Invitation | The 2023 Industrial Expo will open with great fanfare. Avnet invites you to join us for this technological feast.

The highly anticipated 2023 China International Industry Fair (CIIF) will be held at the Shanghai National Exhibition and Convention Center from September 19th to 23rd . With the theme of "Carbon Recycling, New Industry, Digital Aggregation, New Economy," this year's CIIF will attract over 2,600 exhibitors, making it a technological feast not to be missed for industry engineers.

We will bring our blockbuster products to the exhibition

Do you want a date?

Avnet As one of the exhibitors

We will be at booth 5.2H–B092

Conduct a series of cutting-edge solution demos

Content covers machine vision, edge computing

Artificial intelligence and other technical fields

There will be on-site explanations by Avnet and original factory engineers

2,500+ exquisite gifts

Let us treat each other with courtesy

▎LiDAR -Vision All-in-One

This product is a computing module designed by Snow Lake Technology to provide deep learning perception capabilities for LiDAR and intelligent visual perception. It utilizes the LiDAREYETM-BOX dual-board kit and is based on AMD's 16nm Zynq UltraScale+ MPSoC. It can be widely used in scenarios such as smart transportation, 5G-V2X connected vehicles, vehicle-road collaboration, autonomous driving, and smart cities, providing dedicated computing power for various LiDAR and visual perception applications.

▎Based on ZUBoard stereo face detection

The system uses Avnet's ZUBoard development board (based on the AMD 16nm Zynq UltraScale+ MPSoC ZU1CG) and a dual-camera daughter card. It is a complete stereo face detection and ranging reference design, mainly used in the fields of embedded vision and AI.

▎Vision AI Starter Kit-KV260

AMD's KV260 Vision AI Starter Kit is a low-cost, out-of-the-box vision application development platform based on the Zynq UltraScale+ MPSoC. It provides a variety of video input and output interfaces (such as MIPI, USB, Ethernet, HDMI, and DisplayPort), making it suitable for Vision AI and embedded software/hardware developers to quickly evaluate and verify prototype designs for smart city, machine vision, security cameras, new retail, and other industrial vision applications.

▎Industrial High-Speed ​​Camera-KR260

KR260 is a general-purpose programmable SoC platform designed by AMD for industrial vision, industrial high-speed interconnection, and industrial robotics applications. It uses Zynq UltraScale+ MPSoC EV series devices and can be widely used in high-speed industrial cameras and industrial Internet.

AMD CPU Machine Vision Platform

This machine vision platform includes an industrial camera based on an AMD 28nm FPGA and an Advantech Ryzen V2000 Mini-ITX motherboard, connected via GigE Vision to form a complete machine vision signal chain. It can be used as an evaluation and verification platform for machine vision.

▎Next -generation industrial network - TSN

This product uses AMD's TSN IP, is based on the Zynq UltraScale+ MPSoC device and the AMD KR260 robot development kit, supports standards such as 802.1AS clock synchronization protocol and 802.1Qbv traffic shaping, and can be widely used in industrial real-time network communications, automotive autonomous driving, and intelligent manufacturing.

AR1335 ​

The AR1335 is a 13-megapixel rolling shutter image sensor that utilizes advanced 1.1um pixel back-illuminated technology and has a 1/3.2-inch optical size. It can be widely used in applications such as 4K video recording, industrial cameras, and the consumer market.

XGS5000 ​

The XGS5000 is a 5-megapixel global shutter image sensor that utilizes advanced 3.2um pixels and a 12-bit ADC. Its optical size is 2/3 inches, and its 163-pin iLGA 16x16 package enables even smaller cameras. XGS is part of the X-Class image sensor platform, covering 11 resolutions from 2 to 45 megapixels. This platform supports multiple CMOS pixel architectures within the same image sensor framework, enabling flexible new dimensions in camera design.

Based on the AMD 28nm Zynq7000 SoC platform, this product supports numerous protocols, including IEC61850/MMS, CMS, GOOSE, IEC60044/FT3, IEC104, and MQTT. It also supports container apps, enabling communication and policy control between energy storage station subsystems (BMS/PCS/EMS). The system boasts process-layer network storm suppression, high real-time stability and security, a rich set of hardware and communication interfaces, and strong anti-interference capabilities, making it suitable for a wide range of applications in energy storage, photovoltaic, wind power, and distribution substation edge computing.

Neural Network Computing Accelerator

Based on Avnet's 2U EPYC 9004 server and AMD V70 AI inference card, and using third-party Mipsology high-performance AI inference software Zebra, it can quickly deploy AI and achieve high-density AI analysis and detection of multiple real-time videos.

RFSoC Development Kit

Development devices based on the AMD Zynq UltraScale+ RFSoC utilize a core board and baseboard platform model. The single chip supports multi-channel and high-speed ADC/DAC functions, making it widely applicable for the development of wireless 5G and high-performance test and measurement instruments. The core board can also be used directly in final products.

In addition to the aforementioned exhibits, we will also be showcasing IP&E-related products and solutions from partners including Bourns, Molex, and TE Connectivity. We welcome you to visit us and learn more!

Focus on cutting-edge technology

Focus on technological innovation

September 19-23

Shanghai National Exhibition and Convention Center

Booth 5.2H–B092

We look forward to your arrival!