Y5V Dielectric
General Specifications
Y5V formulations are for general-purpose use in a limited
temperature range. They have a wide temperature
characteristic of +22% –82% capacitance change over the
operating temperature range of –30°C to +85°C.
These characteristics make Y5V ideal for decoupling
applications within limited temperature range.
PART NUMBER (see page 2 for complete part number explanation)
0805
Size
(L" x W")
3
Voltage
6.3V = 6
10V = Z
16V = Y
25V = 3
50V = 5
G
Dielectric
Y5V = G
104
Capacitance
Code (In pF)
2 Sig. Digits +
Number of
Zeros
Z
Capacitance
Tolerance
Z = +80 –20%
A
Failure
Rate
A = Not
Applicable
T
Terminations
T = Plated Ni
and Sn
2
Packaging
2 = 7" Reel
4 = 13" Reel
A
Special
Code
A = Std.
Product
Insulation Resistance (Ohm-Farads)
Temperature Coefficient
+20
+10
0
-10
-20
-30
-40
-50
-60
-70
-80
-55
-35 -15
+5 +25 +45 +65 +85 +105 +125
+40
+20
Capacitance Change
vs. DC Bias Voltage
Insulation Resistance vs. Temperature
10,000
Capacitance
1,000
c/c (%)
0
-20
-40
-60
-80
-100
0
20
40
60
80
100
100
%
0
+20
+30
+40
+50
+60
+70
+80
+90
Temperature
°C
% DC Bias Voltage
Temperature
°C
0.1 F - 0603
Impedance vs. Frequency
10,000
1,000
1,000
100
0.22 F - 0805
Impedance vs. Frequency
1,000
100
1 F - 1206
Impedance vs. Frequency
|Z| (Ohms)
|Z| (Ohms)
|Z| (Ohms)
100
10
1
0.1
0.01
10,000
10
1
0.1
0.01
10,000
10
1
0.1
0.01
10,000
100,000
1,000,000
10,000,000
100,000
1,000,000
10,000,000
100,000
1,000,000
10,000,000
Frequency (Hz)
Frequency (Hz)
Frequency (Hz)
26
Y5V Dielectric
Specifications and Test Methods
Parameter/Test
Operating Temperature Range
Capacitance
Dissipation Factor
Y5V Specification Limits
-30ºC to +85ºC
Within specified tolerance
≤ 5.0% for ≥ 50V DC rating
≤ 7.0% for 25V DC rating
≤ 9.0% for 16V DC rating
≤ 12.5% for ≤ 10V DC rating
10,000MΩ or 500MΩ - μF,
whichever is less
No breakdown or visual defects
No defects
≤ ±30%
Meets Initial Values (As Above)
≥ Initial Value x 0.1
≥ 95% of each terminal should be covered
with fresh solder
No defects, <25% leaching of either end terminal
≤ ±20%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±20%
Meets Initial Values (As Above)
Meets Initial Values (As Above)
Meets Initial Values (As Above)
No visual defects
≤ ±30%
≤ Initial Value x 1.5 (See Above)
≥ Initial Value x 0.1 (See Above)
Meets Initial Values (As Above)
No visual defects
≤ ±30%
≤ Initial Value x 1.5 (See above)
≥ Initial Value x 0.1 (See Above)
Meets Initial Values (As Above)
Remove from chamber and stabilize at
room temperature and humidity for
24 ± 2 hours before measuring.
Charge device with twice rated voltage in
test chamber set at 85ºC ± 2ºC
for 1000 hours (+48, -0)
Remove from test chamber and stabilize
at room temperature for 24 ± 2 hours
before measuring.
Store in a test chamber set at 85ºC ± 2ºC/
85% ± 5% relative humidity for 1000 hours
(+48, -0) with rated voltage applied.
Step 1: -30ºC ± 2º
Step 2: Room Temp
Step 3: +85ºC ± 2º
Step 4: Room Temp
30 ± 3 minutes
≤ 3 minutes
30 ± 3 minutes
≤ 3 minutes
Dip device in eutectic solder at 260ºC for 60
seconds. Store at room temperature for 24 ± 2
hours before measuring electrical properties.
90 mm
Measuring Conditions
Temperature Cycle Chamber
Freq.: 1.0 kHz ± 10%
Voltage: 1.0Vrms ± .2V
For Cap > 10 μF, 0.5Vrms @ 120Hz
Charge device with rated voltage for
120 ± 5 secs @ room temp/humidity
Charge device with 300% of rated voltage for
1-5 seconds, w/charge and discharge current
limited to 50 mA (max)
Deflection: 2mm
Test Time: 30 seconds
1mm/sec
Insulation Resistance
Dielectric Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Resistance to
Flexure
Stresses
Solderability
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Appearance
Capacitance
Variation
Dissipation
Factor
Insulation
Resistance
Dielectric
Strength
Dip device in eutectic solder at 230 ± 5ºC
for 5.0 ± 0.5 seconds
Resistance to
Solder Heat
Thermal
Shock
Repeat for 5 cycles and measure after
24 ±2 hours at room temperature
Load Life
Load
Humidity
27
Embedded System
京公网安备 11010802033920号
EEWORLD
