
DMF3948-106
DME3949-106
DMJ3950-106
Low
Medium
High
250
350
575
310
450
675
15
15
15
0.05
0.05
0.05
0.15
0.15
0.15
0.07
0.07
0.07
15
15
15
106
106
106
Low
Medium
High
200
300
525
260
400
625
15
15
15
0.3
0.3
0.3
0.5
0.5
0.5
0.07
0.07
0.07
8
8
8
101
101
101
Max.
∆
(∆) V
F
@ 1 mA
1
(mV)
Max.
C
J
@ 0 V
(pF)
Min.
Max.
∆
(∆) C
T
@ 0 V
2
(pF)
Max.
R
T
@ 10 mA
Ω
(Ω)
Max.
Outline
Drawing
Crossover Ring Quad (to 6 GHz)
DMF3926-100
DME3927-100
DMJ3928-100
Low
Medium
High
200
300
525
260
400
625
15
15
15
0.3
0.3
0.3
0.5
0.5
0.5
0.07
0.07
0.07
8
8
8
100
100
100
Back-to-Back Crossover Quad (to 6 GHz)
DMF3945-103
DME3946-103
DMJ3947-103
Low
Medium
High
200
300
525
260
400
625
15
15
15
0.3
0.3
0.3
C
J
@ 0 V
(pF)
Min.
Max.
0.5
0.5
0.5
∆
(∆) C
T
@ 0 V
2
(pF)
Max.
0.07
0.07
0.07
R
T
@ 10 mA
Ω
(Ω)
Max.
8
8
8
V
B
@ 10
µ
A
(V)
Min.
103
103
103
Part Number
Barrier
V
F
@ 1 mA
(mV)
Min.
Max.
∆
(∆) V
F
@
1 mA
1
(mV)
Max.
Outline
Drawing
Bridge Quad (to 6 GHz)
DMF3929-102
DME3930-102
Low
Medium
200
300
260
400
15
15
0.3
0.3
0.3
0.5
0.5
0.5
0.07
0.07
0.07
8
8
8
2
3
4
102
102
102
DMJ3931-102
High
525
625
15
1. Forward voltage difference between package electrodes.
2. Capacitance difference between package electrodes.
SPICE Model Parameters (Per Junction)
Parameter
IS
R
S
N
TT
C
J0
M
E
G
XTI
F
C
B
V
I
BV
V
J
V
A
V
eV
s
pF
Unit
A
Ω
DMF3926
DMF3929
DMF3945
2.5E–07
4
1.04
1E–11
0.42
0.32
0.69
2
0.5
2
1.0E–05
0.495
DME3927
DME3930
DME3946
1.3E–09
4
1.04
1E–11
0.39
0.37
0.69
2
0.5
3
1.0E–05
0.595
DMJ3928
DMJ3931
DMJ3947
9.0E–13
4
1.04
1E–11
0.39
0.42
0.69
2
0.5
4
1.0E–05
0.800
DMF3948
4.4E–08
9
1.04
1E–11
0.11
0.32
0.69
2
0.5
3
1.0E–05
0.495
DME3949
9.3E–10
9
1.04
1E–11
0.10
0.37
0.69
2
0.5
4
1.0E–05
0.595
DMJ3950
3.3E–13
9
1.04
1E–11
0.10
0.42
0.69
2
0.5
5
1.0E–05
0.800
2
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 6/99A
Chip On Board Mixer Quads
100, 101, 102
0.005 (0.13 mm)
0.001 (0.02 mm) TYP.
INK DOT 0.010 (0.25 mm) DIA. MIN.
COLOR PER INTERNAL SPECIFICATION
103
ORIENTATION
DOT
0.020
(0.51 mm)
±0.003
(0.08 mm)
0.140 (3.56 mm)
± 0.003 (0.08 mm)
SCHEMATIC
2
DOT
1
0.026
(0.66 mm) MIN.
()
GLASS DAM
0.120 (3.05 mm)
+0.002 (0.05 mm)
-0.004 (0.10 mm)
0.020 (0.51 mm)
X 0.010 (0.25 mm)
ORIENTATION MARK
0.050
(1.27 mm)
MAX.
0.025 (0.64 mm)
±0.003 (0.08 mm)
6
5
0.130 (3.30 mm)
±0.003 (0.08 mm)
3
4
0.100 (2.54 mm)
+0.002 (0.05 mm)
-0.004 (0.10 mm)
0.030 (0.76 mm)
±0.003 (0.08 mm)
SQ.
EPOXY ENCAPSULATION
(BLACK)
0.040
(1.02 mm)
MAX.
0.020 (0.51 mm)
± 0.002 (0.05 mm)
0.020 (0.51 mm)
±0.002 (0.05 mm)
GLASS NOT
SHOWN FOR CLARITY
106
0.085 (2.159 mm) SQ.
CERAMIC SUBSTRATE
Notes:
1. Bottom side is free of metalization.
2. The minimum specified area of the contact pads (0.017 x 0.022) shall
be free of epoxy.
EPOXY
ENCAPSULATION
0.003
(0.08 mm) TYP.
EPOXY
ENCAPSULATION
0.015
(0.38 mm)
0.003
(0.08 mm)
TYP
45˚ REF.
0.017
(0.43 mm)
0.020 (0.51 mm) MAX.
GLASS
0.026
(0.66 mm)
0.024
(0.61 mm)
GOLD METALIZATION
Pd/Pt /Ag METALIZATION
Alpha Industries, Inc.
[781] 935-5150
•
Fax
[617] 824-4579
•
Email
sales@alphaind.com
•
www.alphaind.com
Specifications subject to change without notice. 6/99A
3
Embedded System
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