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EPC8QI100

Description
512K X 16 CONFIGURATION MEMORY, PQFP100
Categorystorage    storage   
File Size270KB,36 Pages
ManufacturerAltera (Intel)
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EPC8QI100 Overview

512K X 16 CONFIGURATION MEMORY, PQFP100

EPC8QI100 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Parts packaging codeQFP
package instructionPLASTIC, QFP-100
Contacts100
Reach Compliance Code_compli
ECCN codeEAR99
Maximum clock frequency (fCLK)66.7 MHz
JESD-30 codeR-PQFP-G100
JESD-609 codee0
length20 mm
memory density8388608 bi
Memory IC TypeCONFIGURATION MEMORY
memory width16
Humidity sensitivity level3
Number of functions1
Number of terminals100
word count524288 words
character code512000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize512KX16
Package body materialPLASTIC/EPOXY
encapsulated codeQFP
Encapsulate equivalent codeQFP100,.7X.9
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)220
power supply3.3 V
Certification statusNot Qualified
Maximum seat height2.15 mm
Maximum standby current0.00015 A
Maximum slew rate0.09 mA
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
typeNOR TYPE
width14 mm
Base Number Matches1
2. Enhanced Configuration
Devices (EPC4, EPC8 &
EPC16) Data Sheet
CF52002-2.1
Features
Enhanced configuration devices include EPC4, EPC8, and EPC16
devices
Single-chip configuration solution for Stratix
®
series, Cyclone™
series, APEX™ II, APEX 20K (including APEX 20K, APEX 20KC, and
APEX 20KE), Mercury™, ACEX
®
1K, and FLEX
®
10K (FLEX 10KE
and FLEX 10KA) devices
Contains 4-, 8-, and 16-Mbit flash memories for configuration data
storage
On-chip decompression feature almost doubles the effective
configuration density
Standard flash die and a controller die combined into single stacked
chip package
External flash interface supports parallel programming of flash and
external processor access to unused portions of memory
Flash memory block/sector protection capability via external
flash interface
Supported in EPC16 and EPC4 devices
Page mode support for remote and local reconfiguration with up to
eight configurations for the entire system
Compatible with Stratix series Remote System Configuration
feature
Supports byte-wide configuration mode fast passive parallel (FPP);
8-bit data output per
DCLK
cycle
Supports true n-bit concurrent configuration (n = 1, 2, 4, and 8) of
Altera FPGAs
Pin-selectable 2-ms or 100-ms power-on reset (POR) time
Configuration clock supports programmable input source and
frequency synthesis
Multiple configuration clock sources supported (internal
oscillator and external clock input pin)
External clock source with frequencies up to 133 MHz
Internal oscillator defaults to 10 MHz; Programmable for higher
frequencies of 33, 50, and 66 MHz
Clock synthesis supported via user programmable divide
counter
Available in the 100-pin plastic quad flat pack (PQFP) and the 88-pin
Ultra FineLine BGA
®
packages
Vertical migration between all devices supported in the 100-pin
PQFP package
Supply voltage of 3.3 V (core and I/O)
Altera Corporation
August 2005
2–1

EPC8QI100 Related Products

EPC8QI100 EPC16QI100 EPC8xxx EPC4xxx EPC16xxx
Description 512K X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100 1M X 16 CONFIGURATION MEMORY, PQFP100
memory width 16 16 16 16 16
Number of functions 1 1 1 1 1
Number of terminals 100 100 100 100 100
Maximum operating temperature 85 °C 85 °C 85 Cel 85 Cel 85 Cel
Minimum operating temperature -40 °C -40 °C -40 Cel -40 Cel -40 Cel
organize 512KX16 1MX16 1M X 16 1M X 16 1M X 16
surface mount YES YES Yes Yes Yes
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal location QUAD QUAD QUAD QUAD QUAD
Maximum supply/operating voltage - - 3.6 V 3.6 V 3.6 V
Minimum supply/operating voltage - - 3 V 3 V 3 V
Rated supply voltage - - 3.3 V 3.3 V 3.3 V
Processing package description - - PLASTIC, QFP-100 PLASTIC, QFP-100 PLASTIC, QFP-100
state - - ACTIVE ACTIVE ACTIVE
packaging shape - - RECTANGULAR RECTANGULAR RECTANGULAR
Package Size - - FLATPACK FLATPACK FLATPACK
Terminal spacing - - 0.6500 mm 0.6500 mm 0.6500 mm
terminal coating - - TIN LEAD TIN LEAD TIN LEAD
Packaging Materials - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
storage density - - 1.68E7 deg 1.68E7 deg 1.68E7 deg
operating mode - - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
Number of digits - - 1M 1M 1M
Memory IC type - - CONFIGURATION MEMORY CONFIGURATION MEMORY CONFIGURATION MEMORY
serial parallel - - PARALLEL PARALLEL PARALLEL
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