This week's new product recommendations: Infineon's new high-power density MOSFET package and Molex Mini-Fit Sigma connector.

For power semiconductor devices, in order to pursue higher power density, in addition to working hard on processes and materials, exploring new packaging with better thermal performance is also an important technical path.

Infineon has further expanded its OptiMOS power MOSFET product line with the introduction of the TO-Leaded Top-Cooled (TOLT) package. The TOLT package offers the same high-current, low-profile advantages of the TOLL package, but also features top-side cooling for optimal thermal performance. Specifically, top-side cooling exposes the drain electrode to the package surface, allowing 95% of the heat to be dissipated directly to the heat sink. Compared to the TOLL package, the TOLT package improves junction-to-case thermal resistance by 20% and junction-to-ambient thermal resistance by 50% .

The TOLT package, combined with the excellent features of the OptiMOS 5 Power Block MOSFET series, achieves benchmark efficiency and high current handling capability. These power MOSFETs include 80V and 100V models with high current ratings exceeding 300A, making them ideal for high power density designs.

To learn more about Infineon's TOLT-packaged OptiMOS™ power MOSFETs, please watch the following video.

Digi-Key Daily short video