AC SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| series | AC |
| JESD-30 code | S-CQCC-N20 |
| JESD-609 code | e0 |
| length | 8.89 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | AND GATE |
| MaximumI(ol) | 0.012 A |
| Number of functions | 4 |
| Number of entries | 2 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 12.5 ns |
| propagation delay (tpd) | 12.5 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | MIL-STD-883 Class B |
| Maximum seat height | 1.905 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 8.89 mm |
| Base Number Matches | 1 |
| 54AC08LMQB | 54AC08FMQB | 54AC08DMQB | JM54AC08SDA-FH | |
|---|---|---|---|---|
| Description | AC SERIES, QUAD 2-INPUT AND GATE, CQCC20, CERAMIC, LCC-20 | AC SERIES, QUAD 2-INPUT AND GATE, CDFP14, CERAMIC, FP-14 | AC SERIES, QUAD 2-INPUT AND GATE, CDIP14, CERAMIC, DIP-14 | IC,LOGIC GATE,QUAD 2-INPUT AND,CMOS, RAD HARD,FP,14PIN,CERAMIC |
| package instruction | QCCN, LCC20,.35SQ | DFP, FL14,.3 | DIP, DIP14,.3 | DFP, FL14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| JESD-30 code | S-CQCC-N20 | R-GDFP-F14 | R-GDIP-T14 | R-XDFP-F14 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | AND GATE | AND GATE | AND GATE | AND GATE |
| MaximumI(ol) | 0.012 A | 0.012 A | 0.012 A | 0.012 A |
| Number of terminals | 20 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC |
| encapsulated code | QCCN | DFP | DIP | DFP |
| Encapsulate equivalent code | LCC20,.35SQ | FL14,.3 | DIP14,.3 | FL14,.3 |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK |
| power supply | 3.3/5 V | 3.3/5 V | 3.3/5 V | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 12.5 ns | 12.5 ns | 12.5 ns | 12.5 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO |
| Filter level | MIL-STD-883 Class B | MIL-STD-883 Class B | MIL-STD-883 Class B | 38535V;38534K;883S |
| surface mount | YES | YES | NO | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
| Terminal form | NO LEAD | FLAT | THROUGH-HOLE | FLAT |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| Terminal location | QUAD | DUAL | DUAL | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 |
| Is it Rohs certified? | incompatible | incompatible | incompatible | - |
| series | AC | AC | AC | - |
| JESD-609 code | e0 | e0 | e0 | - |
| Number of functions | 4 | 4 | 4 | - |
| Number of entries | 2 | 2 | 2 | - |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| propagation delay (tpd) | 12.5 ns | 12.5 ns | 12.5 ns | - |
| Maximum seat height | 1.905 mm | 2.032 mm | 5.08 mm | - |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V | - |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | - |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| width | 8.89 mm | 6.2865 mm | 7.62 mm | - |