current feedback video operational amplifier featuring
high slew rate and low differential gain/phase error.
The current feedback design allows for superior large
signal bandwidth, even at high gains. The low differ-
ential gain/phase errors, wide bandwidth and low
quiescent current make the OPA4658 a perfect choice
for numerous video, imaging and communications
applications.
The OPA4658 is internally compensated for stability in
gains of 2 or greater. The OPA4658 is also available in
dual (OPA2658) and single (OPA658) configurations.
+V
S
Current Mirror
I
BIAS
V
+
V
–
C
COMP
Buffer
V
OUT
I
BIAS
Current Mirror
–V
S
NOTE: Diagram reflects only one-fourth of the OPA4658.
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
NOTES: (1) An asterisk (T) specifies the same value as the grade to the left. (2) Bandwidth can be affected by a non-optimal PC board layout. Refer to the
demonstration board layout for details. (3) Slew rate is rate of change from 10% to 90% of output voltage step.
NOTE: (1) Packages must be derated based on specified
θ
JA
. Maximum
T
J
must be observed.
PACKAGE INFORMATION
PRODUCT
OPA4658P
OPA4658U, UB
PACKAGE
14-Pin Plastic DIP
SO-14 Surface Mount
PACKAGE DRAWING
NUMBER
(1)
010
235
NOTE: (1) For detailed drawing and dimension table, please see end of data
sheet, or Appendix C of Burr-Brown IC Data Book.
ORDERING INFORMATION
(1)
PRODUCT
PACKAGE
14-Pin Plastic DIP
SO-14 Surface Mount
TEMPERATURE RANGE
–40°C to +85°C
–40°C to +85°C
PIN CONFIGURATION
Top View
DIP/SO-14
OPA4658P
OPA4658U, UB
NOTE: (1) The "B" grade of the SOIC package will be marked with a "B" by pin 8.
Refer to mechanical section for the location.
Output 1
–Input 1
+Input 1
+V
S
+Input 2
–Input 2
Output 2
1
2
3
4
5
6
7
14
13
12
11
10
9
8
Output 4
–Input 4
+Input 4
–V
S
+Input 3
–Input 3
Output 3
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation
to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric
changes could cause the device not to meet its published
specifications.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes
no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change
without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant
any BURR-BROWN product for use in life support devices and/or systems.
京公网安备 11010802033920号
EEWORLD
