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MT8981DPR1

Description
ISO-CMOS ST-BUS
CategoryWireless rf/communication    Telecom circuit   
File Size472KB,20 Pages
ManufacturerZarlink Semiconductor (Microsemi)
Websitehttp://www.zarlink.com/
Environmental Compliance
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MT8981DPR1 Overview

ISO-CMOS ST-BUS

MT8981DPR1 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerZarlink Semiconductor (Microsemi)
package instructionQCCJ,
Reach Compliance Codecompli
JESD-30 codeS-PQCC-J44
JESD-609 codee3
length16.585 mm
Humidity sensitivity level3
Number of functions1
Number of terminals44
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height4.57 mm
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesDIGITAL TIME SWITCH
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperature30
width16.585 mm
ISO-CMOS ST-BUS
TM
Family
MT8981D
Digital Switch
Data Sheet
Features
Zarlink ST-BUS compatible
4-line x 32-channel inputs
4-line x 32-channel outputs
128 ports non-blocking switch
Single power supply (+5 V)
Low power consumption: 30 mW Typ.
Microprocessor-control interface
Three-state serial outputs
Ordering Information
MT8981DE
40 Pin PDIP
MT8981DP
44 Pin PLCC
MT8981DPR
44 Pin PLCC
MT8981DP1 44 Pin PLCC*
MT8981DPR1 44 Pin PLCC*
*Pb Free Matte Tin
February 2005
Tubes
Tubes
Tape & Reel
Tubes
Tape & Reel
-40°C to +85°C
Description
This VLSI ISO-CMOS device is designed for switching
PCM-encoded voice or data, under microprocessor
control, in a modern digital exchange, PBX or Central
Office. It provides simultaneous connections for up to
128 64 kbit/s channels. Each of the four serial inputs
and outputs consist of 32 64 kbit/s channels
multiplexed to form a 2048 kbit/s ST-BUS stream. In
addition, the MT8981 provides microprocessor read
and write access to individual ST-BUS channels.
C4i
F0i
V
DD
V
SS
ODE
STi0
STi1
STi2
STi3
Serial
to
Parallel
Converter
Data
Memory
Frame
Counter
Output
MUX
Parallel
to
Serial
Converter
STo0
STo1
STo2
STo3
Control Register
Connection
Memory
Control Interface
DS CS
R/W A5/
A0
DTA D7/
D0
Figure 1 - Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 1997-2005, Zarlink Semiconductor Inc. All Rights Reserved.

MT8981DPR1 Related Products

MT8981DPR1 MT8981DP1 MT8981DPR MT8981DP MT8981DE MT8981D
Description ISO-CMOS ST-BUS ISO-CMOS ST-BUS ISO-CMOS ST-BUS ISO-CMOS ST-BUS ISO-CMOS ST-BUS ISO-CMOS ST-BUS
Is it Rohs certified? conform to conform to incompatible incompatible incompatible -
Maker Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) Zarlink Semiconductor (Microsemi) -
package instruction QCCJ, QCCJ, QCCJ, LDCC44,.7SQ QCCJ, LDCC44,.7SQ DIP, DIP40,.6 -
Reach Compliance Code compli compli compli compli compli -
JESD-30 code S-PQCC-J44 S-PQCC-J44 S-PQCC-J44 S-PQCC-J44 R-PDIP-T40 -
JESD-609 code e3 e3 e0 e0 e0 -
length 16.585 mm 16.585 mm 16.585 mm 16.585 mm 51.75 mm -
Humidity sensitivity level 3 3 1 1 - -
Number of functions 1 1 1 1 1 -
Number of terminals 44 44 44 44 40 -
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C -
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY -
encapsulated code QCCJ QCCJ QCCJ QCCJ DIP -
Package shape SQUARE SQUARE SQUARE SQUARE RECTANGULAR -
Package form CHIP CARRIER CHIP CARRIER CHIP CARRIER CHIP CARRIER IN-LINE -
Peak Reflow Temperature (Celsius) 260 260 225 225 225 -
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified -
Maximum seat height 4.57 mm 4.57 mm 4.57 mm 4.57 mm 6.35 mm -
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V -
surface mount YES YES YES YES NO -
technology CMOS CMOS CMOS CMOS CMOS -
Telecom integrated circuit types DIGITAL TIME SWITCH DIGITAL TIME SWITCH DIGITAL TIME SWITCH DIGITAL TIME SWITCH DIGITAL TIME SWITCH -
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL -
Terminal surface MATTE TIN MATTE TIN Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
Terminal form J BEND J BEND J BEND J BEND THROUGH-HOLE -
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 2.54 mm -
Terminal location QUAD QUAD QUAD QUAD DUAL -
Maximum time at peak reflow temperature 30 30 30 30 30 -
width 16.585 mm 16.585 mm 16.585 mm 16.585 mm 15.24 mm -

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