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EPC4xxx

Description
1M X 16 CONFIGURATION MEMORY, PQFP100
Categorystorage   
File Size270KB,36 Pages
ManufacturerAltera (Intel)
Download Datasheet Parametric Compare View All

EPC4xxx Overview

1M X 16 CONFIGURATION MEMORY, PQFP100

EPC4xxx Parametric

Parameter NameAttribute value
Number of functions1
Number of terminals100
Maximum operating temperature85 Cel
Minimum operating temperature-40 Cel
Maximum supply/operating voltage3.6 V
Minimum supply/operating voltage3 V
Rated supply voltage3.3 V
Processing package descriptionPLASTIC, QFP-100
stateACTIVE
packaging shapeRECTANGULAR
Package SizeFLATPACK
surface mountYes
Terminal formGULL WING
Terminal spacing0.6500 mm
terminal coatingTIN LEAD
Terminal locationQUAD
Packaging MaterialsPLASTIC/EPOXY
Temperature levelINDUSTRIAL
memory width16
organize1M X 16
storage density1.68E7 deg
operating modeSYNCHRONOUS
Number of digits1.05E6 words
Number of digits1M
Memory IC typeCONFIGURATION MEMORY
serial parallelPARALLEL
2. Enhanced Configuration
Devices (EPC4, EPC8 &
EPC16) Data Sheet
CF52002-2.1
Features
Enhanced configuration devices include EPC4, EPC8, and EPC16
devices
Single-chip configuration solution for Stratix
®
series, Cyclone™
series, APEX™ II, APEX 20K (including APEX 20K, APEX 20KC, and
APEX 20KE), Mercury™, ACEX
®
1K, and FLEX
®
10K (FLEX 10KE
and FLEX 10KA) devices
Contains 4-, 8-, and 16-Mbit flash memories for configuration data
storage
On-chip decompression feature almost doubles the effective
configuration density
Standard flash die and a controller die combined into single stacked
chip package
External flash interface supports parallel programming of flash and
external processor access to unused portions of memory
Flash memory block/sector protection capability via external
flash interface
Supported in EPC16 and EPC4 devices
Page mode support for remote and local reconfiguration with up to
eight configurations for the entire system
Compatible with Stratix series Remote System Configuration
feature
Supports byte-wide configuration mode fast passive parallel (FPP);
8-bit data output per
DCLK
cycle
Supports true n-bit concurrent configuration (n = 1, 2, 4, and 8) of
Altera FPGAs
Pin-selectable 2-ms or 100-ms power-on reset (POR) time
Configuration clock supports programmable input source and
frequency synthesis
Multiple configuration clock sources supported (internal
oscillator and external clock input pin)
External clock source with frequencies up to 133 MHz
Internal oscillator defaults to 10 MHz; Programmable for higher
frequencies of 33, 50, and 66 MHz
Clock synthesis supported via user programmable divide
counter
Available in the 100-pin plastic quad flat pack (PQFP) and the 88-pin
Ultra FineLine BGA
®
packages
Vertical migration between all devices supported in the 100-pin
PQFP package
Supply voltage of 3.3 V (core and I/O)
Altera Corporation
August 2005
2–1

EPC4xxx Related Products

EPC4xxx EPC16QI100 EPC8xxx EPC16xxx EPC8QI100
Description 1M X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100 512K X 16 CONFIGURATION MEMORY, PQFP100
Number of functions 1 1 1 1 1
Number of terminals 100 100 100 100 100
Maximum operating temperature 85 Cel 85 °C 85 Cel 85 Cel 85 °C
Minimum operating temperature -40 Cel -40 °C -40 Cel -40 Cel -40 °C
surface mount Yes YES Yes Yes YES
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location QUAD QUAD QUAD QUAD QUAD
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
memory width 16 16 16 16 16
organize 1M X 16 1MX16 1M X 16 1M X 16 512KX16
Maximum supply/operating voltage 3.6 V - 3.6 V 3.6 V -
Minimum supply/operating voltage 3 V - 3 V 3 V -
Rated supply voltage 3.3 V - 3.3 V 3.3 V -
Processing package description PLASTIC, QFP-100 - PLASTIC, QFP-100 PLASTIC, QFP-100 -
state ACTIVE - ACTIVE ACTIVE -
packaging shape RECTANGULAR - RECTANGULAR RECTANGULAR -
Package Size FLATPACK - FLATPACK FLATPACK -
Terminal spacing 0.6500 mm - 0.6500 mm 0.6500 mm -
terminal coating TIN LEAD - TIN LEAD TIN LEAD -
Packaging Materials PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY -
storage density 1.68E7 deg - 1.68E7 deg 1.68E7 deg -
operating mode SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS -
Number of digits 1M - 1M 1M -
Memory IC type CONFIGURATION MEMORY - CONFIGURATION MEMORY CONFIGURATION MEMORY -
serial parallel PARALLEL - PARALLEL PARALLEL -
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