Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
Semiconductor Components Industries, LLC, 2013
August, 2013
O0610 SY/90810 SY 20100824-S00001 No.A1829-1/6
LV5061V
Recommended Operating Conditions
at Ta = 25°C
Parameter
Input voltage range
VIN
Symbol
Conditions
Ratings
4.5 to 18
Unit
V
Electrical Characteristics
at Ta
=
25°C, VIN = 15V
Parameter
Reference voltage
Internal reference voltage
Pch drive voltage
Saw wave oscillator
Oscillatory frequency
ON/OFF circuit
IC start-up voltage
Disable voltage
Soft start circuit
Soft start source current
Soft start sink current
UVLO circuit
UVLO release voltage
UVLO lock voltage
Error amplifier
Input bias current
Error amplifier gain
Output sink current
Output source current
Over current limit circuit
Reference current
Over current detection
comparator offset voltage
RSNS pin input range
HICCUP timer start-up cycle
HICCUP comparator threshold
voltage
HICCUP timer change current
PWM comparator
Maximum On-duty
Logic output
Power good “L” sink current
Power good “H” leakage current
Power good threshold voltage
Power good hysteresis
Output
Output on-resistance (High)
Output on-resistance (Low)
Output on-current (High)
Output on-current (Low)
The entire device
Stand-by current
Light load mode consumption
current
Thermal shutdown
TSD
ICCS
ISLEEP1
EN<0.3V
EN>1.5V,
No switching
*2
170
˚C
50
70
1
90
μA
μA
RONH
RONL
IONH
IONL
500
500
3
3
Ω
Ω
mA
mA
IPWRGD_L
IPWRGD_H
VtPG
VPG_H
PG=5V
PG=5V
1.0
40
1.1
50
4
5
6
1
1.2
60
mA
μA
V
mV
D max
95
%
IHIC
1
2
3
μA
VRSNS
NLCYCLES
VtHIC
1.2
VIN-0.175
15
1.26
1.32
VIN
V
cycle
V
ILIM1
VLIM_OFS
48.4
-5
55
61.6
+5
μA
mV
IEA_IN
GEA
IEA_OSK
IES_OSC
FB=1.75V
FB=0.75V
-100
100
-40
10
-50
250
-20
20
100
400
-10
40
nA
μA/V
μA
μA
VUVLON
VUVLOF
FB=COMP
FB=COMP
3.0
2.5
3.4
2.9
3.8
3.3
V
V
ISS_SC
ISS_SK
EN>1.5V
EN>1.5V, ILIM
>RSNS
SS=4V at HICCUP
1.3
1.2
2.0
2.0
2.7
2.8
μA
mA
VCNT_ON
VCNT_OFF
1.5
VIN
0.3
V
V
FOSC
RT=470kΩ
280
330
380
kHz
Vref
VPDR
IOUT=0 to -5mA
1.235
VIN-5.5
1.260
VIN-5.0
1.285
VIN-4.5
V
V
Symbol
Conditions
min
Ratings
typ
max
Unit
*2: Design certification
No.A1829-2/6
LV5061V
Package Dimensions
unit : mm (typ)
3178B
5.2
16
9
1.2
Pd max -- Ta
Specified circuit board :
114.3×76.1×1.6mm
3
glass epoxy board
Allowable power dissipation, Pd max
- W
4.4
6.4
0.8
0.74
0.5
1
0.65
(0.33)
8
0.15
0.22
1.5max
0.4
0.38
0
-40
-20
0
20
40
60
80
100
120
(1.3)
Ambient temperature, Ta
- C
SANYO : SSOP16(225mil)
Block Diagram
VIN
Hi:ON
Lo:OFF
2.EN
0.1
Wake-up
Band-gap
Bias
1.26V
R3
+
-
uvlo.comp
REF
TSD
HIC CUP.comp
enable
16.REF
C5
Pch
Drive
7.PDR
C3
4.VIN
R1
R2
VIN
C1
C10
C8
14.COMP
R6
12.SS
C6
C7
9,13.NC
+
-
1.PG
PG.comp
slope
+
+
-
FB
15.FB
err.amp
+
-
S
R
Q
Q
1.1V
+
-
+
-
15pluse
counter
clk
11.C-HICCUP
+
-
pwm.comp
5.RSNS
3.ILIM
+
-
PbyP.comp
VIN
Level-shift
PDR
6.HDRV
L
OSC
C9
D1
R4
FB
10.RT
R7
8.GND
C2
R5
No.A1829-3/6
LV5061V
Pin Assignment
TOP VIEW
PG 1
EN 2
ILIM 3
VIN 4
RSNS 5
HDRV 6
PDR 7
GND 8
16 REF
15 FB
14 COMP
13 N.C.
LV5061V
12 SS
11 C-HICCUP
10 RT
9 N.C.
Pin Descriptions
Pin
No.
1
Pin name
PG
Power good pin.
Connect to open drain of MOS-FET in ICs inside.
Setting output voltage to "L", when FB voltage is 1.05V or less
Descriptions
Equivalent circuit
PG
GND
2
EN
ON/OFF pin
VIN
EN
GND
3
ILIM
For current detection.
