• You can log in to your eeworld account to continue watching:
  • HDL models at different abstraction levels in FPGA design
  • Login
  • Duration:7 minutes and 38 seconds
  • Date:2015/04/13
  • Uploader:chenyy
Introduction
The composition of digital systems in FPGA and key points of combinatorial logic design
Key points of sequential logic design
Types and uses of modules
Why Verilog can support
Verilog modules for large-scale design of RAM and stimulus sources How to call RAM top-level test Verilog modules
in Quartus II Composition and combination of digital logic circuits Logic example (1):: 8-bit data path controller Combinational logic example (2): An 8-bit three-state data path controller Switch logic application examples and delay issues Why should static random access memory (SRAM) design a finite state machine (1 ) Finite state machine representation method Global clock king and balanced tree structure Avoid risky competition and pipeline Example 1: Use gate-level structure to describe D flip-flop; Example 2: Write test module to check whether the design is correct through simulation; Example 3: Designed by modules to form a higher-level module; Example 4: D flip-flop with asynchronous reset terminal. Example: Implementation and testing of T flip-flops and counters Example: Design of a 4-bit full adder and instruction decoding circuit using a one-bit full adder Example: Testing of the instruction decoding circuit HDL models at different abstraction levels in FPGA design: System Level, algorithm level, register transfer level, gate level, switch level Key points of sequential logic design Top-level testing Verilog module in FPGA design



















Unfold ↓

You Might Like

Recommended Posts

Sinlinx A64 Linux writes LED driver through device tree (with reference code, not tested)
Development platform Sinlinx A64 Memory: 1GB Storage: 4GB Detailed parameters [url=https://m.tb.cn/h.3wMaSKm]https://m.tb.cn/h.3wMaSKm[/url] Development board exchange group 641395230 [b][color=#5E738
babyking Embedded System
Are there any colleagues doing packaging and testing reporting here? ? ?
Please leave your contact information for friends who are engaged in packaging, manufacturing and technology so that we can communicate with each other. The format is as follows: Liu Zhi: Plastic pack
ufuture PCB Design
Does ADI have application solutions designed entirely in Chinese?
Does ADI have a fully Chinese design application solution? Is it better than EGC?
tziang ADI Reference Circuit
[N32L43x Review] 10. Serial port download chip type identification error, USB download DFU driver failed
[i=s]This post was last edited by freeelectron on 2022-8-2 21:18[/i]1. Introduction Usually we use the swd interface to burn the program. This method requires an additional burner. This article experi
freeelectron Domestic Chip Exchange
MSP430 5739 looking for USB download simulation tutorial.
As the title says, great gods please help
zdl133447567 Microcontroller MCU
Intelligent integration 3C enterprises rush to grab the 200 billion yuan security cake
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:56[/i]After installing cameras and video surveillance systems, does the next step in building a safe city require manpower to keep an e
探路者 Mobile and portable

Recommended Content

可能感兴趣器件

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号