GBJ10005 - GBJ1010
10A GLASS PASSIVATED BRIDGE RECTIFIER
Features
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Glass Passivated Die Construction
High Case Dielectric Strength of 1500V
RMS
Low Reverse Leakage Current
Surge Overload Rating to 170A Peak
Ideal for Printed Circuit Board Applications
UL Listed Under Recognized Component Index, File Number
E94661
K
Lead Free Finish/RoHS Compliant (Note 4)
A
L
M
GBJ
Dim
A
B
C
D
E
B
Min
29.70
19.70
17.00
3.80
7.30
9.80
2.00
0.90
2.30
4.40
3.40
3.10
2.50
0.60
10.80
Max
30.30
20.30
18.00
4.20
7.70
10.20
2.40
1.10
2.70
4.80
3.80
3.40
2.90
0.80
11.20
G
S
P
C
R
N
Mechanical Data
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Case: GBJ
Case Material: Molded Plastic - UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Plated Leads, Solderable per MIL-STD-202,
Method 208
e
3
Lead Free Plating (Tin Finish).
Polarity: Molded on Body
Mounting: Through Hole for #6 Screw
Mounting Torque: 5.0 in-lbs Maximum
Marking: Type Number
Weight: 6.6 grams (approximate)
_
J
D
H
I
H
I
J
K
L
M
N
P
R
S
3.0 X 45°
G
E
E
All Dimensions in mm
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Rectified Output Current
@ T
C
= 110°C
Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave superimposed on rated load
Forward Voltage per element
Peak Reverse Current
at Rated DC Blocking Voltage
I
2
t Rating for Fusing (t < 8.3ms) (Note 1)
Typical Total Capacitance per Element (Note 2)
Typical Thermal Resistance, Junction to Case (Note 3)
Operating and Storage Temperature Range
Notes:
1.
2.
3.
4.
@ T
A
= 25°C unless otherwise specified
Symbol
V
RRM
V
RWM
V
R
V
R(RMS)
I
O
I
FSM
V
FM
I
R
I
2
t
C
T
R
qJC
T
j
, T
STG
GBJ
10005
50
35
GBJ
1001
100
70
GBJ
1002
200
140
GBJ
1004
400
280
10
170
1.05
10
500
120
55
1.4
-65 to +150
GBJ
1006
600
420
GBJ
1008
800
560
GBJ
1010
1000
700
Unit
V
V
A
A
V
mA
A
2
s
pF
°C/W
°C
@ I
F
= 5.0A
@T
C
= 25°C
@ T
C
= 125°C
Non-repetitive, for t > 1.0ms and < 8.3ms.
Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
Thermal resistance from junction to case per element. Unit mounted on 150 x 150 x 1.6mm copper plate heat sink.
RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see
EU Directive Annex Notes 5 and 7.
DS21218 Rev. 7 - 2
1 of 3
www.diodes.com
GBJ10005-GBJ1010
ã
Diodes Incorporated
10
with heatsink
I
F
, INSTANTANEOUS FORWARD CURRENT (A)
12
10
I
O
, AVERAGE RECTIFIED CURRENT (A)
8
1.0
T
J
= 25
°
C
6
4
2
without heatsink
Resistive or
Inductive load
0.1
0
25
50
75
100
125
150
T
C
, CASE TEMPERATURE (
°
C)
Fig. 1 Forward Current Derating Curve
0.01
0
0.4
0.8
1.2
1.6
1.8
V
F
, INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics (per element)
I
FSM
, PEAK FORWARD SURGE CURRENT (A)
180
Single half-sine-wave
100
T
j
= 25
°
C
f = 1MHz
160
T
J
= 150
°
C
120
C
T
, TOTAL CAPACITANCE (pF)
100
10
80
40
0
1
10
NUMBER OF CYCLES AT 60 Hz
Fig. 3 Maximum Non-Repetitive Surge Current
1
1
10
100
V
R
, REVERSE VOLTAGE (V)
Fig. 4 Typical Total Capacitance, Per Element
1000
T
J
= 150
°
C
100
T
J
= 125
°
C
T
J
= 100
°
C
10
1.0
T
J
= 25
°
C
0.1
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Fig. 5 Typical Reverse Characteristics
DS21218 Rev. 7 - 2
2 of 3
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GBJ10005-GBJ1010
Ordering Information
Device
GBJ10005-F
GBJ1001-F
GBJ1002-F
GBJ1004-F
GBJ1006-F
GBJ1008-F
GBJ1010-F
Notes:
(Note 5)
Packaging
GBJ
GBJ
GBJ
GBJ
GBJ
GBJ
GBJ
Shipping
15/Tube
15/Tube
15/Tube
15/Tube
15/Tube
15/Tube
15/Tube
5. For packaging details, visit our website at http://www.diodes.com/datasheets/ap2008.pdf.
IMPORTANT NOTICE
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further
notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither
does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will
agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the
President of Diodes Incorporated.
DS21218 Rev. 7 - 2
3 of 3
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GBJ10005-GBJ1010
Embedded System
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