Features
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Sensitive Layer Over a 0.8 µm CMOS Array
Image Zone: 0.4 x 14 mm = 0.02" x 0.55"
Image Array: 8 x 280 = 2240 pixels
Pixel Pitch: 50 µm x 50 µm = 500 dpi
Pixel Clock: up to 2 MHz Enabling up to 1780 Frames per Second
Die Size: 1.7 x 17.3 mm
Operating Voltage: 3 V to 5.5 V
Naturally Protected Against ESD: > 16 kV Air Discharge
Power Consumption: 20 mW at 3.3 V, 1 MHz, 25°C
Operating Temperature Range: -40°C to +85°C
Resistant to Abrasion: >1 Million Finger Sweeps
Chip-on-Board (COB), Chip-on-Board (COB) with Connector, or 20-lead Ceramic DIP
Available for Development, with Specific Protective Layer
Applications
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PDA (Access Control, Data Protection)
Cellular Phones, SmartPhones (Access e-business)
Notebook, PC-add on (Access Control, e-business)
PIN Code Replacement
Automated Teller Machines, POS
Building Access
Electronic Keys (Cars, Home,...)
Portable Fingerprint Imaging for Law Enforcement
TV Access
Figure 1.
FingerChip
™
Packages
Thermal
Fingerprint
Sensor with
0.4 mm x 14 mm
(0.02" x 0.55")
Sensing Area
and
Digital Output
(On-chip ADC)
AT77C101B
FingerChip
™
Chip-on-Board Package
with connector
Chip-on-Board Package
(COB)
Sweep your finger
to make life easier
Actual size
Rev. 2150B–BIOM–09/03
1
Table 1.
Pin Description for Chip-on-Board Package: AT77C101B-CB01Ι
Pin Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Name
GND
AVE
AVO
TPP
TPE
VCC
GND
RST
PCLK
OE
ACKN
De0
Do0
De1
Do1
De2
Do2
De3
Do3
FPL
GND
Type
GND
Analog output
Analog output
Power
Digital input
Power
GND
Digital input
Digital input
Digital input
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
GND
GND
The die attach is connected to pins 1, 7 and 21, and must be grounded. The FPL pin
must be grounded.
GND
AVE
AVO
TPP
TPE
VCC
GND
RST
PCLK
OE
ACKN
De0
Do0
De1
Do1
De2
Do2
De3
Do3
FPL
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
GND
21
2
AT77C101B FingerChip
™
2150B–BIOM–09/03
AT77C101B FingerChip
™
Table 2.
Pin Description for COB with Connector Package: AT77C101B-CB02Ι
(1)
Pin Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
Note:
Name
FPL
Not connected
Not connected
DE3
DO3
DE2
DO2
DE1
DO1
DE0
DO0
AVE
AVO
TPP
TPE
VCC
GND
RST
PCLK
OE
ACKN
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Digital output
Analog output
Analog output
Power
Digital input
Power
GND
Digital input
Digital input
Digital input
Digital output
Type
GND
1. Ref Connector: FH18-21S-0.3SHW (HIROSE).
3
2150B–BIOM–09/03
Figure 2.
COB with Flex
(1)
Flex with metallizations up
Flex with metallizations down
Figure 3.
Flex Output Side
Flex Output
(FingerChip Connector Side)
Metallizations Up
3
1
2
Note:
1. Flex is not provided by ATMEL.
4
AT77C101B FingerChip
™
2150B–BIOM–09/03
AT77C101B FingerChip
™
Description
The AT77C101B is part of the Atmel FingerChip monolithic fingerprint sensor family for
which no optics, no prism and no light source are required.
The AT77C101B is a single-chip, high-performance, low-cost sensor based on tempera-
ture physical effects for fingerprint sensing.
The AT77C101B has a linear shape, which captures a fingerprint image by sweeping
the finger across the sensing area. After capturing several images, Atmel proprietary
software can reconstruct a full 8-bit fingerprint image.
The AT77C101B has a small surface combined with CMOS technology, and a Chip-on-
Board package assembly. These facts contribute to a low-cost device.
The device delivers a programmable number of images per second, while an integrated
analog-to-digital converter delivers a digital signal adapted to interfaces such as an EPP
parallel port, a USB microcontroller or directly to microprocessors. No frame grabber or
glue interface is therefore necessary to send the frames. These facts make AT77C101B
an easy device to include in any system for identification or verification applications.
Table 1.
Absolute Maximum Ratings
(1)
Parameter
Positive supply voltage
Temperature stabilization power
Front plane
Digital input voltage
Storage temperature
Symbol
V
CC
TPP
FPL
RST PCLK
T
stg
Comments
Value
GND to 6.5
GND to 6.5
GND to V
CC
GND to V
CC
-50 to +95
Unit
V
V
V
V
°C
Do not solder
Forbidden
°C
Lead temperature (soldering, 10 seconds)
T
leads
Note:
1. Absolute maximum ratings are limiting values, to be applied individually, while other parameters are within specified operat-
ing conditions. Long exposure to maximum ratings may affect device reliability.
Table 2.
Recommended Conditions Of Use
Parameter
Positive supply voltage
Front plane
Digital input voltage
Digital output voltage
Digital load
Analog load
Operating temperature range
Maximum current on TPP
C
L
C
A
R
A
T
amb
ITPP
Not connected
I grade
0
-40°C to +85°C
100
Symbol
V
CC
FPL
Must be grounded
Comments
Min
3V
Typ
5V
GND
CMOS levels
CMOS levels
50
Max
5.5 V
Unit
V
V
V
V
pF
pF
kΩ
°C
mA
5
2150B–BIOM–09/03
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