Sink current is about 55μA. The current limiter comparator
works when an external resistor is connected between this pin
and VIN, and if the voltage of this resistor is less than the
voltage of RSNS then Pch MOS is turned off. This operation is
reset each PWM pulse.
VIN
ILIM
GND
4
VIN
Supply voltage pin.
It is observed by the UVLO function. When its voltage becomes
3.4V or more, ICs startup in soft start.
VIN
GND
5
RSNS
Current detection resistor connection pin.
Resistor is connected between VIN and this pin, and the current
flows to MOSFET are measured.
VIN
RSNS
GND
Continued on next page.
No.A1829-4/6
LV5061V
Continued from preceding page.
Pin
No.
6
Pin name
HDRV
Descriptions
The external high-side MOSFET gate drive pin.
Equivalent circuit
VIN
HDRV
PDR
7
PDR
Gate drive voltage of the external Pch MOSFET.
Meanwhile, the bypass capacitor is connected between VIN
and this pin.
VIN
PDR
GND
8
GND
Ground Pin.
Ground pin voltage is reference voltage.
VIN
GND
9
10
NC
RT
N.C. pin.
Oscillation frequency setting pin.
Resistor is connected between this pin and GND.
VIN
ILIM
GND
11
C-HICCUP
It is capacitor connection pin for setting re-startup cycle in
HICCUP mode.
If connect it to GND pin, then latch-off when over current.
VIN
C-HICCUP
GND
12
SS
Capacitor connection pin for soft start.
About 2μA current charges the soft start capacitor.
VIN
SS
GND
13
14
NC
COMP
NC pin.
Error Amplifier Output Pin.
The phase compensation network is connected between GND
pin and COMP pin.
Thanks to current-mode control, COMP pin voltage would tell
you the output current amplitude. COMP pin is connected
internally to an int.comparator which comparators with 0.9V
reference. If COMP pin voltage is larger than.
0.9V, IC operates in “continuous mode”. If COMP pin voltage is
smaller than 0.9V, IC operates in “discontinuous mode (low
[align=left][color=rgb(85, 85, 85)][font="][size=14px]In factory automation applications, due to the increasing number of field device nodes and the increasing requirements for automation equipment pr...
DIYShare—GravityShareMobile phone battery charger is the abbreviation of seat charger, which means putting the battery plate on it to charge, which is very convenient to use.
A charger is a charger sp...
Some people may think that I am boring. Everything has to be "efficient", "effective", and "constructive". Isn't it tiring to live like this? Some people say that you can talk about efficiency and eff...
[font=微软雅黑][size=5] [/size][/font] [font=微软雅黑][size=5]Sharing and getting gifts has ended[/size][/font] [font=微软雅黑][size=5]The password for the compressed package for the pre-buried floor is: Roadshow...
I'm recently debugging a serial port program under WINCE, written using a common API. The code is found on the Internet, http://www.pcjx.net/htm/netp2/62195.html. Basically, all serial ports are like ...
Flip-chip and ball grid array (BGA) are two widely used packaging technologies in the electronics industry. Each has its own advantages and limitations, and in some cases, they can complement each ...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
Ever since the Tesla fire incident, electric cars, already known for their poor reputation, have been subjected to even more scathing criticism. Despite this, many people are still willing to buy t...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
According to foreign media reports, BMW has just been granted a patent for a screen that could cover the entire roof. BMW hopes to transform at least a portion of the vehicle's headliner into a dis...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
A tubular motor is an electric motor that is typically used to control the movement of machines and equipment. Tubular motors are generally divided into two categories: linear tubular motors and ro...[Details]
A scale, a large, ground-mounted scale, is typically used to measure the tonnage of truck cargo. It's the primary weighing device used in factories, mines, and businesses for bulk cargo measurement...[Details]
New version helps developers build secure and trustworthy embedded systems
Shanghai, China—August 21, 2025—
QNX, a division of BlackBerry Ltd., today announced the release of QNX...[Details]
introduction
The OMAP-L138 dual-core processor is a new generation of low-power single-chip systems (SoCs) from TI. It is widely used in communications, industrial, medical diagnostic, and aud...[Details]
In microwave amplification circuits, the power chip is the core of the entire circuit. A large number of semiconductor devices in the chip will generate a lot of heat when working. If the heat diss...[Details]
Reasons for the wear of the roller press reducer shaft:
1. Since the expansion sleeve is subjected to a large torque, the mating surfaces of the shaft and the sleeve move relative to each other...[Details]
In recent years, with the development of MOSFETs, they have gradually replaced transistors in the low-power, fast-switching industry. Major manufacturers in this field have also been reducing their...[Details]
Electronic devices are small individual components in electronic circuits. Transistors are common electronic components. Because of their wide range of applications, according to the usage of the e...[Details]
Naxin Micro releases the NS800RT737x high-performance real-time control MCU (DSP), enabling core control in the industrial and energy sectors.
In power electronics and electric drive...[Details]