MCIMX257DJM4 datasheet, PDF - EEWORLD Datasheet

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MCIMX257DJM4: CategoryThe embedded processor and controller Microcontrollers and processors; File Size2MB，153 Pages; ManufacturerNXP; Websitehttps://www.nxp.com; Environmental Compliance

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MCIMX257DJM4 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	NXP
Parts packaging code	BGA
package instruction	LFBGA, BGA400,20X20,32
Contacts	400
Reach Compliance Code	unknown
ECCN code	5A002
Other features	ALSO REQUIRES 3.3 V I/O SUPPLY
Address bus width	26
bit size	32
boundary scan	YES
Bus compatibility	I2C; USB
maximum clock frequency	24 MHz
External data bus width	16
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B400
length	17 mm
low power mode	YES
Humidity sensitivity level	3
Number of I/O lines	6
Number of terminals	400
Maximum operating temperature	70 °C
Minimum operating temperature	-20 °C
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA400,20X20,32
Package shape	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.2/1.5,1.8/3.3 V
Certification status	Not Qualified
RAM (number of words)	65536
Maximum seat height	1.6 mm
speed	400 MHz
Maximum supply voltage	1.52 V
Minimum supply voltage	1.38 V
Nominal supply voltage	1.45 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	Tin/Silver/Copper - with Nickel barrier
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	17 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR

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Freescale Semiconductor

Data Sheet: Technical Data

Document Number: IMX25CEC

Rev. 10, 07/2013

i.MX25 Applications

Processor for

Consumer and

Industrial Products

Silicon Version 1.2

MCIMX25

Package Information

Plastic package

Case 5284 17 x 17 mm, 0.8 mm Pitch

Case 2107 12 x 12 mm, 0.5 mm Pitch

Introduction

Ordering Information

See

Table 1 on page 3

for ordering information.

The i.MX25 multimedia applications processor has

the right mix of high performance, low power, and

integration to support the growing needs of the

industrial and general embedded markets.

At the core of the i.MX25 is Freescale's fast,

proven, power-efficient implementation of the

ARM® 926EJ-S™ core, with speeds of up to

400 MHz. The i.MX25 includes support for up to

133 MHz DDR2 memory, integrated 10/100

Ethernet MAC, and two on-chip USB PHYs. The

device is suitable for a wide range of applications,

including the following:

• Graphical remote controls

• Human Machine Interface (HMI)

• Residential and commercial control panels

• Residential gateway (smart metering)

• Handheld scanners and printers

• Electronic point-of-sale terminals

• Patient-monitoring devices

1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9

3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11

3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11

3.2. Supply Power-Up/Power-Down Requirements and

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18

3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20

3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20

3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24

3.7. Module Timing and Electrical Parameters . . . . . . 41

4. Package Information and Contact Assignment . . . . . . 124

4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124

4.2. Ground, Power, Sense, and Reference Contact

Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125

4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm

Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127

4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135

4.5. 347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch 138

4.6. Ground, Power, Sense, and Reference Contact

Assignments Case 12x12 mm, 0.5 mm Pitch . . . 139

4.7. Signal Contact Assignments—12 x 12 mm, 0.5 mm

Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140

4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 148

5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

MCIMX257DJM4 Related Products

	MCIMX257DJM4	MCIMX258CJM4
Description
Is it Rohs certified?	conform to	conform to
Parts packaging code	BGA	BGA
package instruction	LFBGA, BGA400,20X20,32	17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
Contacts	400	400
Reach Compliance Code	unknown	unknown
ECCN code	5A002	5A002.A
Other features	ALSO REQUIRES 3.3 V I/O SUPPLY	ALSO REQUIRES 3.3 V I/O SUPPLY
Address bus width	26	26
bit size	32	32
boundary scan	YES	YES
maximum clock frequency	24 MHz	24 MHz
External data bus width	16	16
Format	FIXED POINT	FIXED POINT
Integrated cache	YES	YES
JESD-30 code	S-PBGA-B400	S-PBGA-B400
length	17 mm	17 mm
low power mode	YES	YES
Humidity sensitivity level	3	3
Number of terminals	400	400
Maximum operating temperature	70 °C	85 °C
Minimum operating temperature	-20 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA
Encapsulate equivalent code	BGA400,20X20,32	BGA400,20X20,32
Package shape	SQUARE	SQUARE
Package form	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260	260
power supply	1.2/1.5,1.8/3.3 V	1.2/1.5,1.8/3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	1.6 mm	1.6 mm
speed	400 MHz	400 MHz
Maximum supply voltage	1.52 V	1.52 V
Minimum supply voltage	1.38 V	1.38 V
Nominal supply voltage	1.45 V	1.45 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	OTHER	INDUSTRIAL
Terminal surface	Tin/Silver/Copper - with Nickel barrier	Tin/Silver/Copper - with Nickel barrier
Terminal form	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40
width	17 mm	17 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR	MICROPROCESSOR

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