• Duration:12 minutes and 56 seconds
  • Date:2020/05/24
  • Uploader:EE大学堂
Introduction
keywords: socket UDP TCP
After completing this tutorial, you can seamlessly transplant programs written using Socket on the PC to RT-Thread; you can master the use of commonly used network gadgets on RT-Thread; you can write some programs based on HTTP/MQTT Mini programs of the protocol, such as weather acquisition, etc.; you can use the Cloud SDK software package provided by RT-Thread to easily and quickly achieve cloud access to the device, and develop applications for smart homes, smart hardware, etc.
Unfold ↓

You Might Like

Recommended Posts

Question about input and output resistance
Input and output resistance are important parameters of various amplification circuits and integrated operational amplifiers. I would like to ask whether these two parameters are dynamic, that is, the
sabertan Analog electronics
After code relocation, there are two copies of code in memory, causing the sub-function program to run away
What I did was porting the new version of uboot to s3c2440. First, when powered on, the first 4K of code in nandflash was automatically moved to the memory, and then the complete copy of uboot was com
xulanll Linux and Android
The Spring Festival is coming soon, have a good holiday everyone
The Spring Festival is coming soon! I would like to wish you all a happy Spring Festival! Wish me a happy journey home. :)
ren364940161 Talking
Tell me what the classic model of a multimeter is in your mind or what a classic multimeter in your mind should look like
I just heard people discussing in the group, saying that Fluke 187/189 has many advantages such as stability and high precision, but this model has been discontinued. It is very popular in the second-
phantom7 Talking
Summary of SI4432 debugging issues
Working process: We use the si4432 chip for wireless transmission. The si4432 on the receiving end works in LDC mode, and the MCU works in sleep mode. Then the sending end sends multiple continuous wa
edwardpeng RF/Wirelessly
Heat dissipation calculation and heat sink selection for power devices
At present, electronic products mainly use SMD packaging devices, but many high-power devices and some power modules still use perforated packaging, which is mainly because they can be easily installe
lixiaohai8211 Analog electronics

Recommended Content

可能感兴趣器件

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews


Room 1530, 15th Floor, Building B, No.18 Zhongguancun Street, Haidian District, Beijing, Postal Code: 100190 China Telephone: 008610 8235 0740

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号