The enhanced embedded sensor topology of the STREF-MKI128V6 MEMS sensor module helps you save development time and effort for your applications. This compact board integrates the iNEMO inertial module (LSM6DSM) with 3D accelerometer and 3D gyroscope that is particularly suitable for smartphones with OIS/ EIS and AR/VR systems, a magnetometer (LIS2MDL), a dust-resistant full-mold absolute pressure sensor (LPS22HB), and a relative humidity and temperature sensor (HTS221).
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