MPSW05, MPSW06
One Watt Amplifier
Transistors
NPN Silicon
Features
http://onsemi.com
COLLECTOR
3
2
BASE
Symbol
MPSW05
MPSW06
MPSW05
MPSW06
V
CEO
V
CBO
V
EBO
I
C
P
D
P
D
T
J
, T
stg
Value
60
80
60
80
4.0
500
1.0
8.0
2.5
20
−55
to +150
Unit
Vdc
Vdc
Vdc
mAdc
W
mW/°C
W
mW/°C
°C
12
1
2
TO−92 1 WATT
(TO−226)
CASE 29−10
STYLE 1
1
EMITTER
•
Pb−Free Packages are Available*
MAXIMUM RATINGS
Rating
Collector
−Emitter
Voltage
Collector
−Base
Voltage
Emitter
−Base
Voltage
Collector Current
−
Continuous
Total Device Dissipation @ T
A
= 25°C
Derate above 25°C
Total Device Dissipation @ T
C
= 25°C
Derate above 25°C
Operating and Storage Junction
Temperature Range
3
STRAIGHT LEAD
BULK PACK
3
BENT LEAD
TAPE & REEL
AMMO PACK
MARKING DIAGRAM
MPS
W0x
AYWW
G
G
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Case
Symbol
R
qJA
R
qJC
Max
125
50
Unit
°C/W
°C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
x
= 5 or 6
A
= Assembly Location
Y
= Year
WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MPSW05G
MPSW06G
MPSW06RLRA
MPSW06RLRAG
Package
TO−92
(Pb−Free)
TO−92
(Pb−Free)
TO−92
TO−92
(Pb−Free)
Shipping
†
5000 Units/Bulk
5000 Units/Bulk
2000/Tape & Reel
2000/Tape & Reel
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2010
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
August, 2010
−
Rev. 4
1
Publication Order Number:
MPSW05/D
MPSW05, MPSW06
VCE , COLLECTOR-EMITTER VOLTAGE (VOLTS)
1.0
T
J
= 25°C
0.8
I
C
= 10 mA
50
mA
100 mA
250 mA
500 mA
V, VOLTAGE (VOLTS)
0.8
V
BE(sat)
@ I
C
/I
B
= 10
0.6
V
BE(on)
@ V
CE
= 1.0 V
1.0
T
J
= 25°C
0.6
0.4
0.4
0.2
0.2
V
CE(sat)
@ I
C
/I
B
= 10
0
0.05
0.1
0.2
0.5
2.0
5.0
1.0
I
B
, BASE CURRENT (mA)
10
20
50
0
0.5
1.0
2.0
5.0
10
50
100
20
I
C
, COLLECTOR CURRENT (mA)
200
500
Figure 2. Collector Saturation Region
Figure 3. “On” Voltages
θ
VB, TEMPERATURE COEFFICIENT (mV/
°
C)
-0.8
-1.2
C, CAPACITANCE (pF)
80
60
40
C
ibo
T
J
= 25°C
-1.6
θ
VB
for V
BE
20
-2.0
-2.4
10
8.0
6.0
C
obo
0.2
0.5 1.0 2.0
5.0 10
20
V
R
, REVERSE VOLTAGE (VOLTS)
50
100
-2.8
0.5
1.0
2.0
5.0
20
50
10
100
I
C
, COLLECTOR CURRENT (mA)
200
500
4.0
0.1
Figure 4. Base−Emitter Temperature Coefficient
f T, CURRENT-GAIN — BANDWIDTH PRODUCT (MHz)
Figure 5. Capacitance
300
IC, COLLECTOR CURRENT (mA)
200
V
CE
= 2.0 V
T
J
= 25°C
DUTY CYCLE
≤
10%
2k
1k
500
200
100
50
20
30
2.0
3.0
5.0 7.0 10
20 30
50 70 100
I
C
, COLLECTOR CURRENT (mA)
200
10
1.0
T
A
= 25°C
T
C
= 25°C
1.0 s
1.0 ms
100
ms
100
70
50
dc
dc
CURRENT LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
MPSW05
MPSW06
2.0
5.0
10
20
60 80 100
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
Figure 6. Current−Gain
−
Bandwidth Product
Figure 7. Active Region
−
Safe Operating Area
http://onsemi.com
3
MPSW05, MPSW06
PACKAGE DIMENSIONS
TO−92 (TO−226) 1 WATT
CASE 29−10
ISSUE O
A
B
P
F
L
K
STRAIGHT LEAD
BULK PACK
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS
UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN DIMENSIONS P
AND L. DIMENSIONS D AND J APPLY BETWEEN DI
MENSIONS L AND K MINIMUM. THE LEAD
DIMENSIONS ARE UNCONTROLLED IN DIMENSION
P AND BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
F
G
H
J
K
L
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.290
0.310
0.125
0.165
0.018
0.021
0.016
0.019
0.045
0.055
0.095
0.105
0.018
0.024
0.500
---
0.250
---
0.080
0.105
---
0.100
0.135
---
0.135
---
MILLIMETERS
MIN
MAX
4.44
5.21
7.37
7.87
3.18
4.19
0.46
0.53
0.41
0.48
1.15
1.39
2.42
2.66
0.46
0.61
12.70
---
6.35
---
2.04
2.66
---
2.54
3.43
---
3.43
---
R
X X
H
V
1
D
G
J
C
N
N
SECTION X−X
STYLE 1:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
A
R
B
P
T
SEATING
PLANE
BENT LEAD
TAPE & REEL
AMMO PACK
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS
UNCONTROLLED.
4. DIMENSION F APPLIES BETWEEN DIMENSIONS P
AND L. DIMENSIONS D AND J APPLY BETWEEN
DIMENSIONS L AND K MINIMUM. THE LEAD
DIMENSIONS ARE UNCONTROLLED IN DIMENSION
P AND BEYOND DIMENSION K MINIMUM.
DIM
A
B
C
D
G
J
K
N
P
R
V
INCHES
MIN
MAX
0.175
0.205
0.290
0.310
0.125
0.165
0.018
0.021
0.094
0.102
0.018
0.024
0.500
---
0.080
0.105
---
0.100
0.135
---
0.135
---
MILLIMETERS
MIN
MAX
4.44
5.21
7.37
7.87
3.18
4.19
0.46
0.53
2.40
2.80
0.46
0.61
12.70
---
2.04
2.66
---
2.54
3.43
---
3.43
---
G
X X
V
1
D
J
C
N
SECTION X−X
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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MPSW05/D
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