10Gbps ultra-high-speed NVMe/M.2 mobile hard disk enclosure-JMS583

1. Introduction
JMS583 is a bridge chip that can convert PCIe Gen3x2 devices to TYPE-C USB3.1 GEN2 (10Gbps).
It can be made into a solid-state hard disk box with a maximum speed of 10Gbps, that is, 1024MB/s, which
can be used for XBOX external hard disk storage
. 2. Notes and areas for improvement
There are many pitfalls in doing this, but I have stepped on them for you.
The copper pillars that fix the M.2, I use this
M.2 power supply part, you only need to solder the 0 ohm here, and no other soldering is required. I
have stepped on the pit. After soldering, the disk cannot be read because the power-on timing is incorrect, resulting in the M.2 device not being powered on when JMS583 sends the request signal, and the M.2 is waiting. It is a firmware problem.
It is recommended to replace it with a high-current magnetic bead of FB100/5A@100MHz or 0 ohm. The current here is relatively large.
DCDC uses the TD1583 that was used before. This DCDC has a maximum output current of 3A. The actual test using Zhitai TiPlus5000 (3.3V 2.5A) will have
improvements in howling:
1. Replace the inductor with a larger one. 2.2uH was used during the test. It is recommended to replace it with 10uH or more (the schematic diagram has been updated)
2. Replace high-current DCDC
3. Add large electrolytic capacitors to the front and back stages.
 
It is recommended to attach a heat dissipation aluminum sheet to the main control. It may not be able to withstand 10Gbps and slow down.
3. Impedance matching
board thickness 1.0mm
For M.2 NVME, 85 ohm impedance matching is required.
For USB-C, 90 ohm impedance matching is required.
4. Actual
test interface: PCIe 4.0 x4 | PCIe 4.0 x4
Chipset: B760 chipset
test motherboard: ASUS ROG STRIX B760-A GAMING WIFI D4
Processor: 13th Gen Intel Core i7-13700KF
On-board test source hard disk: ZHITAI TiPro7000 1TB theoretical transfer 7500MB/s, 6000MB/s
4.1 TiPlus5000 512G NVME solid state drive
interface: PCIe Gen 3.0*4
standard: NVM Express1.4
theoretical read: 3500MB/s
theoretical write: 3200MB/s
cache size: unknown
4.1.1 Motherboard speed:
interface: PCIe 4.0
motherboard DiskMark speed, reading can be faster than the theoretical speed.
The actual file write speed on the motherboard
can reach 3G/s in the front and stabilize at more than 2G/s in the back.
4.1.2 USB 3.0 5Gbps speed:
Cable: USB to TYPE-C 10Gbps cable
interface: USB3.0 5Gbps
DiskMark speed in the mobile hard disk box
Actual file write speed
4.1.3 USB 3.0 10Gbps speed:
Cable: TYPE-C to TYPE-C 20Gbps cable
interface: TYPE-C 20Gbps
DiskMark speed in the mobile hard disk box has reached the ceiling of 10Gbps rate
. The actual file write speed will be almost
4.2 Colorful CN600 256G NVME solid state drive
interface: PCIe Gen 3.0*4
standard: NVM Express1.3
theoretical read: 2000MB/s
theoretical write: 1500MB/s
cache size: unknown
4.2.1 Speed ​​on the motherboard:
Interface: PCIe on board 4.0
The DiskMark speed on the motherboard can basically run at the theoretical speed.
The actual file writing speed on the motherboard
should be cached in the front and stably write 1.27G in the back.
4.2.2 USB 3.0 5Gbps speed:
Cable: USB to TYPE-C 10Gbps Cable
interface: USB3.0 5Gbps
DiskMark speed in the mobile hard disk box
Actual file writing speed
 
4.2.3 USB 3.0 10Gbps speed:
Cable: TYPE-C to TYPE-C 20Gbps Cable
interface: TYPE-C DiskMark speed in 20Gbps
mobile hard disk box, writing is almost reaching the ceiling, compared with Zhitai,
the actual file writing speed is a little worse
5. Firmware burning
attachment JMS583.bin
Before, a classmate in SATA hard disk engineering asked me how to burn, I will put the burning process here
1. Buy FLASH burner
2. Download the burning software
3. Use the included burning board to solder FLASH to the burning board
4. Put FLASH into the burner and connect it to the computer
5. Open the burning software (some burners are not driver-free, you need to download the driver to identify the burner)
Select the FLASH chip, Smart detection identifies errors most of the time, so it is not recommended.
6. Click to load the bin file.
7. For blank chips, click Write and Burn.
For FLASH with content, select Read to see if there is any content, then click Erase, and then click Write after erasing.
For uncertain FLASH, or all FLASH, whether it is blank or not (because some sellers will buy your disassembled FLASH), I recommend erasing it first, then reading it out after erasing to see if it has been completely erased, and then writing it to the bin. After writing, you can read it out again to see if the content in the bin has been written. This is the safest approach.
8. Turn off the power of the burner, remove the FLASH, and solder it to the motherboard (this picture is not a picture of this project).
It is not recommended to use a burning clip to burn the FLASH that has been soldered to the motherboard. The main control connected to the FLASH will affect the burning. It is recommended to remove it and burn it!
6. In summary,
 
it can indeed run at 10Gbps and can be made into a mobile hard disk box
My PCB is so big because I can get the four-layer board process for free, and the size is limited to 99.5mm. If it is made into a strip, it will be longer and charged. In addition, the M.2 socket is not easy to solder, so the components are as much as possible on the front to facilitate people to use the heating table teppanyaki, so it is drawn into this special shape.
For reference of high-speed signal routing,
the RTL9210 solution has been done by a big guy here, so I won’t do it
https://oshwhub.com/kx111111/rtl9210_2230_typec
The ASM2362 solution is on my agenda, but I don’t have time to do it now. It is expected to be scheduled in the second half of this year
. The ASM2362 has been done by a big guy, so I won’t do it. Directions:
https://oshwhub.com/xyzdiy/nvme-type-c-ying-pan-he