S70GL02GS
2 Gbit (256 MBytes), 3.0 V Flash Memory
General Description
The Cypress S70GL02GS 2-Gigabit MirrorBit
®
Flash memory device is fabricated on 65 nm MirrorBit Eclipse process technology. This
device offers a fast page access time of 25 ns with a corresponding random access time of 110 ns. It features a Write Buffer that
allows a maximum of 256 words/512 bytes to be programmed in one operation, resulting in faster effective programming time than
standard single byte/word programming algorithms. This makes the device an ideal product for today’s embedded applications that
require higher density, better performance and lower power consumption.
This document contains information for the S70GL02GS device, which is a dual die stack of two S29GL01GS die. For detailed
specifications, please refer to the discrete die datasheet.
Document
S29GL01GS Datasheet
Cypress Document Number
001-98285
Distinctive Characteristics
CMOS 3.0 Volt Core with Versatile I/O™
Two 1024 Megabit (S29GL01GS) in a single 64-ball
Fortified-BGA package (see
S29GL01GS datasheet
for full
specifications)
65 nm MirrorBit Eclipse™ process technology
Single supply (V
CC
) for read / program / erase (2.7V to 3.6V)
Versatile I/O Feature
– Wide I/O voltage (VIO): 1.65V to V
CC
x16 data bus
16-word/32-byte page read buffer
512-byte Programming Buffer
– Programming in Page multiples, up to a maximum of 512
bytes
Sector Erase
– Uniform 128-Kbytes sectors
– S70GL02GS: two thousand forty-eight sectors
Suspend and Resume commands for Program and Erase
operations
Status Register, Data Polling, and Ready/Busy pin methods
to determine device status
Advanced Sector Protection (ASP)
– Volatile and non-volatile protection methods for each
sector
Separate 1024-bye One Time Program (OTP) array with two
lockable regions
– Available in each device Support for CFI (Common Flash
Interface)
WP# input
– Protects first or last sector, or first and last sectors of each
device, regardless of sector protection settings
Industrial temperature range (
–
40°C to +85°C)
Automotive AEC-Q100 Grade 3 (
–
40°C to +85°C)
Automotive AEC-Q100 Grade 2 (
–
40°C to +105°C)
100,000 erase cycles per sector typical
20-year data retention typical
Packaging Options
– 64-ball LSH Fortified BGA, 13 mm
11 mm
Cypress Semiconductor Corporation
Document Number: 001-98296 Rev. *J
•
198 Champion Court
•
San Jose
,
CA 95134-1709
•
408-943-2600
Revised August 09, 2017
S70GL02GS
Performance Characteristics
Max. Read Access Times (ns)
(Note 1)
Parameter
Random Access Time (t
ACC
)
Page Access Time (t
PACC
)
CE# Access Time (t
CE
)
OE# Access Time (t
OE
)
110
20
110
25
2 Gb
120
30
120
35
Program
Erase
Standby
Maximum Current Consumption
Active Read at 5 MHz, 30 pF
60 mA
100 mA
100 mA
200 µA
Typical Program and Erase Rates
Buffer Programming (512 bytes)
Sector Erase (128 kbytes)
1.5 MB/s
477 kB/s
Notes
1. Access times are dependent on V
IO
operating ranges. See
Ordering Information on page 4
for further details.
2. Contact a sales representative for availability.
Document Number: 001-98296 Rev. *J
Page 2 of 19
S70GL02GS
Contents
1.
2.
3.
Ordering Information
.................................................... 4
1.1 Recommended Combinations ................................ 4
Input/Output Descriptions and Logic Symbol............
6
Block Diagrams.............................................................
7
3.1 Special Handling Instructions for BGA Package .... 9
3.2 LSH064—64 ball Fortified Ball Grid Array,
13 x 11 mm........................................................... 10
Memory Map
................................................................ 11
Second Die Access
..................................................... 11
Autoselect....................................................................
11
7.
8.
9.
10.
DC Characteristics......................................................
12
BGA Package Capacitance
........................................ 13
Device ID and Common Flash Interface
(ID-CFI) ASO Map
........................................................ 13
Document History
....................................................... 18
4.
5.
6.
