The Q-DPAK achieves extreme power density through clever separation of electrical and heat dissipation pathways via top-mounted heatsinks. Free samples are available for application.
Infineon's CoolSiC™ MOSFET 1200V G2 series features an advanced Q-DPAK top-cooled package, optimized for high power density and high-temperature operation, and is suitable for applications such as electric vehicle charging, photovoltaics, UPS, solid-state circuit breakers, industrial drives, and AI. We are now offering free samples of two devices, the IMCQ120R017M2H and IMCQ120R034M2H , for engineers, R&D teams, and industry partners to experience firsthand!
Why choose the Q-DPAK package?
Q-DPAK top thermal packaging technology is designed to help designers simplify the manufacturing process and increase power density. Its core concept is to separate the electrical connections of the device (on the bottom) from the thermal interface (on the top), thus cleverly combining the advantages of two traditional packaging methods.
While the traditional TO-247 package can be directly mounted on a heatsink for good thermal performance, its through-hole soldering (THT) process requires manual handling during PCB manufacturing, increasing manufacturing complexity. Standard surface mount technology (SMT) devices (such as the TO-263-7), although supporting fully automated processing, must dissipate heat through the PCB board with its limited thermal conductivity, restricting heat dissipation performance. Using an insulating metal substrate (IMS) can improve thermal conductivity, but this increases cost and design complexity.
The CoolSiC™ Q-DPAK top-mount thermal package offers the best of both worlds: it retains the fully automated manufacturing efficiency of SMT technology while achieving thermal performance comparable to or even exceeding that of the standard TO-247 package. Through a dedicated heatsink on the top of the device, heat is directly connected to a high-efficiency heatsink, allowing for rapid heat dissipation and significantly reducing device junction temperature , thus improving system reliability.
The Q-DPAK's top-mounted heatsink design supports a more optimized PCB layout , which not only reduces the impact of parasitic parameters and stray inductance, thereby lowering switching and conduction losses, but also allows components to be placed on both sides of a standard PCB , making the overall system design more compact and simpler. Combined with its superior heat dissipation capabilities, designers can handle greater power in a smaller space, ultimately achieving higher power density.
Product Overview
CoolSiC™ 1200 V G2 in Q-DPAK: Enables higher performance and a more compact design while improving efficiency.
Features
-
SMD top heat dissipation package
-
Low stray inductance
-
CoolSiC™ MOSFET 1200V G2 technology features optimized switching performance and FOM.
-
.XT diffusion solder
-
Minimum R DS(on)
-
Packaging material CTI > 600, CD > 4.8mm
-
Excellent moisture resistance
-
Avalanche protection, short circuit protection, and parasitic conduction PTO protection
Application value
-
Higher power density
-
Supports automated assembly
-
Simplified design
-
Excellent thermal performance
-
Reduce system losses
-
Supports 950V RMS operating voltage
-
Exceptional reliability
-
Reduce TCO and BOM costs
Scan the QR code to get the product datasheet
IMCQ120R017M2H
IMCQ120R034M2H
The Q-DPAK packaging solution offers customers superior thermal performance, easier assembly, and lower system costs, ushering in a new era of cooling, energy efficiency, design flexibility, and performance.
Scan the QR code and fill out the application form now for a chance to receive a free sample and be among the first to test its outstanding performance in real projects! Limited spots available, act fast!
Regarding Avnet
Avnet is a leading global technology distributor and solutions provider, committed for over a century to meeting the evolving needs of its customers. Through its global network of specialized and regional operations, Avnet supports customers and suppliers at every stage of the product lifecycle. Avnet helps companies of all types adapt to changing market environments, accelerating design and delivery during product development. Avnet's central position and unique perspective across the entire technology supply chain make it a trusted partner, helping customers solve complex design and supply chain challenges and achieve revenue faster. Learn more about Avnet at www.avnet.com
京公网安备 11010802033920号