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AGL030V2-QNG132

Description
fpga - field programmable gate array 30k system gates
CategoryProgrammable logic devices    Programmable logic   
File Size7MB,236 Pages
ManufacturerActel
Websitehttp://www.actel.com/
Environmental Compliance
Download Datasheet Parametric View All

AGL030V2-QNG132 Overview

fpga - field programmable gate array 30k system gates

AGL030V2-QNG132 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerActel
package instruction8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, HALOGEN FREE AND ROHS COMPLIANT, QFN-132
Reach Compliance Codecompliant
maximum clock frequency108 MHz
JESD-30 codeS-XBCC-B132
JESD-609 codee3
length8 mm
Configurable number of logic blocks768
Equivalent number of gates30000
Number of entries81
Number of logical units768
Output times81
Number of terminals132
Maximum operating temperature70 °C
Minimum operating temperature
organize768 CLBS, 30000 GATES
Package body materialUNSPECIFIED
encapsulated codeHVBCC
Encapsulate equivalent codeLGA132(UNSPEC)
Package shapeSQUARE
Package formCHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply1.2/1.5 V
Programmable logic typeFIELD PROGRAMMABLE GATE ARRAY
Certification statusNot Qualified
Maximum seat height0.8 mm
Maximum supply voltage1.575 V
Minimum supply voltage1.14 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formBUTT
Terminal pitch0.5 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width8 mm
Revision 18
IGLOO Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
1.2 V to 1.5 V Core Voltage Support for Low Power
Supports Single-Voltage System Operation
5 µW Power Consumption in Flash*Freeze Mode
Low Power Active FPGA Operation
Flash*Freeze
Technology
Enables
Ultra-Low
Power
Consumption while Maintaining FPGA Content
• Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
®
High Capacity
• 15 k to 1 Million System Gates
• Up to 144 kbits of True Dual-Port SRAM
• Up to 300 User I/Os
Reprogrammable Flash Technology
130-nm, 7-Layer Metal, Flash-Based CMOS Process
Live-at-Power-Up (LAPU) Level 0 Support
Single-Chip Solution
Retains Programmed Design When Powered Off
250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
Clock Conditioning Circuit (CCC) and PLL
• 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended
I/O
Standards:
LVTTL,
LVCMOS
3.3 V / 2.5 V / 1.8 V / 1.5 V / 1.2 V, 3.3 V PCI / 3.3 V PCI-X
,
and LVCMOS 2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and M-
LVDS (AGL250 and above)
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold-Sparing I/Os
• Programmable Output Slew Rate
and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the IGLOO Family
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase Shift, Multiply/Divide, Delay Capabilities,
and External Feedback
• Wide Input Frequency Range (1.5 MHz up to 250 MHz)
In-System Programming (ISP) and Security
• Secure ISP Using On-Chip 128-Bit Advanced Encryption
Standard (AES) Decryption (except ARM
®
-enabled IGLOO
®
devices) via JTAG (IEEE 1532–compliant)
• FlashLock
®
to Secure FPGA Contents
Embedded Memory
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit
RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)
• True Dual-Port SRAM (except ×18)
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
ARM Processor Support in IGLOO FPGAs
• M1 IGLOO Devices—Cortex™-M1 Soft Processor Available
with or without Debug
AGL250
M1AGL250
250 k
2,048
6,144
24
36
8
1k
Yes
1
18
4
143
CS196
,4
QN132
4,5
VQ100
FG144
FG144, FG256, FG144, FG256, FG144, FG256,
FG484
FG484
FG484
Advanced I/O
• 700 Mbps DDR, LVDS-Capable I/Os (AGL250 and above)
IGLOO Devices
AGL015
AGL030
AGL060 AGL125
ARM-Enabled IGLOO Devices
System Gates
15 k
30 k
60 k
125 k
Typical Equivalent Macrocells
128
256
512
1,024
VersaTiles (D-flip-flops)
384
768
1,536
3,072
Flash*Freeze Mode (typical, µW)
5
5
10
16
RAM kbits (1,024 bits)
18
36
4,608-Bit Blocks
4
8
FlashROM Bits
1k
1k
1k
1k
1
Secure (AES) ISP
Yes
Yes
2
Integrated PLL in CCCs
1
1
3
VersaNet Globals
6
6
18
18
I/O Banks
2
2
2
2
Maximum User I/Os
49
81
96
133
Package Pins
UC/CS
UC81
CS121
CS196
CS81
QFN
QN68 QN48, QN68, QN132
QN132
QN132
VQFP
VQ100
VQ100
VQ100
FBGA
FG144
5
FG144
Notes:
1.
2.
3.
4.
5.
6.
AGL400
400 k
9,216
32
54
12
1k
Yes
1
18
4
194
CS196
AGL600
M1AGL600
600 k
13,824
36
108
24
1k
Yes
1
18
4
235
CS281
AGL1000
M1AGL1000
1M
24,576
53
144
32
1k
Yes
1
18
4
300
CS281
AES is not available for ARM-enabled IGLOO devices.
AGL060 in CS121 does not support the PLL.
Six chip (main) and twelve quadrant global networks are available for AGL060 and above.
The M1AGL250 device does not support this package.
Device/package support TBD
The
IGLOOe
datasheet and
IGLOOe FPGA Fabric User’s Guide
provide information on higher densities and additional features.
† AGL015 and AGL030 devices do not support this feature.
November 2009
© 2010 Actel Corporation
‡ Supported only by AGL015 and AGL030 devices.
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