Sales, Solutions, and Legal Information ........................... 19
Worldwide Sales and Design Support ............................ 19
Products ......................................................................... 19
PSoC® Solutions ........................................................... 19
Cypress Developer Community ...................................... 19
Technical Support .......................................................... 19
Document Number: 001-98296 Rev. *J
Page 3 of 19
S70GL02GS
1.
1.1
Ordering Information
Recommended Combinations
Recommended Combinations table below list various configurations planned to be available in volume. The table below will be
updated as new combinations are released. Check with your local sales representative to confirm availability of specific
configuration not listed or to check on newly released combinations.
S29GL-S Valid Combinations
Base OPN
Speed (ns)
Package and
Temperature
Model Number
Packing Type
Ordering Part Number
(yy = Model Number, x = Packing
Type)
S70GL02GS11FHI01x
S70GL02GS11FHI02x
S70GL02GS11FHV01x
S70GL02GS11FHV02x
S70GL02GS12FHIV1x
S70GL02GS12FHIV2x
S70GL02GS12FHVV1x
S70GL02GS12FHVV2x
110
S70GL02GS
120
FHI, FHV
(Note 1)
01, 02
0, 3
(Note 2)
V1, V2
Notes
1. BGA package marking omits leading “S70” and packing type designator from ordering part number.
2. Packing Type “0” is standard option.
The table below lists configurations that are Automotive Grade / AEC-Q100 qualified and are planned to be available in volume. The
table will be updated as new combinations are released. Consult your local sales representative to confirm availability of specific
combinations and to check on newly released combinations.
Production Part Approval Process (PPAP) support is only provided for AEC-Q100 grade products.
Products to be used in end-use applications that require ISO/TS-16949 compliance must be AEC-Q100 grade products in
combination with PPAP. Non–AEC-Q100 grade products are not manufactured or documented in full compliance with
ISO/TS-16949 requirements.
AEC-Q100 grade products are also offered without PPAP support for end-use applications that do not require ISO/TS-16949
compliance.
Valid Combinations — Automotive Grade / AEC-Q100
Base OPN
Speed (ns)
Package and
Temperature
Model Number
Packing Type
Ordering Part Number
(yy = Model Number, x = Packing Type)
S70GL02GS11FHA01x
S70GL02GS11FHA02x
S70GL02GS11FHB01x
S70GL02GS11FHB02x
S70GL02GS12FHAV1x
S70GL02GS12FHAV2x
S70GL02GS12FHBV1x
S70GL02GS12FHBV2x
110
S70GL02GS
120
FHA, FHB
(Note 1)
01, 02
0, 3
(Note 2)
V1, V2
Document Number: 001-98296 Rev. *J
Page 4 of 19
S70GL02GS
The ordering part number is formed by a valid combination of the following:
S70GL02GS
12
F
H
I
01
0
PACKING TYPE
0 = Tray (standard)
3 = 13” Tape and Reel
MODEL NUMBER (V
IO
range, protection when WP# =V
IL
)
01 = V
IO
= V
CC
= 2.7V to 3.6V, highest address sector protected
02 = V
IO
= V
CC
= 2.7V to 3.6V, lowest address sector protected
V1 = V
IO
= 1.65V to V
CC
, V
CC
= 2.7V to 3.6V, highest address sector protected
V2 = V
IO
= 1.65V to V
CC
, V
CC
= 2.7V to 3.6V, lowest address sector protected
TEMPERATURE RANGE
I = Industrial (–40°C to +85°C)
A = Automotive, AEC-Q100 Grade 3 (–40°C to +85°C)
B = Automotive, AEC-Q100 Grade 2 (–40°C to +105°C)
V = Automotive - In Cabin (–40°C to +105°C)
PACKAGE MATERIALS SET
H = Low Halogen, Pb-free
PACKAGE TYPE
F = Fortified Ball Grid Array, 1.0 mm pitch package (LSH064), 11 mm x 13 mm
SPEED OPTION
11 = 110 ns
12 = 120 ns
DEVICE NUMBER/DESCRIPTION
S70GL02GS
3.0 Volt-Only, 2048 Megabit (128M x 16-Bit) Page-Mode Flash Memory
Manufactured on 65 nm MirrorBit Eclipse process technology
Document Number: 001-98296 Rev. *J
Page 5 of 19
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