The adapter component is designed based on the 0jcxg0 module, and a high-performance USB2.0 hub is integrated inside, eliminating the need to connect two wires and making the connection stable.
It is recommended to default to 1.6 for the upper board and 1.2~0.8 for the bottom board. Since the module adopts a back-soldering design, it is not recommended to choose 1.2 or above for the bottom board, and the minimum is 0.8. Otherwise, the finished product will not be strong enough.
It is recommended to use medium temperature solder paste with an air gun or constant temperature soldering station for the entire board, which can improve the yield rate.
All reference designs on this site are sourced from major semiconductor manufacturers or collected online for learning and research. The copyright belongs to the semiconductor manufacturer or the original author. If you believe that the reference design of this site infringes upon your relevant rights and interests, please send us a rights notice. As a neutral platform service provider, we will take measures to delete the relevant content in accordance with relevant laws after receiving the relevant notice from the rights holder. Please send relevant notifications to email: bbs_service@eeworld.com.cn.
It is your responsibility to test the circuit yourself and determine its suitability for you. EEWorld will not be liable for direct, indirect, special, incidental, consequential or punitive damages arising from any cause or anything connected to any reference design used.
Supported by EEWorld Datasheet
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
community
Robot
development
community
About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Room 1530, 15th Floor, Building B,
No.18 Zhongguancun Street,
Haidian District,
Beijing, Postal Code: 100190
China
Telephone: 008610 8235 0740
京公网安备 11010802033920号
MI-PC611-IX
