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SMDND02330TA00MQ00

Description
Film Capacitors SMD-PEN 0.033 F 100 VDC 7.2x6.1x3 SC2824
CategoryPassive components   
File Size170KB,7 Pages
ManufacturerWIMA
Websitehttps://www.wima.de/
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SMDND02330TA00MQ00 Overview

Film Capacitors SMD-PEN 0.033 F 100 VDC 7.2x6.1x3 SC2824

SMDND02330TA00MQ00 Parametric

Parameter NameAttribute value
Product CategoryFilm Capacitors
ManufacturerWIMA
Capacitance0.033 uF
Voltage Rating DC100 VDC
Tolerance20 %
Length3 mm
Width7.2 mm
Height6.1 mm
Capacitance - nF33 nF
Capacitance - pF33000 pF
WIMA SMD-PEN
Metallized Polyethylene-Naphthalate (PEN) SMD Film Capacitors with
Box Encapsulation. Capacitances from 0.01
mF
to 1.0
mF.
Rated Voltages from 63 VDC to 400 VDC. Size Codes from 1812 to 2824.
Special Features
˜
Size codes 1812, 2220 and 2824,
with PEN and encapsulated
˜
Operating temperature up to 125° C
˜
Self-healing
˜
Suitable for lead-free soldering
˜
According to RoHS 2011/65/EU
D
Electrical Data
Capacitance range:
0.01
mF
to 1.0
mF
Rated voltages:
63 VDC, 100 VDC, 250 VDC, 400 VDC
Capacitance tolerances:
±20%, ±10% (±5% available subject
to special enquiry)
Operating temperature range:
–55+ C to +125+ C
Climatic test category:
55/125/21 according to IEC
Insulation resistance
at +20+ C:
U
r
U
test
C
0.33
mF
3.75 x 10
3
(mean value: 1 x 10
4
M¸)
1 x 10
4
(mean value: 5 x 10
4
M¸)
63 VDC 50 V
100 VDC 100 V
250 VDC 100 V
Test voltage:
1.6 U
r
, 2 sec.
Voltage derating:
A voltage derating factor of 1.25 % per K
must be applied from +100) C for DC
voltages and from +90) C for AC
voltages
Reliability:
Operational life
300 000 hours
Failure rate
2 fit (0.5 x U
r
and 40+ C)
Typical Applications
For general DC-applications e.g.
˜
By-pass
˜
Blocking
˜
Coupling and decoupling
˜
Timing
0.33
mF
< C
1.0
mF
1250 sec (M¸ x
mF)
(mean value: 3000 sec)
3000 sec (M¸ x
mF)
(mean value: 10 000 sec)
Construction
Dielectric:
Polyethylene-Naphthalate (PEN) film
Capacitor electrodes:
Vacuum-deposited
Internal construction:
Measuring time: 1 min.
Dissipation factors
at +20) C: tan
d
at f
1 kHz
10 kHz
100 kHz
C
0.1
mF
8 x 10
-3
15 x 10
-3
30 x 10
-3
0.1
mF
< C
1.0
mF
8 x 10
-3
15 x 10
-3
Pulse rise time V/
m
sec
max. operation/test
100 VDC
250 VDC
35/350
20/200
10/100
6/60
4/40
40/400
40/400
12/120
Plastic film
Vacuum-deposited
electrode
Metal contact layer
(schoopage)
Terminating plate
Maximum pulse rise time:
for pulses equal to the rated voltage
Capacitance
m
F
0.01
0.033
0.1
0.33
1.0
...
...
...
...
0.022
0.068
0.22
0.68
63 VDC
30/300
20/200
10/100
8/80
3,5/35
400 VDC
35/350
21/210
Encapsulation:
Solvent-resistant, flame-retardant plastic
case, UL 94 V-0
Terminations:
Tinned plates.
Marking:
Colour: Black.
Dip Solder Test/Processing
Resistance to soldering heat:
Test Tb in accordance with DIN IEC
60068-2-58/DIN EN 60384-23.
Soldering bath temperature max. 260+ C.
Soldering duration max. 5 sec.
Change in capacitance
D
C/C
5 %.
Soldering process:
Re-flow soldering (see temperature/time
graphs page 13).
Packing
Available taped and reeled in blister pack.
Detailed taping information and graphs
at the end of the catalogue.
For further details and graphs please
refer to Technical Information.
20
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