| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Parts packaging code | BGA |
| package instruction | FBGA, BGA532,26X26,32 |
| Contacts | 532 |
| Reach Compliance Code | unknown |
| ECCN code | 3A001.A.3 |
| Is Samacsys | N |
| Other features | ALSO REQUIRES 3.3V SUPPLY |
| Address bus width | 23 |
| barrel shifter | NO |
| bit size | 32 |
| boundary scan | YES |
| maximum clock frequency | 75 MHz |
| External data bus width | 64 |
| Format | FIXED POINT |
| Internal bus architecture | MULTIPLE |
| JESD-30 code | S-PBGA-B532 |
| length | 23 mm |
| low power mode | YES |
| Number of terminals | 532 |
| Maximum operating temperature | 90 °C |
| Minimum operating temperature | |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FBGA |
| Encapsulate equivalent code | BGA532,26X26,32 |
| Package shape | SQUARE |
| Package form | GRID ARRAY, FINE PITCH |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 1.2,3.3 V |
| Certification status | Not Qualified |
| RAM (number of words) | 16384 |
| Maximum seat height | 3.25 mm |
| Maximum supply voltage | 1.16 V |
| Minimum supply voltage | 1.05 V |
| Nominal supply voltage | 1.1 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | OTHER |
| Terminal form | BALL |
| Terminal pitch | 0.8 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 23 mm |
| uPs/uCs/peripheral integrated circuit type | DIGITAL SIGNAL PROCESSOR, OTHER |
| Base Number Matches | 1 |
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