Document Conventions and Definitions................................................................................................................................................................. 4
I2C Bus .................................................................................................................................................................................................................. 8
JTAG TAP Port...................................................................................................................................................................................................... 8
Frequency Select (FSEL[1:0]) ............................................................................................................................................................................... 9
AC Test Conditions...................................................................................................................... 16
Power Consumption .................................................................................................................... 18
2.
3.
4.
5.
6.
7.
8.
9.
10. I
2
C Bus ......................................................................................................................................... 19
I
2
C Master Mode and Slave Mode....................................................................................................................................................................... 19
I
2
C Device Address ............................................................................................................................................................................................. 19
C DC Electrical Specifications........................................................................................................................................................................... 23
I
2
C AC Electrical Specifications........................................................................................................................................................................... 24
I
2
C Timing Waveforms......................................................................................................................................................................................... 25
Definition of Amplitude and Swing....................................................................................................................................................................... 29
1.25, 2.5, and 3.125 Gbaud LP-Serial Links........................................................................................................................................................ 30
Level I Electrical Specification ............................................................................................................................................................................. 30
5 and 6.25 Gbaud LP-Serial Links....................................................................................................................................................................... 37
Level II Electrical Specifications .......................................................................................................................................................................... 37
System Logic TAP Controller Overview............................................................................................................................................................... 50
Signal Definitions ................................................................................................................................................................................................. 51
Test Data Register (DR) ...................................................................................................................................................................................... 52
JTAG DC Electrical Specifications....................................................................................................................................................................... 63
JTAG AC Electrical Specifications....................................................................................................................................................................... 64
The 2407DSP interrupt system is divided into two levels. In the first level, there is a peripheral interrupt request register and a peripheral interrupt response register. The principle of the periphe...
BIPES is an open source project that integrates Google Blockly, WebREPL, MicroPython, documentation, an IOT platform for sending and viewing data, an enhanced web file manager using WebREPL and an onl...
Let's look at the hardware diagram first, and then learn 4×4 keyboard programming together! [img]http://img.photo.163.com/bdWP7cn-vZv3qydIdnZqRQ==/766737836560670912.jpg[/img] Now let's look at the or...
[align=left][size=4]1. The SPI rate cannot exceed 15M, otherwise serious bit errors will occur[/size][/align][align=left][size=4]2. If the receiving mode is interrupt reception, the SPICCR character l...
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A parallel inverter consists of two thyristors (T1 and T2), a capacitor, a center-tapped transformer, and an inductor. The thyristors provide a current path, while the inductor L maintains a consta...[Details]
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A multilevel inverter converts a DC signal into a multilevel staircase waveform. Instead of a straight positive-negative output waveform, the output waveform of a multilevel inverter alternates in ...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
On August 20, Geely announced its focus on "One Cockpit". Through a unified AI OS architecture, a unified AI Agent, and a unified user ID, it will achieve an All-in-One AI cockpit, create the first...[Details]
On August 21st, BYD announced the launch of its next-generation "Little White Pile" product, the "Lingchong"
charging
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The fracture mechanism is stress concentration, which typically occurs at the capacitor lead pins or pad connection points, as shown in the figure. Under vibration, the capacitor lead pins and pad ...[Details]
Analog electronics
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