Avnet will present its original equipment manufacturers at the 2023 CIIF, witnessing the "digital" and "intelligent" future.

We will also be livestreaming the first day of the exhibition, allowing those who can't attend to experience the charm of cutting-edge technology. Scan the QR code below to schedule a livestream and receive a variety of interactive gifts.

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Artificial intelligence is seen as a technology that simulates and extends human intelligence, and therefore can be figuratively described as a "smart brain."

The development of AI has permeated every aspect of our lives, leading to explosive growth in the amount of data to be processed and the computing power required. While traditional CPUs and GPUs can meet computing power demands to a certain extent, their low energy efficiency has been criticized, making them inadequate for specific requirements such as low latency and low power consumption. To address these shortcomings of traditional CPUs and GPUs, Avnet has launched the server-based AMD Alveo AI inference accelerator card, which combines the ease of design, flexible computing power configuration, high performance, low latency, and high energy efficiency required by AI applications. It is ideally suited for multi-channel, real-time, and high-density compute-intensive AI applications such as image and video classification, detection, and recognition.

LiDAR -Vision All-in-One This is a computing module designed for LiDAR and visual intelligent perception, providing deep learning capabilities. It can be widely used in multiple automotive intelligence scenarios, providing dedicated computing power for various LiDAR and visual perception applications.

Machine vision serves as the "eyes" of a machine, capturing and processing image data from the real world. Image sensors are one of the core technologies used to acquire image data in machine vision. With the continuous advancement of image sensor technology, the performance of machine vision systems is also improving.

▍ Onsemi 's AR1335 is a 13-megapixel image sensor that uses advanced 1.1um pixel technology to capture excellent images in a smaller size. It is particularly suitable for applications such as 4K video recording, industrial cameras, and the consumer market.

The XGS5000 is another 5-megapixel global shutter image sensor . It utilizes 3.2um pixels and a 12-bit ADC. Its optical size is 2/3 inches. Its 163-pin iLGA 16x16 package allows for smaller camera sizes. It is primarily used in intelligent transportation, machine vision, and high-speed motion capture.

Edge computing is a system that offloads data processing tasks from remote data centers to locations closer to the data source, reducing latency and enabling real-time responses. Its applications are rapidly growing in areas such as the Internet of Things, smart cities, and industrial automation, and solutions supporting it are also emerging.

Avnet 's ZUBoard-based stereo face detection system offers low cost and high performance. Based on AMD's low-cost 16nm SoC development board and employing Avnet's dual cameras, it provides a complete stereo face detection and ranging reference design for a wide range of applications in edge computing, lightweight AI, and machine vision.

AMD CPU Machine Vision Platform This platform consists of an industrial camera based on an AMD 28nm FPGA and a Ryzen V2000 Mini-ITX motherboard. Connected via a USB 3.0 interface, it provides a complete machine vision signal stream, providing a reliable platform for machine vision evaluation and verification.

New Energy Smart Gateway Product This is a high-performance, multi-functional edge computing device designed specifically for industrial environments. Based on the AMD 28nm SoC platform, it supports numerous communication protocols, including IEC61850, and is primarily targeted at applications in photovoltaic, wind power, and energy storage markets.

The coordinated development of artificial intelligence, machine vision, and edge computing requires the support of more tools and solutions.

AMD's KR260 is a general-purpose programmable SoC platform designed for the development of industrial vision, industrial high-speed interconnection, and industrial robotics. AMD also offers a Vision AI Starter Kit , the KV260 , which uses a cost-effective AMD 16nm development board, allowing developers to significantly accelerate development and save costs.

Avnet 's RFSOC Development Kit is a high-performance wireless and test and measurement development platform with integrated high-speed ADC/DAC. It's based on the AMD RFSOC device and includes a production-ready System-on-Module (SOM) core board. Avnet and AMD offer a comprehensive range of hardware and software reference designs.

The surge in Industry 4.0 and the Internet of Things (IoT) requires more reliable and efficient communication technologies. Time-Sensitive Networking ( TSN ) is demonstrating its capabilities in areas such as industrial real-time network communications, autonomous vehicles, and smart manufacturing. AMD, keeping pace with the times, offers a next-generation industrial network TSN solution that significantly enhances real-time network communications capabilities.

In addition, Avnet will also exhibit IP&E-related products from Bourns, Molex, and TE Connectivity at this exhibition . IP&E is a very important component of electronic equipment and has a vital impact on the performance, reliability, and stability of the equipment.

Bourns ' innovative IsoMOV™ protector fully integrates traditional GDTs and MOVs into a single package, overcoming MOV surge life and transient overvoltage (TOV) tolerance issues. Another Bourns® ^BMS flat-plate transformer offers enhanced reliability, addressing both production and application challenges for thin-wire applications. It meets the basic insulation requirements for 1000V system voltages and the safety distance requirements for basic insulation per IEC62368-1/IEC62477-1.

▍ Molex's four-row board-to-board connector is currently the world's smallest four-row board-to-board connector, and is very suitable for space-constrained smartphones, smart watches, wearable devices, and AR/VR devices.

TE Connectivity's SMC connectors (Small Form Factor Hybrid Connectors) have a 1.27mm grid and pin counts ranging from 12 to 80. They offer a variety of form factors, such as straight or angled male and female terminal blocks, to enable different mating configurations. Combining male and female terminal blocks of varying heights allows for different board-to-board spacing. SMC connectors also support wire-to-board solutions.

TE Connectivity 's Dynamic connector, with its compact and slim size, is ideal for tight spaces, while its robust design addresses wiring challenges and high-density wiring. Its smooth wiring provides a streamlined profile, while X-key and Y-key options make it easier to use and install. Its stable crimping position reduces the risk of wire spillage and damage, providing high reliability.